An add-in module is provided. The add-in module includes a substrate, a plurality of first heat sources, a plurality of second heat sources, a heat sink and a heat-dissipation plate. The substrate includes a first substrate surface and a second substrate surface. The first substrate surface is opposite the second substrate surface. The first heat sources are disposed on the first substrate surface. The second heat sources are disposed on the second substrate surface. The heat sink corresponds to the first substrate surface and is thermally connected to the first heat sources, wherein the heat sink includes a heat-sink base and a plurality of heat-dissipation fins, and the heat-dissipation fins are connected to the heat-sink sink base. The heat-dissipation plate corresponds to the second substrate surface and is thermally connected to the second heat sources.

A memory device includes a device housing, a memory module, and a cooling unit. The memory module is disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing. The cooling unit is thermally connected to the device housing to dissipate some of the heat. The cooling unit includes a unit housing and a working fluid. An interior space is formed in the unit housing. The working fluid is disposed in the interior space, wherein some of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid.

A system, information handling system and method are disclosed for accommodating multiple devices in a single bay. A bracket comprises a pair of sidewalls adapted for slidable insertion in slots in a bay. An upper portion of the bracket comprises inner walls formed with slots and a lower portion formed with flanges. A tray formed with rails on exterior surfaces may be inserted in the slots in the inner walls of the bracket. A first SFF device or devices may be positioned in the tray and a second SFF device may be positioned in the flanges to install multiple SFF devices in the bay.

An information handling system EMI shield system couples to a circuit board to enclose an electronic device in a Faraday cage and includes a surface painted with a graphene paint to aid in dissipation of excess thermal energy from the electronic device. The EMI shield system has a frame that couples to the circuit board and interfaces with ground to define a boundary around an electronic device connector and has a shield that couples as a separate piece over the frame to enclose the electronic device. Graphene paint applied to some or all of the shield encourages rejection of excess thermal energy from within shield.

The present invention discloses an electronic device and a cable organizing assembly. The electronic device includes a main structure with a body and the cable organizing assembly. The body has a penetration hole passing through the body and extends from a bottom surface to form a wall having a notch. The cable organizing assembly includes a cable fastening member fixed at the wall and correspondingly sealing the notch. The cable fastening member includes multiple cable grooves for fastening at least one cable. The central axis of each cable groove is not parallel to the central axis of the penetration hole. Cables pass through the penetration hole from one side of a top surface, become bent, and are fixed on one side of the bottom surface of the body by the cable organizing assembly. Thus, a liquid from the exterior is unlikely to enter along the cables into the interior.

A multi-board mid-plane includes a disk backplane board (DBB) having a front side and a rear side. Venting holes are provided within the DBB extending between the front side of the DBB and the rear side of the DBB. The multi-board mid-plane also includes a controller backplane board (CBB) having a front side and a rear side. The front side of the CBB includes venting holes provided within the CBB extending between the front side of the CBB and the rear side of the CBB. A top fabric plane board (TFPB) and a bottom fabric plane board (BFPB) are provided for connecting the DBB with the CBB. A combination of the DBB and the CBB has a venting ratio that is equal to a lower of the venting ratio of the DBB and the venting ratio of the CBB.

An information handling system supports multi-radio and multi-antenna wireless communication by routing coaxial cables between the radios and antennas through a cable clip of a conductive material coupled to system ground and interfaced with the coaxial cable ground sheath through an opening formed in the coaxial cable outer casing. A current source of the radio frequency applies a current in phase with the radio signal to the coaxial cable outer casing to suppress crosstalk with coaxial cables of different frequencies.

An apparatus is provided for the simultaneous transferring of multiple storage devices from a chassis to reduce service time and associated server temperature fluctuations. The storage transfer device may be mounted to a chassis with a multitude of electronic devices, e.g., a JBOD with HDDs, above the devices to be removed. The storage device may then be manipulated to mechanically unlatch the devices from the chassis and simultaneously attach the devices to the transfer device. The devices may then be disconnected and withdrawn from the chassis and pulled into the storage transfer device. The devices may be re-installed later using the storage device and the reverse process.

A chassis includes a chassis body and a support, and the chassis body has a channel that passes through a first end and a second end that are of the chassis body. The support is slidably disposed in the channel. The support is provided with a first accommodation compartment, a fan compartment, and a second accommodation compartment that are successively disposed along a direction from a first end of the channel to a second end of the channel. The first accommodation compartment is capable of sliding out of the chassis body from the first end, and the second accommodation compartment is capable of sliding out of the chassis body from the second end. The fan compartment is configured to accommodate a heat dissipation fan.

A chassis includes a chassis body and an installation frame, and the chassis body has a channel that passes through a first end and a second end that are of the chassis body. The installation frame is slidably disposed in the channel of the chassis body. The installation frame has a first part facing the first end of the chassis body and a second part facing the second end of the chassis body; and the first part is capable of sliding out from the first end of the chassis body, and the second part is capable of sliding out from the second end of the chassis body.