A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R.sup.1 represents a monovalent organic group having 1 to 30 carbon atoms; and X represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000.

R.sup.1—COO.sup.−X.sup.+(1)

Provided are a planographic printing plate precursor including an aluminum support, and an image recording layer and a protective layer which are provided on the aluminum support in this order, in which a thickness of the protective layer is 0.2 μm or greater, and Expression (1) is satisfied in a case where a Bekk smoothness of a surface of an outermost layer on a side opposite to a side where the image recording layer is provided is denoted by b seconds; a planographic printing plate precursor laminate; a plate-making method for a planographic printing plate; and a planographic printing method.

A photosensitive composition capable of forming a cured product with high transparency, a cured product of the photosensitive composition, and a method for producing the cured product using the photosensitive composition. In a photosensitive composition including a base component having photopolymerizability and a photopolymerization initiator, a silicone resin is used as the base component, and a phosphine oxide compound and an oxime ester compound as a photopolymerization initiator are used in combination at a specific ratio.

There is provided a curable resin composition containing quantum dots (A), a resin (B), a photopolymerizable compound (C), and a photopolymerization initiator (D), in which the photopolymerization initiator (D) contains an oxime compound having a first molecular structure represented by the formula (1).

Some of the resin compositions are ultraviolet light or thermally curable, while others are ultraviolet light curable. One example of the ultraviolet light or thermally curable resin composition consists of a predetermined mass ratio of a (meth)acrylate cyclosiloxane monomer and a non-siloxane (meth)acrylate based monomer ranging from about >0:<100 to about 80:20; from 0 mass % to about 10 mass %, based on a total solids content of the resin composition, of an initiator selected from the group consisting of an azo-initiator, an acetophenone, a phosphine oxide, a brominated aromatic acrylate, and a dithiocarbamate; a surface additive; and a solvent.

An example of an ultraviolet light curable resin composition includes a predetermined mass ratio of a first epoxy substituted polyhedral oligomeric silsesquioxane monomer and a second substituted polyhedral oligomeric silsesquioxane monomer, wherein the first and second epoxy substituted polyhedral oligomeric silsesquioxane monomers are different, and wherein the predetermined mass ratio ranges from about 3:7 to about 7:3; bis-(4-methylphenyl)iodonium hexafluorophosphate as a first initiator; a second initiator selected from the group consisting of a free radical initiator and a cationic initiator other than bis-(4-methylphenyl)iodonium hexafluorophosphate; a surface additive; and a solvent.

A photosensitive transfer material including a temporary support and a transfer layer including a photosensitive layer, in which a transmittance of the photosensitive layer to light having a wavelength of 365 nm is 0.1% to 30% or a transmittance of the photosensitive layer to light having a wavelength of 405 nm is 0.05% to 30%.

A photosensitive transfer material including a temporary support and a transfer layer including a photosensitive layer, in which a transmittance of the photosensitive layer to light having a wavelength of 365 nm is 0.1% to 30% or a transmittance of the photosensitive layer to light having a wavelength of 405 nm is 0.05% to 30%.

A photosensitive transfer material including a temporary support and a transfer layer including a photosensitive layer, in which the photosensitive layer has infrared curing properties, and a transmittance of the photosensitive layer to light having a wavelength of 830 nm is 0.1% or more.

A photosensitive transfer material for an LED array, including a temporary support and a transfer layer including a photosensitive layer, in which an L* value of a surface of the photosensitive layer on a temporary support side, which is measured by an SCE method, is 5.0 or less.