Aspects described herein include an apparatus supporting optical alignment with one or more optical waveguides optically exposed along an edge of a photonic integrated circuit (IC). The apparatus comprises a frame body comprising an upper portion defining a reference surface, and a lateral portion defining an interface for an optical connector connected with one or more optical fibers. The lateral portion comprises one or more optical components defining an optical path through the lateral portion. The one or more optical components are arranged relative to the reference surface such that the one or more optical components align with (i) the one or more optical waveguides along at least one dimension when the reference surface contacts a top surface of an anchor IC, and with (ii) the one or more optical fibers when the optical connector is connected at the interface.

Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

An optical device includes a fiber array that has input optical fibers, a lens array that has lenses, a photodiode array that photodiodes, a first spacer disposed between the fiber array and the lens array, and a second spacer disposed between the lens array and the photodiode array. Each of the lenses collimates input light from a corresponding input optical fiber, from among the input optical fibers. Each of the photodiodes receives the input light collimated by a corresponding lens, from among the lenses, and outputs an electrical signal according to a power of the received input light. The first spacer transmits the input light from each of the input optical fibers to a corresponding lens from among the lenses. The fiber array, the first spacer, the lens array, the second spacer, and the photodiode array are laminated.

An optoelectronic device. The device comprising: a silicon-on-insulator, SOI, wafer, the SOI wafer including a cavity and an input waveguide, the input waveguide being optically coupled into the cavity; and a mirror, located within the cavity and bonded to a bed thereof, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer.

An apparatus arranged for deflecting an optical component for alignment purposes of the optical component with a further optical component, wherein the apparatus comprises a plurality of adjacently placed elongate carriers, extending mutually parallel to each other in a longitudinal direction, wherein two adjacently placed elongate carriers have a spacing between them for receiving a first optical component such that the received optical component rests against two adjacently placed elongate carriers, wherein the two elongate carriers have slopes such that the spacing between the two adjacently placed elongate carriers is smaller at a bottom side compared to the spacing at a top side of the carriers, wherein the carriers comprise piezoelectric material configured to deflect the carriers in a direction perpendicular to the longitudinal direction by actuating the piezoelectric material.

A connector may include: a first substrate having a top surface, a bottom surface opposite to the top surface of the top substrate and a side surface joining an edge of the top surface of the first substrate and joining an edge of the bottom surface of the first substrate; a second substrate having a top surface, a bottom surface opposite to the top surface of the second substrate and a side surface joining an edge of the top surface of the second substrate and joining an edge of the bottom surface of the second substrate, wherein the side surface of the second substrate faces the side surface of the first substrate, wherein the top surfaces of the first and second substrates are coplanar with each other at a top of the connector and the bottom surfaces of the first and second substrates are coplanar with each other at a bottom of the connector; and a plurality of metal traces between, in a first horizontal direction, the side surfaces of the first and second substrates, wherein each of the plurality of metal traces has a top end at the top of the connector and a bottom end at the bottom of the connector.

Monolithic optical interconnect component components for surface mounting to photonic IC (PIC) chip assemblies. A protrusion or detent in solid body of the component comprises a contact alignment surface that stands off from a remainder of the solid body and is sloped to facilitate passive alignment of the component to a surface feature of the PIC chip. A face of the solid body may include an interference fitting to receive an MT ferrule connector. An optical interconnect component may include an array of optical elements and/or optical waveguides embedded within a solid body and extending between faces of the solid body. Once assembled, a multi-fiber push-on (MPO) connector may be inserted into the surface mounted interconnect component to optically couple a fiber cable to the PIC chip.

An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer/deserializer circuits, transceivers, clocking circuitry, and/or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electrically connected to the integrated switch ASIC.

Parallel optical interconnects may be used to transmit signals produced by integrated circuits. A parallel optical interconnect may be in the form of a multicore optical fiber and one or more optical coupling assemblies optically connecting a first optical transceiver array and a second optical transceiver array. The multicore optical fiber may have multiple fiber elements with each having a core surrounded by cladding, and the one or more optical coupling assemblies may have refractive and/or reflective elements. In this way, light produced by one transceiver array may be transmitted through the multicore optical fiber and be received by the other transceiver array.

An electro-optical system, and method for making the electro-optical system. The electro-optical system includes a Photonic Integrated Circuit (PIC) having a laser source located on the PIC, a fiberless optical coupler located on the PIC. The fiberless optical coupler is configured to be coupled to a fiber array. The electro-optical system also includes an optical element, and a mechanical aligner. The optical element is aligned with the fiber array, via the mechanical aligner, for a light from the laser source to transmit in between the fiber array and the PIC through the optical element, when the fiberless optical coupler is coupled to the fiber array.