Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations. In particular, some embodiments of the present technology determine the center locations of individual vias on a wafer and average them together to obtain an average center location of the set of vias. Based on a comparison of the average center location to a desired center location, the present technology adjusts the wafer position. Additionally, in some embodiments, the present technology compares wafer via patterns to a template and adjusts the position of the wafer based on the comparison.

The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non-parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.

The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non- parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.

Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations. In particular, some embodiments of the present technology determine the center locations of individual vias on a wafer and average them together to obtain an average center location of the set of vias. Based on a comparison of the average center location to a desired center location, the present technology adjusts the wafer position. Additionally, in some embodiments, the present technology compares wafer via patterns to a template and adjusts the position of the wafer based on the comparison.

A lithography apparatus includes an original holder configured to hold and move an original, a measurement unit configured to measure a misalignment amount of the original with respect to the original holder, and a controller configured to control movement of the original holder. The controller repeatedly performs preliminary driving for moving the original holder before performing the pattern formation. At this time, if the misalignment amount measured by the measurement unit converges to a predetermined convergence value while the preliminary driving is repeatedly performed, the controller ends the preliminary driving.

The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non-parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.

Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations. In particular, some embodiments of the present technology determine the center locations of individual vias on a wafer and average them together to obtain an average center location of the set of vias. Based on a comparison of the average center location to a desired center location, the present technology adjusts the wafer position. Additionally, in some embodiments, the present technology compares wafer via patterns to a template and adjusts the position of the wafer based on the comparison.

An alignment method and an alignment system are provided. The alignment method includes: providing a wafer including an exposed surface, wherein an alignment mark and a reference point with a reference distance are provided on the exposed surface; placing the wafer on a reference plane; performing an alignment measurement on the exposed surface to obtain a projection distance, configured as a measurement distance, between the alignment mark and the reference point on the reference plane; performing a levelling measurement between the exposed surface and the reference plane to obtain levelling data of the exposed surface; obtaining a distance, configured as an expansion reference value, between the alignment mark and the reference point in the exposed surface; obtaining an expansion compensation value based on a difference between the expansion reference value and the reference distance; and adjusting parameters of a photolithography process based on the expansion compensation value for an alignment.

A liquid immersion exposure apparatus includes a stage having a holder that holds a substrate, and is movable below a projection system, supply ports via which immersion liquid is supplied, the supply ports facing an upper surface of the substrate held on the holder, recovery ports via which the immersion liquid is collected and arranged such that (i) the upper surface of the substrate held on the holder faces the recovery ports and (ii) the recovery ports encircle a path of exposure light. The recovery ports collect the immersion liquid from the upper surface of the substrate such that only a portion of the upper surface of the substrate is covered with the immersion liquid. The stage is movable below a gas supply opening that supplies a gas. The stage is movable to a position where the supplied gas is supplied to a surface of the stage.

A liquid immersion exposure method exposes a substrate with exposure light through liquid, and uses a projection system, a stage system having a holder that holds the substrate, a supply port via which the liquid is supplied arranged such that an upper surface of the substrate faces the supply port and that is spaced a first distance from an optical axis of the projection system, and a recovery port via which the liquid is collected arranged such that the upper surface of the substrate faces the recovery port, which is spaced a second distance greater than the first distance from the optical axis of the projection system, and that encircles the supply port. In the method, the substrate held on the holder is positioned based on a detection result of an alignment system that detects an alignment mark of the substrate not through the liquid.