A method localizes assembly errors during the arrangement and/or the assembly of in particular vibration-isolated structural elements, in particular of components of optical arrangements, preferably of microlithographic projection exposure apparatuses.

Embodiments described herein relate to a dynamically controlled lens used in lithography tools. Multiple regions of the dynamic lens can be used to transmit a radiation beam for lithography process. By allowing multiple regions to transmit the radiation beam, the dynamically controlled lens can have an extended life cycle compared to conventional fixed lens. The dynamically controlled lens can be replaced or exchanged at a lower frequency, thus, improving efficiency of the lithography tools and reducing production cost.

A semiconductor lithography projection exposure apparatus includes a sensor reference including reference elements. The apparatus also includes an optical element, which includes a main body comprising receiving elements receiving the reference elements. The optical element further includes a referential surface that is an optically active surface of the optical element. The reference elements are arranged to determine a position and an orientation of the optical element. A method includes aligning a sensor reference with respect to a referential surface in a semiconductor lithography projection exposure apparatus.

For the purposes of positioning a component part, provision is made in an optical system for a stray magnetic field to be detected via a sensor device and for a correction signal for compensating the effect of the stray magnetic field on the positioning of the component part to be ascertained.

A filter assembly, for example for a control loop for controlling the position of at least one element, comprises first and second filters. The first filter suppresses an undesired component in a signal to be filtered. The first filter produces a first signal delay in a first frequency range. The second filter produces a second signal delay in the first frequency range. The second signal delay at least partly compensates the first signal delay.

A method for localizing an abnormality in a travel path of an optical component in or for a lithography apparatus includes: a) moving the optical component in at least one first degree of freedom; b) detecting a movement (R.sub.z) of the optical component and/or a force acting on the optical component in at least one second degree of freedom; and c) localizing the abnormality as a function of the movement detected in b) and/or the force detected in b).

There is provided a planarization apparatus that planarizes composition in a specified region on a substrate using a planar section of a mold. The planarization apparatus includes a mold holding unit configured to hold the mold, a measurement unit configured to measure a shape of the planar section of the mold held by the mold holding unit and convexly deformed, and a control unit configured to align, based on a result of measurement by the measurement unit, the planar section of the mold and the substrate with respect to a direction along a surface of the substrate so as to bring the planar section of the mold into contact with the specified region on the substrate, and bring the mold and the composition into contact with each other.

A reticle inspection system and a method of handling a reticle in a reticle inspection system are provided. The reticle inspection system includes an active reticle carrier and an inspection tool. The reticle is disposed on the active reticle carrier, and the inspection tool is configured to determine an orientation of the reticle when the active reticle carrier is disposed on a reticle stage. The active reticle carrier is movable between a loading station and the reticle stage and is configured to rotate the reticle to reorient the reticle based on the orientation of the reticle while the active carrier is disposed on the reticle stage.

A semiconductor lithography projection exposure apparatus includes a sensor reference including reference elements. The apparatus also includes an optical element, which includes a main body comprising receiving elements receiving the reference elements. The optical element further includes a referential surface that is an optically active surface of the optical element. The reference elements are arranged to determine a position and an orientation of the optical element. A method includes aligning a sensor reference with respect to a referential surface in a semiconductor lithography projection exposure apparatus.

A mounting fixture of an apparatus for clamping a film includes a platform, a barricade, and fixing members. A surface of the platform includes a first fixing portion, and second and third fixing portions which are opposite to the first fixing portion. The second fixing portion is adjacent to the third fixing portion and located between the first and third fixing portions. The barricade is disposed on the surface between the second and third fixing portions and has channels. The fixing members are disposed on the surface. First, second, and third bars of the apparatus are disposed on the first, second, and third fixing portions, the barricade is located between the second and third bars, and the channels receive elastic elements of the apparatus. Each elastic element has two ends disposed on the second and third bars. The fixing members can fix the first and third bar.