Methods, systems, and devices for grouping power supplies for a power saving mode are described to configure a memory device with groups of internal power supplies whose voltage levels may be successively modified according to a group order signaled by an on-die timer. For example, when the memory device enters a deep sleep mode, respective voltage levels of a first group of internal power supplies may be modified to respective external power supply voltage levels at a first time, respective voltage levels of a second group of internal power supplies may be modified to respective external power supply voltage levels at a second time, and so on. When the memory device exits the deep sleep mode, the groups of internal voltage supplies may be modified from the respective external power supply voltage levels to respective operational voltage levels in a group order that is opposite to the entry group order.

Methods, systems, and devices for power distribution for stacked memory are described. A memory die may be configured with one or more conductive paths for providing power to another memory die, where each conductive path may pass through the memory die but may be electrically isolated from circuitry for operating the memory die. Each conductive path may provide an electronic coupling between at least one of a first set of contacts of the memory die (e.g., couplable with a power source) and at least one of a second set of contacts of the memory die (e.g., couplable with another memory die). To support operations of the memory die, a contact of the first set may be coupled with circuitry for operating a memory array of the memory die, and to support operations of another memory die, another contact of the first set may be electrically isolated from the circuitry.

A system on chip (SOC) integrated circuit device having an incorporated ferroelectric memory configured to be selectively refreshed, or not, depending on different operational modes. The ferroelectric memory is formed of an array of ferroelectric memory elements (FMEs) characterized as non-volatile, read-destructive semiconductor memory cells each having at least one ferroelectric layer. The FMEs can include FeRAM, FeFET or FTJ constructions. A read/write circuit writes data to the FMEs and subsequently reads back data from the FMEs responsive to respective write and read signals supplied by a processor circuit of the SOC. A refresh circuit is selectively enabled in a first normal mode to refresh the FMEs after a read operation, and is selectively disabled in a second exception mode so that the FMEs are not refreshed after a read operation. The FMEs can be used as a main memory, a cache, a buffer, an OTP, a keystore, etc.

A memory is provided which comprises a capacitor including non-linear polar material. The capacitor may have a first terminal coupled to a node (e.g., a storage node) and a second terminal coupled to a plate-line. The capacitors can be a planar capacitor or non-planar capacitor (also known as pillar capacitor). The memory includes a transistor coupled to the node and a bit-line, wherein the transistor is controllable by a word-line, wherein the plate-line is parallel to the bit-line. The memory includes a refresh circuitry to refresh charge on the capacitor periodically or at a predetermined time. The refresh circuit can utilize one or more of the endurance mechanisms. When the plate-line is parallel to the bit-line, a specific read and write scheme may be used to reduce the disturb voltage for unselected bit-cells. A different scheme is used when the plate-line is parallel to the word-line.

A voltage regulator receives an input voltage and produces a regulated output voltage. A first feedback network compares a feedback signal to a reference signal to assert/de-assert a first pulsed control signal when the reference signal is higher/lower than the feedback signal. A second feedback network compares the output voltage to a threshold signal to assert/de-assert a second control signal when the threshold signal is higher/lower than the output voltage. A charge pump is enabled if the second control signal is de-asserted and is clocked by the first pulsed control signal to produce a supply voltage higher than the input voltage. A first pass element is enabled when the second control signal is asserted and is selectively activated when the first pulsed control signal is asserted. A second pass element is selectively activated when the second control signal is de-asserted.

Tracking circuitry for a memory device is disclosed. The tracking circuitry includes an inverter, a level shifter, delay circuitry, and a logic gate. The inverter is configured to receive a first clock signal and generate an inverted clock signal. The level shifter is configured to receive the first clock signal and the inverted clock signal and generate a level shifted clock signal. The delay circuitry is configured to receive the level shifted clock signal and generate an inverted level shifted clock signal. The logic gate comprises a first input configured to receive the first clock signal and a second input configured to receive the inverted level shifted clock signal. The logic gate is configured to generate a second clock signal based on the first clock signal and the inverted level shifted clock signal.

Methods, systems, and devices for die voltage regulation are described. A device may include a first die and second die. A component that generates voltage on the first die may be connected to a capacitor on the second die through a conductive line. The conductive line may allow the capacitor on the second die to regulate voltage generated by the component on the first die.

Methods, systems, and devices for signal development caching in a memory device are described. In one example, a memory device in accordance with the described techniques may include a memory array, a sense amplifier array, and a signal development cache configured to store signals (e.g., cache signals, signal states) associated with logic states (e.g., memory states) that may be stored at the memory array (e.g., according to various read or write operations). In various examples, accessing the memory device may include accessing information from the signal development cache, or the memory array, or both, based on various mappings or operations of the memory device.

Methods, systems, and devices for power gating in a memory device are described for using one or more memory cells as drivers for load circuits of a memory device. A group of memory cells of the memory device may represent memory cells that include a switching component and that omit a memory storage element. These memory cells may be coupled with respective plate lines that may be coupled with a voltage source having a first supply voltage. Each memory cell of the group may also be coupled with a respective digit line that may be coupled with the load circuits. Respective switching components of the group of memory cells may therefore act as drivers to apply the first supply voltage to one or more load circuits by coupling a digit line with a plate line having the first supply voltage.

This application relates to the field of storage technologies and discloses a content addressable memory, a data processing method, and a network device, to resolve a problem that an existing CAM has a relatively large area, and consumes relatively large power. The CAM includes bit units of M rows and N columns, each bit unit includes a first FeFET and a second FeFET, a source of the first FeFET is connected to a drain of the second FeFET, a source of the second FeFET is grounded, bit cells of a same column correspond to a same match line, and a drain of a first FeFET in each bit cell of a same column is connected to a match line corresponding to the column. Bit cells of a same row correspond to a same first bit line and a same second bit line, a gate of a first FeFET in each bit cell of a same row is connected to a first bit line corresponding to the row, and a gate of a second FeFET in each bit cell of a same row is connected to a second bit line corresponding to the row. The CAM may be applied to a network device such as a router.