The present disclosure describes active optical cable assemblies. A cable assembly includes a fixed active optical connector having a transceiver, a ruggedized optical fiber cable integrated with the fixed active optical connector, a main cable assembly comprising one or more optical fiber cables, wherein the ruggedized cable is spliced to the main cable assembly; and a removable shroud configured to surround at least a portion of the fixed active optical connector plugged into a remote radio unit and to be secured to a remote radio unit. Active optical cable and remote radio unit systems are also described.

Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC.

A laser optical device includes: an optical fiber unit for transmitting a laser beam; a connector for connecting the optical fiber unit; a collimator for transforming the laser beam into a parallel beam; and a condenser lens unit for condensing the parallel beam. The parallel beam emitted from the condenser lens unit is a flat-top beam. A laser optical head includes: a housing; a connector located in the housing and for connecting an optical fiber unit; a collimator formed at one side of the connector located in the housing and for transforming a laser beam transmitted from the optical fiber unit into a parallel beam; and a condenser lens unit located in the housing and for condensing the parallel beam. The parallel beam emitted from the condenser lens unit is a flat-top beam.

Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC.

A waveguide connection structure consists of a waveguide chip having a waveguide, and a connector having a groove dug in a thickness direction, the waveguide chip and the connector each having a concave-convex portion that fit into each other in a state of being adjacent to each other on the same plane.

An optical waveguide device including an optical waveguide substrate that has an electro-optic effect, is a crystal having anisotropy in thermal expansion rate, has a thickness set to 10 μm or lower, and includes an optical waveguide and a holding substrate that holds the optical waveguide substrate, the optical waveguide substrate and the holding substrate being joined to each other, in which the holding substrate is formed of a crystal having a lower dielectric constant than the optical waveguide substrate and having anisotropy in thermal expansion rate, and the optical waveguide substrate and the holding substrate are joined to each other such that differences in thermal expansion rate between the optical waveguide substrate and the holding substrate become small in different axial directions on a joint surface.

Lens-based optical connector assemblies and methods of fabricating the same are disclosed. In one embodiment, a lens-based connector assembly includes a glass-based optical substrate includes at least one optical element within the optical substrate, and at least one alignment feature positioned at an edge of the glass-based optical substrate, wherein the at least one alignment feature is located within 0.4 μm of a predetermined position with respect to the at least one optical element along an x-direction and a y-direction. The lens-based connector assembly further includes a connector element including a recess having an interior surface, The interior surface has at least one connector alignment feature. The glass-based optical substrate is disposed within the recess such that the at least one alignment feature of the glass-based optical substrate engages the at least one connector alignment feature.

A chip packaging structure that includes an optoelectronic (OE) chip mounted on a first surface of a substrate and whose optically active area is directed laterally; and a lens array for the optoelectronic (OE) chip that is mounted on the first surface of the substrate and faces to the optoelectronic (OE) chip, wherein the lens array has inside a reflector reflecting light from a first direction to a second direction, in which the first direction is substantially perpendicular to the second direction.

A sensor probe has a connector and the connector's corresponding receptacle on a console have security mechanisms that ensure that the connector and the receptacle are properly connected and mated. The connector and receptacle can have physical security features that block insertion of the connector into the receptacle if they are not aligned in a proper orientation. The console can also include a software security feature that allows optical measurements from the sensor probe only if the connector of the sensor probe and receptacle on the console are connected properly. An adapter can also be used to convert a conventional receptacle mounted on a console into a receptacle with security features.

Pluggable optical transceiver modules are described herein that are specifically configured to preclude use of fiber jumpers inside of the module. Pluggable optical transceiver modules implement a rigid-plane jumper that provides an opto-mechanical interface between an external fiber cable (attached to the pluggable optical transceiver module) and the optical transceiver in a manner that does not require the fiber jumper, while ensuring reduced optical loss. In some embodiments one or more rigid waveguide plates act as an opto-mechanical coupling between the external fiber cable and on-board opto-electrical components (e.g., optical transceiver). For example, the rigid waveguide plates are coupled to a faceplate connector, and a CWDM block that is in turn optically coupled to the optical socket. In some embodiments, the CWDM block is directly attached to the rigid waveguide plates. In some embodiments, the CWDM block is indirectly attached to the rigid waveguide plates using a half periscope.