A copolymer including fluorinated units of formula (I):

—CX.sub.1X.sub.2—CX.sub.3X.sub.4—  (I)

in which each of the X.sub.1, X.sub.2, X.sub.3 and X.sub.4 is independently chosen from H, F and alkyl groups including from 1 to 3 carbon atoms which are optionally partially or totally fluorinated; and fluorinated units of formula (II):

—CX.sub.5X.sub.6—CX.sub.7Z—  (II)

in which each of the X.sub.5, X.sub.6 and X.sub.7 is independently chosen from H, F and alkyl groups including from 1 to 3 carbon atoms which are optionally partially or totally fluorinated, and in which Z is a photoactive group of formula —Y—Ar—R, Y representing an oxygen atom or an NH group or a sulfur atom, Ar representing an aryl group, and R being a monodentate or bidentate group including from 1 to 30 carbon atoms. Also, a process for preparing this copolymer, a composition including this copolymer, and a film obtained from this copolymer.

Provided are a photosensitive composition including a coloring material, a photopolymerization initiator, a polymerizable monomer, and a resin, in which the photopolymerization initiator includes an oxime compound OX having an aromatic ring group Ar.sup.OX1 in which an electron withdrawing group is introduced into an aromatic ring, and a value obtained by dividing a mass of the polymerizable monomer by a mass of the photopolymerization initiator is 0.5 to 5.5; a film; an optical filter; a solid-state imaging element; and an image display device.

Provided are a photosensitive composition including a coloring material, a photopolymerization initiator, a polymerizable monomer, and a resin, in which the photopolymerization initiator includes an oxime compound OX having an aromatic ring group Ar.sup.OX1 in which an electron withdrawing group is introduced into an aromatic ring, and a value obtained by dividing a mass of the polymerizable monomer by a mass of the photopolymerization initiator is 0.5 to 5.5; a film; an optical filter; a solid-state imaging element; and an image display device.

Disclosed herein is a photosensitive composition comprising an epoxy resin, a photoacid generator, and an antioxidant. The disclosed composition is useful for producing relief images having reduced yellowing or other discoloration due to thermal oxidation.

Disclosed herein is a photosensitive composition comprising an epoxy resin, a photoacid generator, and an antioxidant. The disclosed composition is useful for producing relief images having reduced yellowing or other discoloration due to thermal oxidation.

The present invention relates to a photoresist composition capable of realizing excellent pattern performance during formation of fine patterns, and of preparing a photoresist film that is excellent in chemical stability of a plating solution, and a photoresist film using the same.

The present invention relates to a photoresist composition capable of realizing excellent pattern performance during formation of fine patterns, and of preparing a photoresist film that is excellent in chemical stability of a plating solution, and a photoresist film using the same.

A lithographic printing plate precursor including a support and a coating comprising a polymerisable compound, optionally a sensitizer, a photoinitiator and discrete particles is disclosed wherein the discrete particles comprise a crosslinked hydrophobic polymer backbone and a plurality of hydrophobic pendant grafts.

A black light-shielding photosensitive resin composition, a black matrix, a black light-shielding film, a frame, and a filling material for a splicing area are provided. The black light-shielding photosensitive resin composition includes a resin (A), a pigment (B), a monomer (C), an initiator (D), and a solvent (E). The resin (A) includes an epoxy resin (A-1) and a resin (A-2) having an ethylenic unsaturated functional group. The pigment (B) includes black particles (B-1) and hollow particles (B-2).

The present invention provides a positive photoresist composition having excellent storage stability, sensitivity, developing properties, plating resistance, and heat resistance. More specifically, a specific dissolution inhibitor in the form of an oligomer having the same repeating unit structure as the resin contained in the photoresist composition is applied to said composition.