An optical module includes a substrate with a through-hole formed therein, an optical element member that includes a light receiving or emitting part that receives light or emits light at a position on a surface that is opposite to the substrate, the position corresponding to the through-hole, and a post that is formed of a transparent material, covers the light receiving or emitting part and is inserted into the through-hole.

Systems, methods, and apparatus for a data bus-in-a-box (BiB) are disclosed. The system involves an electrical box, and at least one optical connector located on the box. The system further involves at least one mother board housed inside of the box, and comprising a transmit side comprising at least one transmit optical media converter (OMC) tile, and a receive side comprising at least one receive OMC tile. Also, the system involves first receive optical fibers that are each connected from at least one receive OMC tile to a receive coupler; and a second receive optical fiber connected from the receive coupler to one of the optical connectors. Further, the system involves first transmit optical fibers that are each connected from at least one transmit OMC tile to a transmit coupler; and a second transmit optical fiber connected from the transmit coupler to at least one of the optical connectors.

A photoelectric conversion connector comprising a support, a photoelectric conversion element that is provided on said support and that can be connected to an optical fiber through an optical signal, a first resin member that is formed at the upper part of the photoelectric conversion element, and a second resin member that is formed at the upper part of the first resin member. An optical signal transmitted between the photoelectric conversion element and the optical fiber goes through both the first resin member and the second resin member.

Optical connectors for connecting optical fiber to a light source are disclosed. In one embodiment, an optical connector includes a housing with a first end having an open aperture and a second end having a blind aperture. A chamber is disposed in the housing such that the optical axis of the housing passes through the chamber. The chamber includes a first material. A light collecting region formed from a second material is disposed in the housing between the second end of the housing and the chamber. A blind aperture is positioned in the light collecting region such that a termination of the blind aperture is spaced apart from the chamber by at least a portion of the second material. A refracting surface is disposed in the housing between the open aperture and the light collecting region such that the optical axis of the housing passes through the refracting surface.

An optical device includes one or more optical fibers and a holder having a supporting block, a reflecting plate, and an intermediate layer. The supporting block has a first to a third end surfaces at one end. The first end surface extends from a bottom surface of the holder to claddings of the optical fibers. The second end surface extends along a first axis intersecting the first end surface. The third end surface is oblique with respect to the first axis at an angle greater than zero degrees and less than 90 degrees. The optical fibers extend in the supporting block and is exposed to the third end surface. The reflecting plate is provided on the third end surface via the intermediate layer. Light from the optical fiber passes through the third end surface which has some roughness, and is reflected by a surface of the reflecting plate.

A structure including a photonic integrated circuit die, an electric integrated circuit die, a semiconductor dam, and an insulating encapsulant is provided. The photonic integrated circuit die includes an optical input/output portion and a groove located in proximity of the optical input/output portion, wherein the groove is adapted for lateral insertion of at least one optical fiber. The electric integrated circuit die is disposed over and electrically connected to the photonic integrated circuit die. The semiconductor dam is disposed over the photonic integrated circuit die. The insulating encapsulant is disposed over the photonic integrated circuit die and laterally encapsulates the electric integrated circuit die and the semiconductor dam.

Provided is a connector plug includes: an optical device module having an optical engine that generates an optical signal or receives an optical signal; an optical fiber alignment guide member having an optical fiber insertion channel formed on one surface of the optical device module so that optical fibers are seated; and an optical component that is seated in an optical component alignment guide groove formed adjacent to the optical fiber alignment guide member on one surface of the optical device module, wherein the optical engine includes an optical device which is formed adjacent to the optical component on one surface of the optical device module, and which radiates an optical signal or receives an optical signal in the horizontal direction, and an optical integrated circuit (IC) installed in the optical device module and controlling the optical device.

Provided is an optical element module comprising: a mold body having a first surface formed on an upper portion thereof and a second surface formed on a lower portion thereof; an external connection terminal formed on the first surface and electrically connected to the outside; an optical engine embedded and sealed between the first surface and the second surface and having a connection pad exposed to the second surface; a conductive vertical via formed to penetrate the first surface and the second surface and having one end portion electrically connected to the external connection terminal; a wiring layer formed on the second surface to interconnect the other end of the conductive vertical via and the connection pad of the optical engine; and a reflective surface integrally formed on the wiring layer and transmits an optical signal generated by the optical engine or received by the optical engine.

Embodiments disclosed herein include electronic packages with photonics modules. In an embodiment, a photonics module comprises a carrier substrate and a photonics die over the carrier substrate. In an embodiment, the photonics die has a first surface facing away from the carrier substrate and a second surface facing the carrier substrate, and a plurality of V-grooves are disposed on the first surface proximate to an edge of the photonics die. In an embodiment, the photonics module further comprises a fiber connector attached to the photonics die, where the fiber connector couples a plurality of optical fibers to the photonics die. In an embodiment, individual ones of the plurality of optical fibers are positioned in the V-grooves.

In the plug connector, the front end side of a fiber optic cable used for optical signal transmission is connected to, and rearwardly extends from, the rear end side of said plug connector and lateral terminals are arranged in each of a pair of lateral edge portions that extend in the forward-backward direction; at least one of the plug connector and receptacle connector has provided therein resilient members that generate a biasing force between the plug connector and receptacle connector in the forward-backward direction; and, a restricting portion, which provides a limiting value for the distance of relative displacement of the plug connector with respect to the receptacle connector in the direction of the biasing force under the action of the above-mentioned biasing force, is formed in the receptacle connector, and a restricted portion is formed in the plug connector.