The present disclosure provides a positive photoresist composition including a major adhesive material and a photosensitizer, wherein the photoresist composition further includes a photoisomerizable compound which would be converted into an ionic structure with an increased degree of molecular polarity after ultraviolet irradiation. The formation of the ionic structure with increased polarity of the molecule reduces the adhesion between the positive photoresist and the organic film layer, facilitates stripping after formation of the via, and improves the product rate of pass. Further, the present disclosure provides a via-forming method using the positive resist composition, a display substrate including the via formed by the via-forming method, and a display device including the display substrate.

Provided is a matte-like cured coating film that is provided on a substrate such as a wiring boar, in which scratches are unnoticeable. The cured coating film is a cured coating film of a curable resin composition provided on the substrate. The cured coating film satisfies Gs (20°)≤5 and Gs (85°)≥35 and has a ratio R represented by the formula R={Gs (85°)/Gs (60°)}/{Gs (60°)/Gs (20°)} ranging from 0.35 to 4.0, where Gs (20°), Gs (60°), and Gs (85°) are 20° gloss, 60° gloss, and 85° gloss on a surface of the cured coating film measured according to JIS Z 8741-1997, respectively.

Provided are a coloring resin composition including a resin, a coloring material, and an organic solvent, in which the resin includes a resin A including a repeating unit (A) represented by Formula (a), where, in Formula (a), L.sup.a1 represents a trivalent group, Ar.sup.a1 represents an aromatic hydrocarbon group having a substituent, the substituent is a group having a structure in which a bonding portion with the aromatic hydrocarbon group is an ester bond or an amide bond, in the ester bond, an atom on a side different from an oxygen atom in the ester bond is on a side of the bonding portion with the aromatic hydrocarbon group, and in the amide bond, an atom on a side different from a nitrogen atom in the amide bond is on a side of the bonding portion with the aromatic hydrocarbon group; a film formed of the coloring resin composition; a color filter; a solid-state imaging element; and an image display device.

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A composition includes two or more near infrared absorbing compounds having an absorption maximum in a wavelength range of 650 to 1000 nm and having a solubility of 0.1 mass % or lower in water at 23° C., in which the two or more near infrared absorbing compounds include a first near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm, and a second near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm which is shorter than the absorption maximum of the first near infrared absorbing compound, and a difference between the absorption maximum of the first near infrared absorbing compound and the absorption maximum of the second near infrared absorbing compound is 1 to 150 nm.

A composition includes two or more near infrared absorbing compounds having an absorption maximum in a wavelength range of 650 to 1000 nm and having a solubility of 0.1 mass % or lower in water at 23° C., in which the two or more near infrared absorbing compounds include a first near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm, and a second near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm which is shorter than the absorption maximum of the first near infrared absorbing compound, and a difference between the absorption maximum of the first near infrared absorbing compound and the absorption maximum of the second near infrared absorbing compound is 1 to 150 nm.

A photosensitive resin composition is provided. The photosensitive resin composition is applied in a technical field of flexible display devices. The photosensitive resin composition comprises 5 to 50 parts by weight of an acrylate crosslink monomer, 0.2 to 0.6 parts by weight of an initiator, 5 to 8 parts by weight of a liquid pigment solid substance, 5 to 8 parts by weight of a resin, and 20 to 70 parts by weight of a solvent. The initiator is a radical initiator having a decomposition temperature less than 40° C. The acrylate crosslink monomer comprises a copolymerization two of aromatic group-containing and triol-containing acrylate polymerizable monomers for lowering a temperature of a following color filter preparing process. A method of preparing the photosensitive resin composition and a display device comprising the photosensitive resin composition are also provided.

A composition includes a near infrared absorbing pigment and a solvent, in which the near infrared absorbing pigment is at least one selected from a colorant compound which has a cation and an anion in the same molecule, a colorant compound which is a salt of a cationic chromophore and a counter anion, and a colorant compound which is a salt of an anionic chromophore and a counter cation, a D50 particle size in which a cumulative volume in a particle size distribution of particle sizes of the near infrared absorbing pigment is 50% is 100 nm or lower, and d values of Hansen solubility parameters of the near infrared absorbing pigment and the solvent satisfy a predetermined expression.

A composition includes a near infrared absorbing pigment and a solvent, in which the near infrared absorbing pigment is at least one selected from a colorant compound which has a cation and an anion in the same molecule, a colorant compound which is a salt of a cationic chromophore and a counter anion, and a colorant compound which is a salt of an anionic chromophore and a counter cation, a D50 particle size in which a cumulative volume in a particle size distribution of particle sizes of the near infrared absorbing pigment is 50% is 100 nm or lower, and d values of Hansen solubility parameters of the near infrared absorbing pigment and the solvent satisfy a predetermined expression.

[Object] To provide a negative type photosensitive composition developable with a low concentration alkali developer and capable of forming a cured film excellent in transparency, in chemical resistance and in environmental durability; and further to provide a pattern-formation method employing the composition. [Means] The present invention provides a negative type photosensitive composition comprising: (I) an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit, (II) a polysiloxane, (III) a compound having two or more (meth)acryloyloxy groups, (IV) (i) a silicone derivative having a particular structure and/or (ii) a compound having two or more epoxy groups, (V) a polymerization initiator, and (VI) a solvent.

[Object] To provide a negative type photosensitive composition developable with a low concentration alkali developer and capable of forming a cured film excellent in transparency, in chemical resistance and in environmental durability; and further to provide a pattern-formation method employing the composition. [Means] The present invention provides a negative type photosensitive composition comprising: (I) an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit, (II) a polysiloxane, (III) a compound having two or more (meth)acryloyloxy groups, (IV) (i) a silicone derivative having a particular structure and/or (ii) a compound having two or more epoxy groups, (V) a polymerization initiator, and (VI) a solvent.