The present invention provides an information processing apparatus comprising a generator configured to generate image information for causing a display unit to display, as display information, any one of: difference information corresponding to a difference between first information and second information; information indicating at least one of a height and an attitude of the substrate during the exposure process of each of the plurality of shot regions; and information indicating a measurement result obtained by measuring a surface position of the substrate for each of the plurality of shot regions.

The invention provides an inspection apparatus for inspecting an object, the apparatus comprising: a measurement system configured to measure: a first parameter of the object across an area of interest of the object, and a second parameter, different from the first parameter, of the object at a plurality of locations on the object; a stage apparatus configured to position the object relative to the measurement system during a measurement of the first parameter, wherein the measurement system is configured to measure the second parameter at the plurality of different locations during the measurement of the first parameter and wherein the stage apparatus is configured to position the object relative to the measurement system based on a compliance characteristic of the stage apparatus.

Process control methods, metrology targets and production systems are provided for reducing or eliminating process overlay errors. Metrology targets have pair(s) of periodic structures with different segmentations, e.g., no segmentation in one periodic structure and device-like segmentation in the other periodic structure of the pair. Process control methods derive metrology measurements from the periodic structures at the previous layer directly following the production thereof, and prior to production of the periodic structures at the current layer, and use the derived measurements to adjust lithography stage(s) that is part of production of the current layer. Production system integrate lithography tool(s) and metrology tool(s) into a production feedback loop that enables layer-by-layer process adjustments.

Disclosed is a method of measuring a target on a substrate using a metrology tool comprising an illumination source operable to emit an illumination beam for illuminating the target and a metrology sensor for collecting the scattered radiation having been scattered by the target. The method comprises calculating a target angle based on cell dimensions of a unit cell of said target in a first direction and a second direction orthogonal to said first direction; and order numbers of a selected pair of complementary diffraction orders in said first direction and second direction. At least one pair of measurement acquisitions is performed at a first target orientation and a second target orientation with respect to the illumination beam, wherein said target angle for at least one of said at least one pair of measurement acquisitions is an oblique angle.

An operating method includes: placing a first mask, a second mask, a third mask and a fourth mask on a rotating base, in which each of the first, second, third and fourth masks has a first exposure unit, a second exposure unit, a third exposure unit and a fourth exposure unit; overlaying the first, second, third and fourth masks such that the first exposure unit of the first mask, the second exposure unit of the second mask, the third exposure unit of the third mask and the fourth exposure unit of the fourth mask are arranged adjacently to form an exposure area; simulating a first coordinate information according to the exposure area by an image simulation unit; scanning the exposure area, by a scanning electron microscope (SEM), to obtain a second coordinate information; and comparing the first coordinate information with the second coordinate information.

A method of image template matching for multiple process layers of, for example, semiconductor substrate with an adaptive weight map is described. An image template is provided with a weight map, which is adaptively updated based during template matching based on the position of the image template on the image. A method of template matching a grouped pattern or artifacts in a composed template is described, wherein the pattern comprises deemphasized areas weighted less than the image templates. A method of generating an image template based on a synthetic image is described. The synthetic image can be generated based on process and image modeling. A method of selecting a grouped pattern or artifacts and generating a composed template is described. A method of per layer image template matching is described.

A metrology tool that includes a substrate table to hold a substrate; a projection system configured to project a beam on a target portion of the substrate; an actuator configured to adjust a position of the projection system relative to the substrate on the substrate table; a sensor configured to determine a position of the substrate table; and a one or more processors configured to: determine, based on the position of the substrate table, a position error of the substrate table with respect to a reference; and control, via the actuator, a position of the projection system to compensate for the position error of the substrate table so that the beam projects on the target portion of the substrate.

Disclosed is an illumination module for a metrology device. The illumination module comprises a configurable illumination module operable to provide measurement illumination over a configurable range of illumination angles, a grating light valve module for controllably configuring a spectral configuration of the measurement illumination; and a controller operable to control the configurable illumination module and the grating light valve module such that the spectral configuration of the measurement illumination is varied in dependence with illumination angle within the range of illumination angles so as to obtain a desired detection condition for detection of diffracted radiation from a diffractive structure resultant from a measurement of the diffractive structure using the measurement illumination.

A system for measuring a beam. The system includes a measurement device configured to measure the beam and determine a signal based on the measured beam, and a fluid supply device configured to provide fluid as a fluid stream to, or surrounding, the beam. The system is configured to calculate noise of the signal, and to adjust a parameter of the fluid of the fluid stream to reduce the calculated noise.

Embodiments of the systems, methods, and software provided herein patterns substrates using digital lithography patterning controlled by field programmable gate arrays (FPGA). Stage position data is provided to the FPGA from the lithography environment and the data is loaded into a memory from the FPGA. The graphics processing unit, reads the data from the memory and calculates instructions based on the data. At least a portion of a substrate disposed on the stage is processed using instructions provided by the FPGA.