An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.

The present disclosure provides a display substrate motherboard and a manufacturing method thereof, and a display device, wherein the display substrate motherboard includes a plurality of display units located on an organic substrate and a cutting region between adjacent display units, and the cutting region includes therein the organic substrate and an inorganic film layer covering the organic substrate.

In example implementations, a system board is provided. The system board includes a printed circuit board and an extended portion. The printed circuit board includes an electrical connection to a processor of a computing system. The extended portion is to redistribute power. The extended portion includes a connection to connect to a power supply unit and a plurality of power connections. The plurality of power connections are located along an edge of the extended portion to connect wiring to other components within the computing system and deliver power from the power supply unit to the other components.

A method of manufacturing a display substrate and a display substrate motherboard. The method of manufacturing the display substrate includes: providing a base substrate including a first main surface and a second main surface opposite to each other and divided into at least one active region and a dummy region located around the active region; forming a magnetic layer on at least one of the first main surface within the dummy region and the second main surface; and forming an element layer on the first main surface.

A circuit board is a circuit board on which a predetermined circuit unit that causes heat and electromagnetic noise is disposed, and which is to be fixed to a conductive housing with a conductive screw. The circuit board includes: an insulator layer including an insulating plate-shaped base material; a conductor layer having a circuit pattern including a ground portion, which is disposed on at least one surface of the insulator layer; and a screw insertion hole that penetrates the insulator layer and the ground portion, and through which the conductive screw is to be inserted. The ground portion has a slit disposed between the screw insertion hole and the predetermined circuit unit. The ground portion has a ground bridge that electrically connects a portion of the ground portion between the slit and the screw insertion hole and a portion of the ground portion between the slit and the predetermined circuit unit.

The invention provides a motherboard assembly. The motherboard assembly includes a circuit board, an expansion card connector, an expansion card assembly, a bracket and a fastener. The expansion card connector is disposed on the circuit board. The expansion card assembly includes a cage, an adapter card, and at least one expansion card. The adapter card is installed on the cage and includes an electrical connector. The electrical connector is inserted into the expansion card connector, and the expansion card is installed on the adapter card. The bracket includes a first mount plate and a second mount plate connected to each other. The first mount plate is fixed on the circuit board, and the second mount plate is located farther away from the circuit board than the first mount plate. The fastener is disposed through the cage and screwed into the second mount plate of the bracket.

A riser bracket for supporting a riser board and a computer card inserted into the riser board is disclosed. The riser bracket includes a first riser bracket piece, a first latch, a second riser bracket piece, and a second latch. The computer card and the riser board are positioned on a motherboard. The first riser bracket piece is configured to be coupled to the riser board. The first latch is configured to the first riser bracket piece to a first mounting point of the motherboard, and to move between a latched position and an unlatched position. The second riser bracket piece is coupled to the first riser bracket piece. The second latch is configured to couple the second riser bracket piece to a second mounting point of the motherboard, and move between a latched position and an unlatched position.

According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.

The disclosure provides a server including a housing, a plurality of Hash boards, a power module, a control module, a power supply module, and an electrical connection board. Each Hash board is disposed in the first accommodation cavity of the housing; the power module is disposed in the second accommodation cavity; the control module is slidably disposed in the third accommodation cavity; the power supply module is slidably disposed in the fourth accommodation cavity; the electrical connection board is disposed in the housing. The plurality of Hash boards, the power module, the control module, and the power supply module are all connected to the electrical connection board; the power module supplies power to the plurality of Hash boards via the electrical connection board, and the power supply module supplies power to the control module via the electrical connection board.

A synergistic composition can be used to treat water containing nitrogen compounds and phosphorus compounds. The synergistic composition includes iron filings, clay particles, aluminum particles, and sand particles. The iron filings, clay particles, and aluminum particles act synergistically to remove nitrogen compounds and phosphorus compounds from water. Specifically, the clay particles attract the nitrogen compounds and the phosphorus compounds to be absorbed onto a surface of the iron filings and the clay particles. The aluminum particles react with the nitrogen compounds via an oxidation reaction to form ammonia compounds, and react with the phosphorus compounds to produce aluminum phosphate. As such, the synergistic relationship between the iron filings, clay particles, and aluminum particles remove nitrogen and phosphorus compounds from water and recover the compounds in usable forms, namely, ammonia and aluminum phosphate.