The present disclosure provides a dual-backplane structure and electronic device using the same. The dual-backplane structure includes: a first backplane having an opening, and the front side of the first backplane includes at least one connector connected with a connector of the second assembly surface on a main board of a control module; a second backplane disposed on the back of the first backplane, the front side of the second backplane includes a connector connected with a connector of the first assembly surface on a main board of a control module; the back side of the second backplane includes a plurality of hard disk connectors for connecting with the hard disk module. At least one connector on the front side of the second backplane is connected with the connector corresponding to the first assembly surface on the main board through the opening of the first backplane.

Methods and systems for managing power distribution and/or mechanical load in data processing systems is provided. The power distribution may be managed using multifunction power buses that may relieve a motherboard of a data processing system from distributing power. The mechanical load may be managed using an adapter plate that may relieve the motherboard of the data processing system from providing for attachment of devices based on the location of the mechanical mounting hardware on the devices. By doing so, motherboards may be standardized and customized for use with various devices.

The present disclosure provides a display motherboard, a method for fabricating the same, and a method for aligning the same. The display motherboard includes an array substrate on which an alignment mark and a color film layer are provided. A portion of a black matrix of the color film layer in an alignment mark area includes a first light-shielding portion and a second light-shielding portion. The first light-shielding portion covers the alignment mark, and the second light-shielding portion covers an area outside the alignment mark, where upper surfaces of the first light-shielding portion and the second light-shielding portion are not in the same plane. When the display motherboard is aligned in the subsequent processes, since the black matrix forms the same pattern as the alignment mark due to a height step, when the exposure machine exposures, the pattern can be directly captured for alignment.

Provided are an array substrate mother board, an array substrate, a display panel and a display device. The array substrate mother board includes array substrates, the array substrate includes a component disposing area; the array substrate includes a base substrate and a drive circuit layer, the drive circuit layer includes a first metal layer, and the first metal layer includes capacitor plates arranged in an array along the first direction and along the second direction; the plurality of array substrates include first-type array substrates, and the plurality of first-type array substrates are arranged along the first direction and are adjacent to a boundary extending along a first direction in the mother board of the array substrate.

A display device includes a housing, a screen, and a control board. The housing includes grip portions to be gripped at a right end portion and a left end portion of the housing in a horizontal direction. The screen is on a front face of the housing. The control board controls the display device and is disposed at a position at which the control board does not overlap with the grip portions in a direction orthogonal to the screen.

An apparatus includes a motherboard with a processor socket, a load frame connected to the motherboard adjacent to at least two sides of the processor socket, and a processor retainer rotatably connected to the load frame, the processor retainer being positionable in a closed position, an opened position, and an installation position. The processor retainer extends over the processor socket when the processor retainer is in the closed position.

A mainboard mounting mechanism is provided for use with a chassis box, the chassis box defining an accommodating space, the mainboard mounting mechanism including: a tray; a positioning post, positioned in the mounting area; and a rod assembly, rotatably connected to the tray, wherein the rod assembly drives the tray to slide toward the positioning post so as for the mainboard to be at a disengagement position, and the rod assembly drives the tray to slide away from the positioning post for the mainboard to be at an engagement position.

A modular mounting for a computer motherboard. An outer cabinet is designed to provide a protective enclosure for electrical components, and designed to permit throughhole drilling to facilitate mounting on a wall while avoiding disturbance of contents to be mounted within the outer cabinet. A subpanel plate is designed to detachably and securely attach a computer motherboard and cage assembly, and designed to removably mount the motherboard and cage assembly within the outer cabinet as a modular component, mounting of the motherboard and cage assembly being independent of power supply and nonvolatile storage. An inner cage is designed to protectably mount and enclose a computer motherboard and heat sink, and mount to the subpanel plate. A multipole switch may have a set of contacts for each conductor of a network cable entering the outer cabinet, one throw of the switch connecting all conductors of the cable, another throw of the switch disconnecting all contacts of the cable.

The embodiments described herein describe technologies for memory systems. One implementation of a memory system includes a motherboard substrate with multiple module sockets, at least one of which is populated with a memory module. A first set of data lines is disposed on the motherboard substrate and coupled to the module sockets. The first set of data lines includes a first subset of point-to-point data lines coupled between a memory controller and a first socket and a second subset of point-to-point data lines coupled between the memory controller and a second socket. A second set of data lines is disposed on the motherboard substrate and coupled between the first socket and the second socket. The first and second sets of data lines can make up a memory channel.

An interactive information system includes: a first frame, a first interactive module arranged in the first frame, a second frame, a control module arranged in the second frame and configured to generate the GUI and to perform a function of the interactive information system based on the first user input; and a first internal cable connecting the first interactive module bridge board and the control module and configured to transmit the plurality of inter-frame signals between the first frame and the second frame. The first interactive module includes: a first display module configured to display a graphic user interface (GUI) of the interactive information system; a first touch input module configured to receive a first user input to the GUI; and a first interactive module bridge board configured to transmit a plurality of inter-frame signals comprising electrical signals of the first display module and the first touch input module.