A nonvolatile memory device includes a semiconductor substrate, a memory array region including a plurality of word lines formed linearly along a plane having a height (h1), a plurality of linear bit lines formed linearly along a plane having a height (h2) in a direction intersecting the plurality of word lines, and a plurality of memory cells provided between an intersection portion of each of the plurality of word lines with the plurality of bit lines and each of the plurality of bit lines, and a peripheral circuit region including a plurality of linear electrodes formed linearly along a plane having a height (h1), a plurality of linear electrodes formed linearly along a plane having the height (h2) in a direction intersecting the plurality of linear electrodes, and an insulators provided at least between the plurality of linear electrodes and the plurality of linear electrodes.

Apparatuses and methods for driving word driver lines in a gradual manner are disclosed herein. Word driver lines may be driven to intermediate potentials between high and low potentials. In some examples, the word driver lines may be driven in a step-wise manner. In some examples, the intermediate potential may be a bias voltage. The bias voltage may be provided by a bias voltage generator. One or more enable signals may be used to control the driving of the word driver line. In some examples, an address signal may be used to control the driving of the word driver line. Driving the word driver line in a gradual manner may cause a word line to discharge in a gradual manner in some examples.

According to one embodiment, a memory device includes a memory cell array; a generation circuit generating a reference current; a sense amplifier comparing a cell current flowing through a memory cell with the reference current; a first clamp transistor connected between the sense amplifier and the memory cell; a second clamp transistor connected between the sense amplifier and the generation circuit; a first interconnect layer connected to a gate of the first clamp transistor; a second interconnect layer connected to a gate of the second clamp transistor and arranged adjacent to the first interconnect layer; and a first shield line arranged adjacent to one of the first interconnect layer and the second interconnect layer, a fixed voltage being applied to the first shield line.

According to one embodiment, a memory device includes a first address memory storing a first address; a controller which is based on a first interface which transmits a signal serially and outputs a first command in accordance with the first interface; and a memory which stores data in a nonvolatile manner, is based on the first interface, and stores received write data in an address based on the first address when the memory receives the first command.

A semiconductor storage device has a non-volatile memory, a memory controller to carry out write processing to the non-volatile memory using a write pulse, and a write pulse controller to select one of a first write mode for writing to the non-volatile memory and a second write mode for writing to the non-volatile memory with higher electric power consumption than the first write mode at higher speed than the first write mode and, when the first write mode is selected, set a pulse width of the write pulse such that the pulse width is shorter than one cycle of a clock signal used to control access to the non-volatile memory,

Examples disclosed herein relate to dual in-line memory module (DIMM) battery backup. Some examples disclosed herein describe systems that include a backup power source pluggable into a DIMM slot. The backup power source may include a plurality of battery cells electrically connected to a DIMM to provide backup power to the DIMM. Each of the plurality of battery cells supporting the DIMM may be electrically connected to a DC-to-DC converter in series and to each other in parallel.

Disclosed is a memory device including a magnetic memory element. The memory device includes a memory cell array including a first region and a second region, the second region configured to store a value of a write voltage, the write voltage based on a value of a reference resistor for determining whether a programmed memory cell is in a parallel state or anti-parallel state, a voltage generator configured to generate a code value based on the value of the write voltage, and a write driver configured to drive a write current based on the code value, the write current being a current for storing data in the first region.

Embodiments of the present disclosure are directed toward probabilistic in-memory computing configurations and arrangements, and configurations of probabilistic bit devices (p-bits) for probabilistic in-memory computing. concept with emerging. A probabilistic in-memory computing device includes an array of p-bits, where each p-bit is disposed at or near horizontal and vertical wires. Each p-bit is a time-varying resistor that has a time-varying resistance, which follows a desired probability distribution. The time-varying resistance of each p-bit represents a weight in a weight matrix of a stochastic neural network. During operation, an input voltage is applied to the horizontal wires to control the current through each p-bit. The currents are accumulated in the vertical wires thereby performing respective multiply-and-accumulative (MAC) operations. Other embodiments may be described and/or claimed.

Systems, methods, and apparatus are provided for tuning a memristive property of a device. The device (500) includes a layer of a dielectric material (507) disposed over and forming an interface with a layer of an electrically conductive material (506), and a gate electrode (508) disposed over the dielectric material. The dielectric material layer includes at least one ionic species (302) having a high ion mobility. The electrically conductive material is configured such that a potential difference applied to the device can cause the at least one ionic species to migrate reversibly across the interface into or out of the electrically conductive material layer, to modify the resistive state of the electrically conductive material layer.

A memory cell (101) is connected to a word line (WL), a bit line (BL), and a power supply line (PL), and includes a flip-flop storing data based on a change in resistance value of a magnetic tunnel junction element, and, a power gating field-effect transistor including a drain that is one end of a current path connected to the power supply line, and which has another end connected to the flip-flop. The ON and OFF states of the power gating field-effect transistor are controlled based on a control signal applied to a control terminal of the power gating field-effect transistor.