A clamping apparatus of a soft film and a mounting fixture thereof are described. The clamping apparatus includes a first bar, a second bar, a third bar, and at least one elastic element. The first bar and second bar are respectively configured to fix a first side portion and a second side portion of a soft film. The third bar is adjacent and connected to the second bar. The third bar and the first bar are respectively located on two opposite sides of the second bar. The third bar is configured to pull the soft film from the second side portion of the soft film through the second bar. The elastic element has a first end and a second end opposite to each other and respectively disposed on the second bar and the third bar. The elastic element is configured to provide the soft film with pull buffer.

Provided for herein is a device that includes a first base support rotatable about a first rotational axis perpendicular to a rest surface of the first base support; a second base support arranged on the first base support and rotatable about a second rotational axis perpendicular to the rest surface of the first base support; at least one third base support arranged on the second base support and rotatable about a third rotational axis perpendicular to the rest surface of the first base support; and a supporting element is arranged on the third base support and including a holding surface for holding at least one optical element, the holding surface being rotatable about a rotational axis perpendicular to the holding surface.

An EUV mask inspection system includes a mask receiving unit configured to receive a manufactured EUV mask, a main chamber configured to perform an inspection on the EUV mask, and a load-lock chamber disposed between the mask receiving unit and the main chamber. The load-lock chamber includes a mask table for loading the EUV mask, an UV lamp disposed adjacent the mask table in a first direction, a cold trap disposed adjacent the mask table in a second direction, and a vacuum pump. The first direction is a direction perpendicular to a sidewall of the mask table, and the second direction is a direction perpendicular to a top surface of the mask table. The UV lamp is configured to evaporate water molecules on the EUV mask by irradiating UV light onto the EUV mask. The cold trap is configured to trap the water molecules evaporated from the EUV mask.

An optical element reflects radiation, such as EUV radiation. The optical element includes a substrate with a surface to which a reflective coating is applied. The substrate has at least one channel through which a coolant can flow. The substrate is formed from fused silica, such as titanium-doped fused silica, or a glass ceramic. The channel has a length of at least 10 cm below the surface to which the reflective coating is applied. The cross-sectional area of the channel varies by no more than +/−20% over the length of the channel.

A method includes: a) measuring individual parts K1-KN of an optical system to provide measurement data, N being greater than one; b) using the measurement data to virtualize the individual parts K1-KN and using the virtualized individual parts K1-KN to generate an actual assembly model by geometrically stringing together a plurality of the virtualized individual parts K1-KN, the actual assembly model comprising virtual actual positions of the virtualized individual parts K1-KN in a virtually assembled state; c) using the actual assembly model and a target assembly model to determine a correction measure, the target assembly model comprising virtual target positions of one or more of the virtualized individual parts K1-KN in the virtually assembled state; and d) using the correction measure, assembling the individual parts K1-KN to form the optical system.

An arrangement for use in a microlithographic optical imaging device includes an optical unit and a supporting structure for supporting the optical unit. The optical unit includes an optical element, a carrier structure for carrying the optical element, and an active actuating device. The optical element is supported on the carrier structure via of the active actuating device. The active actuating device is configured to adjust the optical element during normal operation of the optical imaging device in a maximum movement range, which is predefined by the normal operation of the optical imaging device, with respect to a first reference assigned to the imaging device. The active actuating device is configured so that the maximum movement range is completely covered by actuating movements of the active actuating device with an actuating accuracy predefined by the normal operation of the optical imaging device.

A method adjusts a first element of a lithography apparatus toward a second element of the lithography apparatus via a tunable spacer which is arranged between the first element and the second element. The method includes: determining an actual location of the first element; determining a nominal location of the first element; unloading the tunable spacer; adjusting a height of the tunable spacer to bring the first element from the actual location to the nominal location; and loading the tunable spacer.

An arrangement of a microlithographic imaging device, such as one that operates in the EUV range, includes a holding device for holding an optical element. The optical element includes an optical surface and defines a plane of main extension, in which the optical element defines a radial direction and a circumferential direction. The holding device includes a base unit and more than three separate holding units. The base unit includes a plurality of support interface units, which are spaced apart from one another in the circumferential direction, for connecting the holding device to a support structure. The holding units are connected to the base unit and distributed along the circumferential direction and spaced apart from one another. The holding units hold the optical element with respect to the base unit.

An optical assembly and a method of making an optical assembly in which additive manufacturing techniques are used to form a support structure either directly on an optical element or on a carrier that is subsequently bonded to an optical element.

An arrangement of a microlithographic optical imaging device includes first and second supporting structures. The first supporting structure supports at least one optical element of the imaging device via an active relative situation control device of a control device. The first supporting structure supports the second supporting structure via supporting spring devices of a vibration decoupling device. The supporting spring devices act kinematically parallel to one another. Each supporting spring device defines a supporting force direction and a supporting length along the supporting force direction. The second supporting structure supports a measuring device of the control device. The measuring device is connected to the relative situation control device. The measuring device outputs to the relative situation control device measurement information representative for the position and/or the orientation of the at least one optical element in relation to a reference in at least one degree of freedom in space.