An electronic device can include a housing defining an aperture, and an electromagnetic radiation emitter and an electromagnetic radiation detector disposed in the housing. An optical component can be disposed in the aperture and can include a first region of a first material having a first index of refraction, the first region aligned with the electromagnetic radiation emitter, a second region of the first material, the second region aligned with the electromagnetic radiation detector, and a bulk region surrounding a periphery of the first region and a periphery of the second region, the bulk region including a second material having a second index of refraction that is lower than the first index of refraction.

A photonic coupler includes an input coupling section, an output coupling section, and a multimode interference (MMI) waveguide section. The input coupling section is adapted to receive an input optical signal along an input waveguide channel. The output coupling section is adapted to output a pair of output optical signals along output waveguide channels. The output optical signals having output optical powers split from the input optical signal. The MMI waveguide section is optically coupled between the input and output coupling sections. Notched waveguide sections may each be disposed between the MMI waveguide section and a corresponding one of the input or output coupling sections and/or the MMI waveguide section may include curvilinear sidewalls.

Waveguides, such as light guides, made entirely of elastomeric material or with indents on an outer surface are disclosed. These improved waveguides can be used in sensors, soft robotics, or displays. For example, the waveguides can be used in a strain sensor, a curvature sensor, or a force sensor. In an instance, the waveguide can be used in a hand prosthetic. Sensors that use the disclosed waveguides and methods of manufacturing waveguides also are disclosed.

Configurations are disclosed for multi-wavelength optical devices and systems. In particular, multi-wavelength optical devices that include separate chips optically connected via phonic wire bonds. The disclosed configurations can utilize photonic wire bond interconnects and photonic wire bond interconnection techniques, which may facilitate low-cost implementation of wavelength division multiplexed optical systems.

The various embodiments described herein include methods, devices, and systems for fabricating and operating superconducting photon detectors. In one aspect, a photon detector includes: (1) a first waveguide configured to guide photons from a photon source; (2) a second waveguide that is distinct and separate from the first waveguide and optically-coupled to the first waveguide; and (3) a superconducting component positioned adjacent to the second waveguide and configured to detect photons within the second waveguide.

Optical connection systems including electrical-and-optical connection systems and methods thereof are disclosed. An electrical-and-optical connection system can include an extension tube having a plug and a relay module having a receptacle. The plug can be formed of a metal piece around electrical wires, which, in turn, are around optical-fiber cores that extend along a length of the extension tube. The plug can be configured to pierce through at least a sterile barrier. The relay module can include electrical wires and optical-fiber cores within a housing of the relay module, as well as a receptacle disposed in the housing. The receptacle can be configured to simultaneously accept insertion of the plug therein and establish both electrical and optical connections between the plug and the receptacle from a sterile field to a non-sterile field set up by the sterile barrier. Shape-sensing systems including the optical connection systems are also disclosed.

A connector for a circuit board includes a connector housing having a mounting arm. The mounting arm has a first fastening element that is releasably connectable to a first connecting element on the circuit board. The connection between the first fastening element and the first connecting element can be established and/or released by deflecting the mounting arm. A securing unit is disposed on the connector housing in such a way that the securing unit is movable between a releasing position and a locking position. In the locking position, the securing unit blocks deflection of the mounting arm. In the releasing position, the securing unit enables deflection of the mounting arm.

Embodiments herein describe an optical system that includes a photonic integrated circuit (PIC) bonded to a package containing an electrical integrated circuit (EIC). However, this bond can prevent an edge coupler from optically aligning an optical fiber to an edge of the PIC in order to transfer optical signals. To provide room for the edge coupler, the PIC is arranged to overhang the package containing the EIC so that the package does not interfere with the ability of the edge coupler to align with the side or edge of the PIC. In this manner, an optical fiber can be optically aligned (e.g., butt coupled) to the edge of the PIC rather than having to use a grating coupler or some other less efficient optical coupling in order to transfer optical signals between the PIC and the optical fiber.

An optical device cut from a wafer into a chip by dicing, on the wafer, the optical device includes a plurality of optical waveguides; an optical circuit connected to the optical waveguide; and of the plurality of optical waveguides, a testing optical waveguide that guides test light to the optical circuit to be tested, by bypassing a non-connected optical waveguide portion at a terrace for mounting an optical chip component.

A light source comprising: —at least one semiconductor chip capable of emitting incident radiation: —an output stage comprising at least one fiber or free space for propagating a plurality of predefined modes; —at least one optical part having a microstructured main surface arranged opposite the semiconductor chip for intercepting the incident radiation, spatially modifying the phase of the incident radiation and forming, by a plurality of reflections and/or transmissions on the optical component, transformed light radiation comprising at least the predefined modes.