A process and an apparatus for pyrolysis of mixed plastic feedstock producing petroleum products are described. In one example, a process for producing petroleum products includes charging feedstock of mixed polymer materials into a reactor apparatus. Heat energy is applied to the feedstock while advancing the feedstock through the reactor apparatus in an anaerobic operation. The energy input to the reactor apparatus is controlled by controlling a temperature gradient within the reactor vessel to produce petroleum gas product. The process involves in situ chemical reactions comprising cracking and recombination reactions that that are controlled to convert solid hydrocarbonaceous portion of the feedstock to molten fluids and gases inside the reactor vessel and to produce gaseous petroleum products which exit the reactor vessel. The separated solid residue from the pyrolysis process is also removed from the reactions vessel.

Cooling control methods and systems include measuring a temperature of air provided to one or more nodes by an air-to-liquid heat exchanger; measuring a temperature of at least one component of the one or more nodes and finding a maximum component temperature across all such nodes; comparing the maximum component temperature to a first and second component threshold and comparing the air temperature to a first and second air threshold; and controlling a proportion of coolant flow and a coolant flow rate to the air-to-liquid heat exchanger and the one or more nodes based on the comparisons.

A wafer processing apparatus is provided. The apparatus includes: a heating plate through which vacuum ports are formed; a plurality of temperature sensors; a heating device configured to heat the heating plate; first and second power supplies; temperature controllers to generate first and second feedback temperature control signals for controlling power output power supplies based on measurement values generated by the temperature sensors; an electronic pressure regulator configured to provide vacuum pressure for fixing a wafer to the plurality of vacuum ports; and a wafer chucking controller configured to control the electronic pressure regulator, and generate a feedback pressure control signal for controlling the electronic pressure regulator based on the first and second feedback temperature control signals.

Some embodiments are directed to an apparatus for monitoring at least one thermal control device, the device including a power supply input terminal suitable for being connected to an electric power source. The monitoring apparatus includes an electronic console that stores control instructions from the or each thermal control device. The control instructions include, for each thermal control device, at least one temperature setpoint and one energy consumption setpoint; at least one temperature sensor suitable for providing temperature data measurements, the temperature and energy consumption setpoints being determined based on parameters comprising at least said temperature data measurements; and at least one device for controlling the electric power supply of the or one of the thermal control devices, connected to the power supply input terminal of said device and suitable for controlling the electric power supply of the device based on at least the temperature and energy consumption setpoints.

According to certain embodiments, a thermostat is configured for use in a climate control system. The thermostat is operable to use two-way communication for communicating operational information between the thermostat and at least one rooftop unit (RTU) within the climate control system. For example, the two-way communication comprises sending first operational information to the RTU and receiving second operational information from the RTU. The operational information comprising one or more climate control commands, setpoints, configuration information, diagnostics, and/or sensor data. The thermostat is further operable to operate the climate control system based on the operational information communicated between the thermostat and the RTU.

A heat treatment apparatus includes: a vertically-extended processing container configured to accommodate a substrate; a gas supply including a gas supply pipe that extends along an inner wall surface of the processing container in a vertical direction; a heater having a heat insulating material provided around the processing container, and a heating element provided along the inner wall surface of the heat insulating material; and a cooler having a fluid flow path formed outside the heat insulating material, and a blowing-out hole penetrating the heat insulating material and configured to blow out a cooling fluid toward the gas supply pipe, the blowing-out hole having one end that communicates with the fluid flow path and a remaining end that communicates with a space between the processing container and the heat insulating material. A plurality of blowing-out holes is provided in the gas supply pipe in a longitudinal direction.

Techniques for inducing non-uniform cooling are described. According to an embodiment, a system is provided. The system can comprise at least one processor device that executes components stored in a memory, wherein the components comprise: a flow control device that distributes coolant to a location of the at least one processor device; and a sensor controller component that detects a location of a thermal anomaly of the at least one processor device. The components can also comprise a cooling controller component that adjusts the flow control device to direct the coolant to the location of the thermal anomaly.

Techniques for group control using service data objects (SDO) are disclosed. A device controller is configured to perform operations including: receiving, from device controllers that are configured to control devices so that the devices operate based on a shared set point, SDO messages using an SDO protocol; determining that the device controller is a master device controller for the device controllers, based at least on the SDO messages; and sending a setpoint update message including a modified value of the shared set point, using the SDO protocol, to slave device controllers in the device controllers, wherein a slave device controller in the slave device controllers is configured to adjust operation of at least one slave device in the devices, based at least on the setpoint update message.

An integrated circuit that controls distributed temperature sensors in a semiconductor die is described. This integrated circuit may include: memory; a controller (such as a PTAT controller) coupled to the memory; temperature sensors distributed at measurement locations in the semiconductor die (such as remote locations from the controller), where a given temperature sensor includes building blocks (or components) that are common to the temperature sensors; and routing between the controller and the building blocks over an addressable bus, where signal lines for analog signals in the addressable bus are reused when communicating between the controller and different temperature sensors.

A method for adjusting furnace temperature of a reflow oven by AI, through obtaining product data of the reflow oven, obtaining initial characteristic data of a preceding work station and calculating mean values of temperatures of an upper furnace and a lower furnace, and taking the mean values as initial reflow characteristic data. Data as to first reflow characteristics of each reflow temperature zone and second reflow characteristics data of each zone are obtained, and data of the first and second reflow characteristics data are obtained. The electronic device further combines the characteristic data of the preceding work station with the combined reflow characteristics and combines results into a trained neural network model to output a temperature prediction, the oven temperature being adjusted according to the temperature prediction.