Patent classifications
G06F1/184
ELECTROMAGNETIC INTERFERENCE SHIELDING ENCLOSURE WITH THERMAL CONDUCTIVITY
Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.
MAINBOARD FIXING DEVICE, DISPLAY MODULE AND DISPLAY DEVICE
A mainboard fixing device, a display module and a display device are provided. The mainboard fixing device includes a printed circuit board (PCB) mainboard, a first elastic member and a second elastic member. The first elastic member and the second elastic member are disposed at a first side and a second side of the PCB mainboard, respectively. The first side and the second side are symmetric with each other.
Mainboard fixing device, display module and display device
A mainboard fixing device, a display module and a display device are provided. The mainboard fixing device includes a printed circuit board (PCB) mainboard, a first elastic member and a second elastic member. The first elastic member and the second elastic member are disposed at a first side and a second side of the PCB mainboard, respectively. The first side and the second side are symmetric with each other.
MOTHERBOARD AND DETACHABLE MODULE
A motherboard, comprises a signal transmitting terminal and a plurality of connectors connected to the signal transmitting terminal, respectively. Each of the connectors supports a plurality of connection specifications for assembling a detachable module. The detachable module includes a golden finger connecting member and an I/O port.
MANUFACTURING METHOD OF DISPLAY SUBSTRATE MOTHERBOARD, AND DISPLAY DEVICE
The present disclosure provides a display substrate motherboard and a manufacturing method thereof, and a display device, wherein the display substrate motherboard includes a plurality of display units located on an organic substrate and a cutting region between adjacent display units, and the cutting region includes therein the organic substrate and an inorganic film layer covering the organic substrate.
Unlocking structure and electronic device
An unlocking structure adapted to an insert slot is provided. An expansion card is adapted to be inserted into the insert slot and fixed on the insert slot by a locking component. The unlocking structure includes a base and an operation shaft. The base is fixed on the insert slot. The operation shaft is pivoted to the base. The operation shaft is adapted to rotate in relative to the base from a locking position to an unlocking position to drive the locking component to be separated from the expansion card. In addition, an electronic device having the unlocking structure and an electronic module having the unlocking structure are also provided.
Packaging of vertically oriented orthogonally connected systems
A computing system including a chassis and a canister slidably insertable within the chassis, where the canister includes first and second angled slots. A CPU module mounted within the canister includes a plurality of first connectors and a plurality of I/O modules are positioned within the chassis and include a second connector. A plurality of riser cards including a third connector coupled to a bottom edge and a fourth connector coupled to a rear edge, where the third connector on each riser card is connected to one of the first connectors and the fourth connector on each riser card is connected to one of the second connectors. Actuation of ejector levers pivotally mounted to the bottom panel of the chassis cause pins to move in the angled slots and the canister to move relative to the chassis so as to connect and disconnect the second and fourth connectors.
ADAPTER MODULE FOR CIRCUIT BOARD DEVICES AND HOUSING ASSEMBLY FOR SAME
An adapter module includes a bottom housing segment, a top housing segment and a circuit board. The bottom housing segment is structured to mount to a topside of an external circuit board as a first type of component. The circuit board is structured to mount to an interior region of the bottom housing segment. The top housing segment is pivotably connected to the bottom housing segment to move between a closed position and an open position, where in the open position, the interior region can be exposed to allow for the one or multiple components to be accessed.
ULTRA SLIM MODULE FORM FACTOR AND CONNECTOR ARCHITECTURE FOR INLINE CONNECTION
A board-to-board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of the boards. The boards can interconnect while aligned in substantially the same plane with an inline connector. The connector includes a lead frame having the electrical leads and the connector includes an alignment frame to hold the lead frame. The connector includes a conductive case to secure over the alignment frame. The connector includes screw holes to allow screws to secure the connector in place against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.
FIXING STRUCTURE
A fixing structure configured to fix an expansion card to a motherboard and including a support plate and a holder. The support plate has a top side, a bottom side and a first side surface. The top side is located opposite to the bottom side. The first side surface is located between the top side and the bottom side. The first side surface is configured to hold the expansion card. The bottom side is configured to be fixed to the motherboard. The holder includes a connecting part and a fixing part that are located opposite to each other. The connecting part is connected to the top side of the support plate. The fixing part is configured to be fixed to the motherboard.