An optical connection component includes: a glass plate formed of a glass material capable of transmitting ultraviolet rays, the glass plate having a first surface, a second surface opposite to the first surface, and one or a plurality of first through holes penetrating from the first surface to the second surface; a resin ferrule fixed to the first surface of the glass plate and having one or a plurality of second through holes each having a central axis coaxial with the central axis of the one or a plurality of first through holes; and one or a plurality of optical fibers including a glass fiber and a resin coating covering the outer periphery of the glass fiber, wherein the glass fiber exposed from the resin coating at the tip end of each of the one or a plurality of optical fibers is received in the one or a plurality of first through holes and the one or a plurality of second through holes.

The present invention provides an optical transceiver including a first housing, a second housing, a printed circuit board, a handle member and an elastic body. The first housing and the second housing are assembled with each other as a main body, and form an accommodation space, a first handle-guiding groove and a second handle-guiding groove. The first handle-guiding groove and the second handle-guiding groove are respectively located on two opposite sides of the main body. The printed circuit board is accommodated within the accommodation space. The handle member has a first arm and a second arm respectively received in the first handle-guiding groove and the second handle-guiding groove. The elastic body is received in an elastic-body-receiving slot of the first housing. None side of the elastic-body-receiving slot is formed by the second housing, or the elastic-body-receiving slot is a non-linear slot.

An optical module includes: a substrate; one or more light sources that produce light that is an optical signal; one or more light reflection units that change the direction of travel of the light to a direction substantially perpendicular to the substrate; one or more optical waveguides that optically connect the one or more light sources and the one or more light reflection units to each other; and a lid that is attached to the substrate to cover the one or more light sources, the one or more light reflection units and the one or more optical waveguides. The lid has one or more lenses that collimate light directed by the one or more light reflection units and transmit the light to the outside of the lid.

The present disclosure relates to systems and method for deploying a fiber optic network. Distribution devices are used to index fibers within the system to ensure that live fibers are provided at output locations throughout the system. In an example, fibers can be indexed in multiple directions within the system. In an example, fibers can be stored and deployed form storage spools.

A pigtail-type optical receptacle includes a tubular ferrule having a through-hole extending in an axial direction, an optical fiber inserted into the through-hole such that part of the optical fiber extends outside the ferrule, a protective member covering the part of the optical fiber extending outside the ferrule, a tubular sleeve mounted on a front end side, outer surface of the ferrule, a holder tubular having holding the rear end side of the ferrule, and a tubular housing covering the ferrule and at least a portion of the sleeve. The ferrule through-hole includes first and second regions, the second region being disposed rearward of the first region, and the housing engaging the outer surface of the holder rearward of the first region.

A HFC network includes an optical node, a first fiber optic cable, and a second fiber optic cable. The first fiber optic cable has a first end that is connected to the optical node for delivering signals to the optical node. The second fiber optic cable has a first end that is positioned within the optical node. Optical fibers of the first optic cable are ribbonized and spliced to ribbonized optical fibers of the second fiber optic cable at a spliced connection such that signals can be transmitted between the fiber optic cables. An optical fiber of the first fiber optic cable is spliced to a connectorized fiber pigtail at a spliced connection, and the connectorized fiber pigtail is optically connected to a broadband optical transceiver in the optical node. The spliced connections are stored in a fiber splice tray within the optical node.

An adiabatic optical coupler can include: a top tapered region that includes a top taper having two top tapered sides that taper from a first end region to a top tip region, the top taper having a first length; and a bottom tapered region under the top tapered region, wherein the bottom tapered region includes a bottom taper having two bottom tapered sides that taper from the first end region to a bottom tip region, the bottom taper having a second length that is longer than the first length. Another adiabatic optical coupler can include: a tapered region that includes a taper having two tapered sides that taper from an end region to a tip region; and a sub-wavelength grating (SWG) optically coupled with the tip region. Another adiabatic optical coupler can include a combination of these two adiabatic optical couplers.

In order to bond an opto-electronic device with fiber pigtails to a larger PCB, the fibers need to be secured in place so that they don't become entangled in the bonding elements resulting in misalignment of the electronic connectors and of the optics. Accordingly, there is a need for packaged parts, which enables customers to use their own surface mount technology (SMT) bonding process without the fiber pigtails interfering with the process. Ideally, the fiber holder device is disposable and provides a spool and a fiber track to guide the fibers from the package to the spool. Ideally, an opening is provided through the spool to enable the components on the opto-electronic device to be accessed.

A plurality of lid structures include at least one lid structure configured to overlie one or more heat sources within a multi-chip-module and at least one lid structure configured to overlie one or more temperature sensitive components within the multi-chip-module. The plurality of lid structures are configured and positioned such that each lid structure is separated from each adjacent lid structure by a corresponding thermal break. A heat spreader assembly is positioned in thermally conductive interface with the plurality of lid structures. The heat spreader assembly is configured to cover an aggregation of the plurality of lid structures. The heat spreader assembly includes a plurality of separately defined heat transfer members respectively configured and positioned to overlie the plurality of lid structures. The heat spreader assembly is configured to limit heat transfer between different heat transfer members within the heat spreader assembly.

A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.