An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including an improved load lock unit is disclosed. An improved load lock system may comprise a plurality of supporting structures configured to support a wafer and a conditioning plate including a heat transfer element configured to adjust a temperature of the wafer. The load lock system may further comprise a gas vent configured to provide a gas between the conditioning plate and the wafer and a controller configured to assist with the control of the heat transfer element.

Embodiments of baking chambers for baking a substrate and methods of use thereof are provided herein. In some embodiments, a multi-chamber process tool for processing a substrate including: a wet clean chamber for cleaning the substrate; and a baking chamber configured to heat the substrate to remove residue or haze left over after a wet clean process performed in the wet clean chamber, the baking chamber comprising: a chamber body enclosing an interior volume; a heater disposed in the interior volume, wherein the heater is configured to have a surface temperature of about 100 to about 400 degrees Celsius during use; a substrate support configured to support a substrate disposed in the interior volume, wherein the substrate support has a direct line of sight with the heater such that the heater heats the substrate support via convection; and a gas inlet and a gas outlet coupled to the interior volume.

The disclosure relates to a device for transmitting electrical signals between a first interface element, arranged at a first structure of a lithography system, and a second interface element, arranged at a second structure of the lithography system. An electrical conductor connects the first interface element and the second interface element. The device has a hollow body which surrounds at least sections of the electrical conductor and which is designed to electromagnetically shield the electrical conductor. A gap is provided in the hollow body or between the hollow body and one of the structures and allows a relative movement of the first structure and the second structure to mechanically decouple the first structure from the second structure.

A component for a projection exposure apparatus includes a printed circuit board arranged in an encapsulated housing and having electronic component parts, and a heat conducting structure for dissipating heat from the electronic component parts to an outer side of the housing.

A substrate processing apparatus including: a first valve provided between a gas supply source and an air-water separation tank, the first valve opening and closing a flow path of a gas supplied from the gas supply source; a second valve that opens and closes a flow path of liquid discharged from a discharge port of the air-water separation tank; and a control unit that controls the first valve and the second valve. The discharge port of the air-water separation tank communicates with a discharge port of a cleaning chamber that cleans the substrate, and the control unit controls to close the first valve after preset gas supply time elapses from when the first valve is opened and gas can no longer be discharged from the air-water separation tank and controls to close the second valve after the first valve is closed.

A vessel having a seal that is protected from the liquid material within the vessel by a volume of gas. The vessel has a partition that divides the vessel into two volume spaces such that the seal that is in gaseous communication with the first volume space is protected from the liquid material in the second volume space by a volume of gas in the first volume space.

A microlithographic apparatus comprises an optical wavefront manipulator. The latter includes an optical element and a gas-tight cavity that is partly confined by the optical element or contains it. A gas inlet device directs a gas jet towards the optical element. The location, where the gas jet impinges on the optical element after it has passed through the cavity, is variable in response to a control signal supplied by a control unit. A gas outlet is in fluid connection with the vacuum pump so that, upon operation of the vacuum pump, the pressure within the cavity is less than 10 mbar even if the gas jet passes through the cavity.

A lithographic apparatus is described having a liquid supply system configured to at least partly fill a space between a projection system of the lithographic apparatus and a substrate with liquid, a barrier member arranged to substantially contain the liquid within the space, and a heater.

A vacuum system, in particular an EUV lithography system, includes: a vacuum housing (2), in which a vacuum environment (16) is formed. A surface (2a) of the vacuum housing is subjected to contaminating particles (17) in the vacuum environment. A surface structure (18) at the surface reduces adhesion of the contaminating particles and has pore-shaped depressions (24) separated from one another by webs (25).

The disclosure relates to a device for transmitting electrical signals between a first interface element, arranged at a first structure of a lithography system, and a second interface element, arranged at a second structure of the lithography system. An electrical conductor connects the first interface element and the second interface element. The device has a hollow body which surrounds at least sections of the electrical conductor and which is designed to electromagnetically shield the electrical conductor. A gap is provided in the hollow body or between the hollow body and one of the structures and allows a relative movement of the first structure and the second structure to mechanically decouple the first structure from the second structure.