There is provided a capacitive fingerprint sensing device for sensing a fingerprint pattern of a finger, the capacitive fingerprint sensor comprising: a protective dielectric top layer to be touched by the finger; a two-dimensional array of electrically conductive sensing structures arranged underneath the top layer; readout circuitry coupled to each of the electrically conductive sensing structures to receive a sensing signal indicative of a distance between the finger and the sensing structure, the readout circuitry comprising a plurality of signal amplifiers arranged underneath the array of electrically conductive sensing structures, wherein a number of signal amplifiers is lower than a number of sensing structures; and selection circuitry coupling each of the sensing structures to at least one signal amplifier and configured to select a sensing structure to be coupled to a corresponding signal amplifier. There is also provided a method for controlling a fingerprint sensing device.

A fingerprint sensor package includes a substrate, a fingerprint sensor chip, and a flexible printed circuit board (FPC). The substrate includes a first portion and a second portion. A line layer is disposed on the first portion. The fingerprint sensor chip is disposed on the substrate. The fingerprint sensor chip is electrically connected to the FPC by the line layer. The package is simple, reliable, and easy for manufacturing process, reducing materials and processing costs.

A fingerprint sensor and a display device include a substrate. A circuit element layer is disposed on a first surface of the substrate and includes a semiconductor layer, conductive layers and at least one opening portion. A light emitting element layer is disposed on the circuit element layer and includes at least one light emitting element. A sensor layer is disposed on a second surface of the substrate and includes at least one light sensor corresponding to the opening portion. The opening portion is defined by non-overlapping of the semiconductor layer and the conductive layers, the opening portion has a closed loop shape in plan view, and at least a portion of the closed loop shape includes a curve, or an internal angle of the at least a portion of the closed loop shape is an obtuse angle.

A through silicon via chip and manufacturing method thereof are provided, where the through silicon via chip includes a silicon substrate, the silicon substrate is provided with a via, the via is an oblique via, and a backfill structure layer is disposed in the via. According to the through silicon via chip and manufacturing method thereof, a fingerprint identification sensor and a terminal device, a backfill structure is added in an oblique via to play a supportive role when a force is exerted on a surface of the through silicon via chip, which avoids a fracture of the through silicon via chip, thereby enhancing structural strength of the through silicon via chip.

Provided is a fingerprint sensor package including a first substrate including first bonding pads and an external connection pad, a second substrate attached to the first substrate, the second substrate including a plurality of first sensing patterns spaced apart from each other in a first direction and extending in a second direction intersecting the first direction, a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction, second bonding pads, and test pads, conductive wires electrically connecting the first bonding pads and the second bonding pads, a controller chip connected to the second substrate, and a molding layer covering the controller chip and the second substrate and in contact with the first bonding pads, the second bonding pads, the test pads, and the conductive wires.

An all-flat sensor includes a coupling substrate; a sensing chip, which is disposed on the coupling substrate, has first electrodes arranged in an array and a first dielectric layer covering over the first electrodes, and is electrically connected to the coupling substrate; and a second dielectric layer covering over the sensing chip and providing an outlook color. An electronic device using the all-flat sensor is also provided.

A fingerprint sensor is provided. The fingerprint sensor includes a multi-layer printed circuit board (PCB), a fingerprint sensing die and a molding compound. The multi-layer PCB includes a bottom dielectric layer, at least one intermediate dielectric layer disposed on the bottom dielectric layer, a top dielectric layer disposed on the intermediate dielectric layer and a trench. The trench is formed by digging out a portion of the intermediate dielectric layer and a portion of the top dielectric layer. The fingerprint sensing die is disposed in the trench of the multi-layer PCB and mounted on an upper surface of the bottom dielectric layer of the multi-layer PCB. The fingerprint sensing die includes a sensing array capable of sensing fingerprint information of a user. The fingerprint sensing die is covered by the molding compound, and the trench of the multi-layer PCB is filled with the molding compound.

A capacitive fingerprint sensing device and method therein for noise detection are disclosed. The capacitive fingerprint sensing device comprises a plurality of sensing elements, each comprising a sensing structure and configured to sense a capacitive coupling between the sensing structure and a finger. The fingerprint sensing device further comprises sensing circuitry and timing circuitry configured to control a timing of a drive signal. The fingerprint sensing device is controllable to operate in a noise-detection mode and in a fingerprint mode. In the noise-detection mode, the fingerprint sensing device is configured to control the timing circuitry such that no drive signal is provided. The fingerprint sensing device senses a capacitive coupling between the finger and at least one sensing structure and provides a sensing signal indicative of the capacitive coupling between the finger and the sensing structures by means of said sensing circuitry.

A detection device includes a sensor area provided with a plurality of detection elements each comprising a photoelectric conversion element in a detection area, and a detector configured to detect a potential difference between a voltage generated in a first detection element and a voltage generated in a second detection element adjacent to the first detection element in the detection area.

Disclosed are a chip package capable of improving the strength of a package and simplifying a manufacturing process and a manufacturing method therefor. This invention may improve the durability of the package by further forming a reinforcing layer on a chip by using an adhesive layer and molding the chip and the reinforcing layer so as to be integrated by using a molding layer. Also, the strength of the package may be improved by having a structure in which solder balls are formed between a base substrate and a re-wiring layer and integrated with the molding layer, and a wiring layer may be formed directly on the molding layer by using polyimide (PI) as the molding layer without using a separate insulating layer formed on the molding layer as in the conventional art.