The present disclosure discloses an optical module including a circuit board and a light-emitting assembly. In the light-emitting assembly, a wavelength tuning mechanism is formed of a semiconductor optical amplification chip, a silicon optical chip and a semiconductor refrigerator. The semiconductor optical amplification chip may provide a plurality of wavelengths, and a wavelength selection is carried out by an optical filter in the silicon optical chip; a temperature adjustment for the optical filter is achieved by the semiconductor refrigerator, so as to further adjust a performance of the filter for wavelength selection. The above device is provided in a housing to facilitate packaging of the devices.

A waveguide coupler includes a coupling section which evanescently couples an optical signal, received from an input waveguide, with an absorbing waveguide. Structurally, the coupling section is an elongated waveguide with one end butt-coupled to the input waveguide. Further, the coupling section defines an engagement side edge which is positioned at a predetermined distance from a dimensionally compatible side surface area of the absorbing waveguide. In this combination, evanescence from the optical signal is directed laterally from the coupling section, through the engagement side edge of the coupling section, and through an assisting component, to the absorbing waveguide for use with a photodetector.

Integrated circuit packages may be formed having at least one optical via extending from a first surface of a package substrate to an opposing second surface of the package substrate. The at least one optical via creates an optical link between the opposing surfaces of the package substrate that enables the fabrication of a dual-sided optical multiple chip package, wherein integrated circuit devices can be attached to both surfaces of the package substrate for increased package density.

An optical connection identification assembly includes first and second connectors for conveying optical signals within and away from the optical connection identification assembly, first and second optical filters configured for conveying optical signals to and from the respective first and second connectors and between each other, and first and second photodiodes. The first photodiode is configured for receiving optical signals from the first optical filter to confirm the optical connection identification assembly is receiving optical signals. The second photodiode is configured for receiving optical signals from the second optical filter to confirm the optical connection identification assembly is receiving optical signals. The first and the second connectors are on opposite sides of each of the first and the second optical filters and each of the first and the second photodiodes. Multiple optical connection identification assemblies are used in a system to prepare a connectivity map of a fiber optic system.

An endpoint detection system for enhanced spectral data collection is provided. An optical bundle is coupled to a light source configured to generate incident light. The optical bundle includes two or more sets of optical fibers that each include an emitting optical fiber and a receiving optical fiber. The receiving optical fibers are disposed within the optical bundle at a pairing angle relative to a respective emitting optical fiber. The optical bundle is also coupled to a collimator assembly that includes an achromatic lens. The achromatic lens receives a first light beam of incident light from a first emitting optical fiber and directs spectral components of the first light beam to a first and second portion of a surface of a substrate. The first portion of the substrate surface is substantially the same as the second portion. The achromatic lens collects reflected spectral components that are produced by the spectral components directed to the first and second portions of the substrate surface. The achromatic lens transmits the reflected spectral components to a first receiving fiber of the optical fiber bundle, which transmits the reflected spectral components to a light detection component. A processing device coupled to the light detection component determines a reflectance of the substrate surface based on the reflected spectral components.

An optical waveguide package includes a substrate, a cladding on a first surface of the substrate, and a core in the cladding. The cladding has a recess surrounding an element mount. The recess has an inner wall surface including a plurality of wall surfaces and a corner support surface between adjacent wall surfaces of the plurality of wall surfaces.

An optical device includes a fiber array that has input optical fibers, a lens array that has lenses, a photodiode array that photodiodes, a first spacer disposed between the fiber array and the lens array, and a second spacer disposed between the lens array and the photodiode array. Each of the lenses collimates input light from a corresponding input optical fiber, from among the input optical fibers. Each of the photodiodes receives the input light collimated by a corresponding lens, from among the lenses, and outputs an electrical signal according to a power of the received input light. The first spacer transmits the input light from each of the input optical fibers to a corresponding lens from among the lenses. The fiber array, the first spacer, the lens array, the second spacer, and the photodiode array are laminated.

Structures for a photodetector or terminator and methods of fabricating a structure for a photodetector or terminator. The structure includes a waveguide core, a light-absorbing layer having a sidewall, and a taper positioned adjacent to the sidewall of the light-absorbing layer. The taper extends laterally from the sidewall of the light-absorbing layer to overlap with the waveguide core, and the taper has a thickness that varies with position relative to the sidewall of the light-absorbing layer. For example, the thickness of the taper may decrease with increasing distance from the sidewall of the light-absorbing layer.

A method of forming an optical bridge waveguide between an optical element and an optical waveguide layer fabricated on a substrate such as a PIC platform. An optical element is heterogeneously integrated on the substrate. A first dielectric layer is deposited on the substrate and etched to a predetermined height. A second dielectric layer having a higher k than the first dielectric layer is deposited on the first dielectric layer, and a third dielectric layer having a lower k than the second dielectric layer is deposited on the second dielectric layer. The dielectric layers are formed such that the second dielectric layer provides an optical bridge waveguide between the optical element and optical waveguide layer, with the first and third dielectric layers providing a lower and upper cladding, respectively, for the optical bridge waveguide.

An optical interconnect structure including a base substrate, an optical waveguide, a first reflector, a second reflector, a dielectric layer, a first lens, and a second lens is provided. The optical waveguide is embedded in the base substrate. The optical waveguide includes a first end portion and a second end portion opposite to the first end portion. The first reflector is disposed between the base substrate and the first end portion of the optical waveguide. The second reflector is disposed between the base substrate and the second end portion of the optical waveguide. The dielectric layer covers the base substrate and the optical waveguide. The first lens is disposed on the dielectric layer and located above the first end portion of the optical waveguide. The second lens is disposed on the dielectric layer and located above the second end portion of the optical waveguide.