The present application provides a memory test circuit and a device wafer including the memory test circuit. The memory test circuit is coupled to a memory array having intersecting first and second signal lines, and includes a fuse element and a transistor. The fuse element has a first terminal coupled to a first group of the first signal lines and a test voltage, and has a second terminal coupled to second and third groups of the first signal lines. The transistor has a source/drain terminal coupled to the second terminal of the fuse element and another source/drain terminal coupled to a reference voltage. The first group of the first signal lines are selectively coupled to the test voltage when the transistor is turned on, and all of the first signal lines are coupled to the test voltage when the transistor is kept off.

A semiconductor memory includes storage arrays, at least one verification module and gating circuits. Each verification module corresponds to multiple storage arrays. The verification module is configured to verify whether an error occurs in data information of the corresponding storage arrays. Each verification module is connected to a group of global data buses. The gating circuits are respectively connected to the storage arrays and the global data buses, and the gating circuits are configured to control on and off of a data transmission path connecting the global data buses to the storage arrays.

Embodiments of three-dimensional (3D) memory devices with embedded dynamic random-access memory (DRAM) and methods for forming the 3D memory devices are disclosed. In an example, a method for operating a 3D memory device is disclosed. The 3D memory device includes an input/output circuit, an array of embedded DRAM cells, and an array of 3D NAND memory strings in a same chip. Data is transferred through the input/output circuit to the array of embedded DRAM cells. The data is buffered in the array of embedded DRAM cells. The data is stored in the array of 3D NAND memory strings from the array of embedded DRAM cells.

Three-dimensional (3D) memory devices with 3D phase-change memory (PCM) and methods for forming and operating the 3D memory devices are disclosed. In an example, a 3D memory device includes a first semiconductor structure including an array of NAND memory cells, and a first bonding layer including first bonding contacts. The 3D memory device also further includes a second semiconductor structure including a second bonding layer including second bonding contacts, a semiconductor layer and a peripheral circuit and an array of PCM cells between the second bonding layer and the semiconductor layer. The 3D memory device further includes a bonding interface between the first and second bonding layers. The first bonding contacts are in contact with the second bonding contacts at the bonding interface.

A memory controller for accessing a memory, comprises a holding circuit which holds a plurality of read or write access requests from a bus master, a read/write control circuit which selects one of the access requests in the holding circuit and issues a read command or a write command; and an active control circuit which selects the access request held in the holding circuit and issues an active command, wherein the active control circuit includes a generation circuit that generates number of activated read commands and number of activated write commands, and a selection circuit that, when the number of activated read commands is not less a threshold, issues the active command of an read access, and when the number of activated write commands is not less than the threshold, issues the active command of a write access.

Disclosed herein are memory cells and memory arrays, as well as related methods and devices. For example, in some embodiments, a memory device may include: a support having a surface; and a three-dimensional array of memory cells on the surface of the support, wherein individual memory cells include a transistor and a capacitor, and a channel of the transistor in an individual memory cell is oriented parallel to the surface.

Memory devices having electro-optical substrates are described herein. In one embodiment, a memory device includes a plurality of memories carried by an electro-optical substrate. The electro-optical substrate can include a circuit board and an optical routing layer on the circuit board. The memories can be (a) electrically coupled to the circuit board and (b) optically coupled to the optical routing layer. In some embodiments, the optical routing layer is a polymer waveguide.

Memory devices having electro-optical substrates are described herein. In one embodiment, a memory device includes a plurality of memories carried by an electro-optical substrate. The electro-optical substrate can include a circuit board and an optical routing layer on the circuit board. The memories can be (a) electrically coupled to the circuit board and (b) optically coupled to the optical routing layer. In some embodiments, the optical routing layer is a polymer waveguide.

A comparison circuit includes a comparison module, a state judgment module and a state storage module. The comparison module includes a first input end connected to a voltage to be measured and a second input end connected to a reference voltage. The state judgment module includes a first input end connected to a first output end of the comparison module and a second input end connected to a second output end of the comparison module. The state storage module includes an input end connected to the first output end of the comparison module and an enable end connected to an output end of the state judgment module. The embodiments of the disclosure may improve processing efficiency of the comparison circuit.

A comparison circuit includes a comparison module, a state judgment module and a state storage module. The comparison module includes a first input end connected to a voltage to be measured and a second input end connected to a reference voltage. The state judgment module includes a first input end connected to a first output end of the comparison module and a second input end connected to a second output end of the comparison module. The state storage module includes an input end connected to the first output end of the comparison module and an enable end connected to an output end of the state judgment module. The embodiments of the disclosure may improve processing efficiency of the comparison circuit.