A lithography apparatus includes an original holder configured to hold and move an original, a measurement unit configured to measure a misalignment amount of the original with respect to the original holder, and a controller configured to control movement of the original holder. The controller repeatedly performs preliminary driving for moving the original holder before performing the pattern formation. At this time, if the misalignment amount measured by the measurement unit converges to a predetermined convergence value while the preliminary driving is repeatedly performed, the controller ends the preliminary driving.

A reticle transfer apparatus includes a reticle, a reticle stage (4) and a robot (2). The robot (2) is configured to support, transport and transfer the reticle onto the reticle stage (4). The apparatus further includes: a first set of marks (52) and a second set of marks (53), both provided on the reticle; a pre-alignment unit (3), disposed on one side of the reticle stage (4) and configured to perform a first pre-alignment process by detecting the first set of marks (52) and perform a second pre-alignment process by detecting the second set of marks (53) during the transfer of the reticle; and a control unit, configured to adjust the position of the reticle relative to the reticle stage (4) based on the results of the first pre-alignment process such that the reticle is prevented from colliding with the reticle stage (4) and to adjust the position of the reticle relative to the reticle stage (4) based on the results of the second pre-alignment process such that the reticle is positioned in a predetermined range relative to the reticle stage (4). A reticle transfer method is also disclosed.

In a method of controlling a lithographic apparatus, historical performance measurements are used to calculate a process model relating to a lithographic process. Current positions of a plurality of alignment marks provided on a current substrate are measured and used to calculate a substrate model relating to a current substrate. Additionally, historical position measurements obtained at the time of processing the prior substrates are used with the historical performance measurements to calculate a model mapping. The model mapping is applied to modify the substrate model. The lithographic apparatus is controlled using the process model and the modified substrate model together. Overlay performance is improved by avoiding over- or under-correction of correlated components of the process model and the substrate model. The model mapping may be a subspace mapping, and dimensionality of the model mapping may be reduced, before it is used.

An optical system for producing lithographic structures is disclosed. Also disclosed is a method for determining relative coordinates of a position of a writing field relative to a position of a preview field in such an optical system, and a method for producing lithographic structures using such an optical system.

Reticle pods include inner pods where motion limiting features restrict translational motion of the cover and the baseplate relative to one another. The motion limiting features are in addition to gross alignment features included in the inner pod. The motion limiting features resist the translational motion before the gross alignment features would resist the motion. Motion limiting features can include elastic bodies providing friction against contact surfaces, or pins received on elastic contact surfaces or in diaphragms or motion limiting cups.

The preset invention provides a method of obtaining an array of a plurality of regions on a substrate, including obtaining, using a prior distribution representing a probability distribution of parameters of a regression model used to estimate the array, a first posterior distribution representing the probability distribution of the parameters, obtaining, using the first posterior distribution as the prior distribution representing the probability distribution of the parameters, a second posterior distribution representing the probability distribution of the parameters, and updating the regression model by deciding the parameters based on the second posterior distribution and obtaining, using the updated regression model, the array of the plurality of regions on a substrate from the second position measurement data.

A sensor system configured to determine a position of a substrate having an edge. The sensor system includes a radiation source arranged to emit a radiation bundle, a reflective element, a detector device and a substrate table having a supporting surface for supporting the substrate. The supporting surface is at least partly along a plane. The radiation source and the detector device are arranged on a first side of the plane. The reflective element is arranged on a second side of the plane other than the first side. The reflective element is arranged to create a reflected bundle by reflecting the radiation bundle. The reflective element is arranged to illuminate the edge with the reflected bundle. The detector device is arranged to receive the reflected bundle.

An optical system for producing lithographic structures is disclosed. Also disclosed is a method for determining relative coordinates of a position of a writing field relative to a position of a preview field in such an optical system, and a method for producing lithographic structures using such an optical system.

A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide a light directed to the wafer. The light detection device is configured to detect reflected light intensity from the wafer to locate at least one wafer alignment mark of wafer alignment marks separated by a plurality of angles. At least two of those angles are equal.

The invention relates to an alignment apparatus for aligning a substrate, and a substrate processing system comprising such alignment apparatus. The alignment apparatus comprises an alignment base for supporting said substrate and/or a substrate support member, and a force generating device for applying a contact force on said substrate.

The force generating device comprises: an arm comprising a rigid proximal end and a rigid distal end, said distal end being provided with a contact section for contacting an edge of said substrate, and an elastically deformable arm section extending between the proximal and distal ends, a connection part connecting said proximal end to said alignment base, said arm being movable with respect to said alignment base via said connection part, and an actuator for causing a displacement of said proximal end, whereby said contact force, defined by said elastically deformable arm section, is applied to said substrate by said contact section.