An electromagnetic connector is disclosed that is configured to form a first magnetic circuit portion comprising a first core member and a first coil disposed of the first core member. The electromagnetic connector is configured to mate with a second electromagnetic connector, where the second electromagnetic connector is configured to form a second magnetic circuit portion comprising a second core member and a second coil disposed of the second core member. The first core member and the second core member are configured to couple the first coil to the second coil with a magnetic circuit formed from the first magnetic circuit portion and the second magnetic circuit portion when the electromagnetic connector is mated with the second electromagnetic connector. The magnetic circuit is configured to induce a signal in the first coil when the second coil is energized.

A method for providing composite cognitive insights comprising receiving streams of data from a plurality of data sources; processing the streams of data from the plurality of data sources, the processing the streams of data from the plurality of data sources performing data enriching and generating a sub-graph for incorporation into a cognitive graph; processing the cognitive graph, the processing the cognitive graph providing a plurality of individual cognitive insights; and, generating a composite cognitive insight, the composite cognitive insight being composed of the plurality of individual cognitive insights.

The embodiments herein describe a 3D SmartNIC that spatially distributes compute, storage, or network functions in three dimensions using a plurality of layers. That is, unlike current SmartNIC that can perform acceleration functions in a 2D, a 3D Smart can distribute these functions across multiple stacked layers, where each layer can communicate directly or indirectly with the other layers.

A cross-network bridging apparatus includes a bus interface and bridging circuitry. The bus interface is configured for connecting to a system bus. The bridging circuitry is configured to translate between (i) system-bus transactions that are exchanged between one or more local devices that are coupled to the system bus and served by the system bus and one or more remote processors located across a network from the apparatus, and (ii) data units that convey the system-bus transactions, for transmitting and receiving as network packets over the network to and from the remote processors.

An interconnect interface is applied between sockets or between dies. The interconnect interface includes a first transmitter (TX), a first receiver (RX), and an electrical physical layer (EPHY) coupled between the first TX and the first RX. The data provided by a first device is transmitted from the first TX to the EPHY and then received by the first RX to be retrieved by a second device. The first TX includes an arbiter for arbitrating between a plurality of channels of the first device to obtain data from the first device. The first TX includes a packet generator, which packs the data obtained from the first device into a packet to be transmitted through the EPHY. The first TX further includes a first buffer that backs up the data obtained from the first device for retransmission.

A interconnect system, including a plurality of sockets and a first interconnect interface. Any two of the sockets are accessible to each other's hardware resources by transmitting a first packet and a second packet through the first interconnect interface. The first packet includes first interconnect information, used for establishing communication between the two sockets. The second packet includes a first data payload, loaded from one of the two sockets. The sockets include a first socket and a second socket, configured to be interconnected with each other through the first interconnect interface.

A method, system and computer-usable medium for providing cognitive insights comprising receiving streams of data from a plurality of data sources; processing the streams of data from the plurality of data sources, the processing the streams of data from the plurality of data sources performing data enriching to provide enriched data; generating the cognitive session graph, the cognitive session graph being associated with a session, the cognitive session graph comprising at least some enriched data; and, processing the cognitive session graph to provide a cognitive insight, the cognitive insight being related to the session.

The application relates to a processing device (100) including a buffer (102) coupled to a system bus, a ciphering device coupled to the system bus, and a memory coupled to the ciphering device. The processing device is configured to operate in at least one of a deciphering mode and a ciphering mode. In the deciphering mode, the ciphering device is configured to receive a ciphered data unit directly from the buffer over the system bus, decipher the ciphered data unit so as to obtain a deciphered data unit, and transfer the deciphered data unit to the memory. In the ciphering mode, the ciphering device is configured to receive a data unit from the memory, cipher the data unit so as to obtain a ciphered data unit, and transfer the ciphered data unit directly to the buffer over the system bus.

A building management system includes a communications bus, and devices coupled to the communications bus. The devices are coupled to the communications bus and configured to communicate on the communications bus using a master-slave token passing protocol. A first one of the devices has an active node table stored therein. The active node table includes multiple nodes. Each node represents one of the devices participating in a token passing ring used to exchange information among the devices via the communications bus using the master-slave token passing protocol. The first device is configured to monitor the active node table for new nodes and to identify a new device communicating on the communications bus in response to a determination that the active node table includes a new node.

A multi-package system includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first die and a second die. The second semiconductor package includes a third die. A first processing circuit of the first die communicates with a second processing circuit of the second die through a first configurable input/output (IO) interface circuit of the first die and a third configurable IO interface circuit of the second die that are configured to perform single-ended intra-package communication. The first processing circuit of the first die communicates with a third processing circuit of the third die through a second configurable IO interface circuit of the first die and a fourth configurable IO interface circuit of the third die that are configured to perform differential inter-package communication. The first configurable IO interface circuit and the second configurable IO interface circuit have a same circuit design.