The invention relates to a method for detecting the position of a mask holder for photolithographic masks, said method including the following steps: positioning the mask holder with the mask on a measuring table of a measurement apparatus, measuring the mask holder by use of an algorithm, storing the absolute position of the mask holder on the measuring table, and recording and storing at least one reference image.

A pre-alignment measurement device includes, disposed in a direction of propagation of light, a laser, a first cylindrical lens, a first imaging lens, an illumination diaphragm, a second imaging lens, a second cylindrical lens and a CCD detector. The laser, an object under measurement and the CCD detector are arranged at respective apexes of a triangle formed by the measurement device for pre-alignment. A light beam is emanated by the laser and is transformed into a line beam. The line beam is reflected by the object under measurement and then passes through the second cylindrical lens to form a CCD image which has different horizontal and vertical magnifications, allowing horizontal and vertical resolutions to be matched with horizontal and vertical measuring ranges, respectively. The CCD image contains information of a position and a height of a step defined by the object under measurement and the wafer stage.

A substrate handling system for handling a substrate, the substrate handling system including a holder for holding the substrate, a rotation device for rotating the holder around an axis perpendicular to a plane, and a mover for moving the holder along a path in the plane relative to the axis. Further, there is provided a lithographic apparatus including the substrate handling system. The substrate handling system may include a coupling device arranged to couple the holder to the mover or the rotation device in a first situation. The coupling device may be arranged to decouple the holder from the mover or rotation device in a second situation.

A device for determining alignment errors of structures which are present on, or which have been applied to a substrate, comprising a substrate holder for accommodating the substrate with the structures and detection means for detecting X-Y positions of first markings on the substrate and/or second markings on the structures by moving the substrate or the detection means in a first coordinate system, wherein in a second coordinate system which is independent of the first coordinate system X-Y structure positions for the structures are given whose respective distance from the X-Y positions of the first markings and/or second markings can be determined by the device.

The present invention provides a measurement apparatus that measures a position of an object, the apparatus including a detector configured to detect a mark formed on the object and generate a detection signal, and a processor configured to obtain the position of the object based on the detection signal, wherein the processor is configured to obtain the position of the object based on a portion of the detection signal that is limited based on information about a tolerance regarding a measurement precision for the object.

A configuration dataset indicative of a setting of one or more operational policies of a control of an industrial field device and a measurement dataset indicative of an event associated with the industrial field device is read from a distributed database. An analysis of the measurement dataset is performed, depending on the configuration dataset.

A lithographic apparatus has a substrate table on which a substrate is positioned, and an alignment sensor used to measure the alignment of the substrate. In an exemplary processing method, the alignment sensor is used to perform one or more edge measurements in a first step. In a second step, one or more edge measurements are performed on the notch of the substrate. The edge measurements are then used to align the substrate in the lithographic apparatus. In a particular example, the substrate is arranged relative to the alignment sensor such that a portion of the edge surface is positioned at the focal length of the lens. When the alignment sensor detects radiation scattered by the edge surface at the focal length of the lens, the presence of the edge of the substrate is detected.

A device for determining alignment errors of structures which are present on, or which have been applied to a substrate, comprising a substrate holder for accommodating the substrate with the structures and detection means for detecting X-Y positions of first markings on the substrate and/or second markings on the structures by moving the substrate or the detection means in a first coordinate system, wherein in a second coordinate system which is independent of the first coordinate system X-Y structure positions for the structures are given whose respective distance from the X-Y positions of the first markings and/or second markings can be determined by the device.

An alignment apparatus for aligning a substrate, and a substrate processing system including such alignment apparatus. The alignment apparatus includes an alignment base for supporting the substrate and/or a substrate support member. A force generating device applies a contact force on the substrate. The force generating device includes an arm including a rigid proximal end and a rigid distal end. The distal end is provided with a contact section for contacting an edge of the substrate and an elastically deformable arm section extending between the proximal and distal ends. The connection part connects the proximal end to the alignment base. The arm is movable with respect to the alignment base via the connection part. The alignment apparatus also includes an actuator for causing a displacement of the proximal end, whereby the contact force, defined by the elastically deformable arm section, is applied to the substrate by the contact section.

A substrate is transported to a coating processing unit. An annular region of one surface of the substrate is processed. The substrate is carried into an edge exposure unit. Positions of a peripheral edge of the substrate and an inner edge of the annular region are detected. A position deviation amount of a center of the substrate held by a spin chuck from a rotation center of the spin chuck is calculated. Based on schedule management information, a relationship between orientations of the substrate held by the spin chuck at the time of carrying of the substrate into the coating processing unit and the substrate held by the substrate rotation unit at the time of carrying of the substrate into the edge exposure unit is specified. Based on the relationship, a position deviation direction of the center of the substrate from the rotation center is determined.