A photoresist composition and manufacturing method thereof, a manufacturing method of a metal pattern, and a manufacturing method of an array substrate are provided. The photoresist composition includes a base material and an ion adsorbent, and the ion adsorbent is chelating resin.

A photosensitive composition capable of forming a cured product with high transparency, a cured product of the photosensitive composition, and a method for producing the cured product using the photosensitive composition. In a photosensitive composition including a base component having photopolymerizability and a photopolymerization initiator, a silicone resin is used as the base component, and a phosphine oxide compound and an oxime ester compound as a photopolymerization initiator are used in combination at a specific ratio.

The present invention provides a photosensitive material with which a film having a low relative permittivity can be formed. In addition, the present invention provides a pattern forming method, a manufacturing method of a circuit wiring, a manufacturing method of a touch panel, and a transfer film, which are related to the photosensitive material.

The photosensitive material of the present invention satisfies at least one requirement of the following requirement (V01) or the following requirement (W01).

(V01) the photosensitive material includes a polymer A having a carboxy group and a compound β which has a structure b0 in which an amount of the carboxy group included in the polymer A is reduced by exposure.

(W01) the photosensitive material includes a polymer Ab0 which is the polymer A and further has the structure b0 in which the amount of the carboxy group included in the polymer A is reduced by exposure.

In a conductive film, a cured film formed of a photosensitive resin composition including at least one of monomers represented by Formulae (1) and (2), a clay mineral, and a photopolymerization initiator is provided as a protective layer of a lead-out wiring part of the conductive film that functions as a touch sensor.

In a conductive film, a cured film formed of a photosensitive resin composition including at least one of monomers represented by Formulae (1) and (2), a clay mineral, and a photopolymerization initiator is provided as a protective layer of a lead-out wiring part of the conductive film that functions as a touch sensor.

The present application relates to a binder resin including a compound represented by Formula 1-1 and a compound represented by the following Formula 1-2, a negative-type photosensitive resin composition, and a display device including a black bank formed by using the same.

The present application relates to a binder resin including a compound represented by Formula 1-1 and a compound represented by the following Formula 1-2, a negative-type photosensitive resin composition, and a display device including a black bank formed by using the same.

A holographic recording medium composition comprising component (e): a compound having an isocyanate group or an isocyanate-reactive functional group and further having a nitroxyl radical group, wherein component (e) contains component (e-1) below: component (e-1): a compound having a heterobicyclic ring structure or a heterotricyclic ring structure, the heterobicyclic ring structure or the heterotricyclic ring structure being obtained by replacing a carbon atom in a bicyclic ring structure or a tricyclic ring structure by the nitroxyl radical group.

A curable resin composition containing quantum dots (A), a resin (B), a photopolymerizable compound (C), a photopolymerization initiator (D), an antioxidant (E), and a solvent (F), wherein a water content based on a total mass of the curable resin composition is 50 ppm or more and less than 5000 ppm.

There is provided a curable resin composition containing quantum dots (A), a resin (B), a photopolymerizable compound (C), and a photopolymerization initiator (D), in which the photopolymerization initiator (D) contains an oxime compound having a first molecular structure represented by the formula (1).