An optical assembly includes an optical ferrule including a light redirecting member configured to receive light from an optical waveguide along a first direction and redirect the light along a different second direction, the redirected light exiting the optical ferrule at an exit location on a mating surface of the optical ferrule, and a cradle with a mating surface and configured to hold and align the optical ferrule to an optical component, wherein the mating surface of the optical ferrule and the mating surface of the cradle are held together by a magnetic attraction between opposing magnetic elements, wherein the optical ferrule and the cradle, but not the opposing elements, physically contact each other.

Embodiments of the present disclosure are directed to an optical assembly for optical transceiver which is composed of two separate sub-assemblies including an assembly that is coupled with a substrate and has a post formed to have a central hollow into a multi-branched shape, for increasing the optical alignment efficiency between the optical elements included in the optical assembly for optical transceiver which involves multiple complicated and sophisticated processes, the optical assembly for optical transceiver being structured to drain out the epoxy resin or the refractive index matching material used when coupling the optical fiber inserted from the outside with the optical elements, whereby greatly reducing optical alignment errors caused by the epoxy resin or refractive index matching material, as well as directed to an optical transceiver using the optical assembly for optical transceiver.

A package includes a first die, a second die, a semiconductor frame, and a reinforcement structure. The first di has a first surface and a second surface opposite to the first surface. The first die includes grooves on the first surface. The second die and the semiconductor frame are disposed side by side over the first surface of the first die. The semiconductor frame has at least one notch exposing the grooves of the first die. The reinforcement structure is disposed on the second surface of the first die. The reinforcement structure includes a first portion aligned with the grooves.

Provided are a slim connector plug capable of transmitting and receiving a large amount of data at an ultra-high speed and implementing a miniaturized and slimmed structure with a thickness of 1 mm while being manufactured at low cost, and an active optical cable (AOC) assembly using the same. The connector plug includes: an optical sub-assembly in which an optical fiber seating groove on which an optical fiber is mounted is formed on one side of the optical sub-assembly and a reflective surface is formed on an inner end of the optical fiber seating groove; an optical element module having an optical engine stacked on the optical sub-assembly and generating an optical signal or receiving an optical signal; and an optical component installed on the reflective surface of the OSA and transmitting the optical signal between the optical fiber and the optical engine.

A structure including a photonic integrated circuit die, an electric integrated circuit die, a semiconductor dam, and an insulating encapsulant is provided. The photonic integrated circuit die includes an optical input/output portion and a groove located in proximity of the optical input/output portion, wherein the groove is adapted for lateral insertion of at least one optical fiber. The electric integrated circuit die is disposed over and electrically connected to the photonic integrated circuit die. The semiconductor dam is disposed over the photonic integrated circuit die. The insulating encapsulant is disposed over the photonic integrated circuit die and laterally encapsulates the electric integrated circuit die and the semiconductor dam.

A structure including a photonic integrated circuit die, an electric integrated circuit die, a semiconductor dam, and an insulating encapsulant is provided. The photonic integrated circuit die includes an optical input/output portion and a groove located in proximity of the optical input/output portion, wherein the groove is adapted for lateral insertion of at least one optical fiber. The electric integrated circuit die is disposed over and electrically connected to the photonic integrated circuit die. The semiconductor dam is disposed over the photonic integrated circuit die. The insulating encapsulant is disposed over the photonic integrated circuit die and laterally encapsulates the electric integrated circuit die and the semiconductor dam.

An optical sensing apparatus includes a base, and an emitter and a detector that are respectively disposed on the base. A package structure covers the emitter and the detector, a first recess portion divides the emitter and the detector, and a second recess portion is located on the detector. A scattering path of light generated by the emitter is altered by the first recess portion and the second recess portion.

There is provided an optical element mounted on a substrate and an optical coupling element mounted on the substrate. The optical coupling element includes a guide unit extending in a direction parallel to a plane of the substrate so as to fix an optical fiber. There is provided a mold resin layer formed on the substrate so as to cover the optical element and expose a side surface of the optical coupling element at one end of the guide unit. The optical element includes a light incidence/emission unit on a side surface perpendicular to the plane of the substrate, and the other end of the guide unit and the light incidence/emission unit are disposed to face each other.

An optical sensing apparatus includes a base, and an emitter and a detector that are respectively disposed on the base. A package structure covers the emitter and the detector, a first recess portion divides the emitter and the detector, and a second recess portion is located on the detector. A scattering path of light generated by the emitter is altered by the first recess portion and the second recess portion.

A package includes a first die, a second die, a semiconductor frame, and a reinforcement structure. The first die has a first surface and a second surface opposite to the first surface. The first die includes grooves on the first surface. The second die and the semiconductor frame are disposed side by side over the first surface of the first die. The semiconductor frame has at least one notch exposing the grooves of the first die. The reinforcement structure is disposed on the second surface of the first die. The reinforcement structure includes a first portion aligned with the grooves.