A 3D device, the device including: at least a first level including logic circuits; at least a second level including an array of memory cells; at least a third level including special circuits; and at least a fourth level including special connectivity structures, where the special connectivity structures include one of the following: a. waveguides, or b. differential signaling, or c. radio frequency transmission lines, or d. Surface Waves Interconnect (SWI) lines, and where the third level includes Radio Frequency (“RF”) circuits to drive the special connectivity structures, where the second level overlays the first level, where the third level overlays the second level, and where the fourth level overlays the third level.

According to one embodiment, a memory system includes a semiconductor memory device and a controller. The semiconductor memory device includes a first memory cell configured to store data. The controller is configured to output a first parameter and a first command. The first parameter relates to an erase voltage for a first erase operation with respect to the first memory cell. The first command instructs the first erase operation. The controller outputs the first command after outputting the first parameter to the semiconductor memory device.

A non-volatile memory device is provided. The non-volatile memory device may include a memory cell array, a first pumping circuit configured to output a first pumping voltage, a second pumping circuit configured to pump the first pumping voltage of the first pumping circuit to output a second pumping voltage, and a pumping circuit control unit which is connected to the first pumping circuit and the second pumping circuit and configured to output at least one of the first pumping voltage and the second pumping voltage to the memory cell array. The first pumping circuit may be enabled in a first mode and a second mode different from the first mode, and the second pumping circuit may be disabled or not enabled in the first mode and enabled in the second mode.

Various examples described herein are directed to systems and methods for generating data values using a NAND flash array. A memory controller may read a number of memory cells at the NAND flash array using an initial read level to generate a first raw string. The memory controller may determine that a difference between a number of bits from the first raw string having a value of logical zero and a number of bits from the first raw string having a value of logical one is greater than a threshold value and read the number of memory cells using a second read level to generate a second raw string. The memory controller may determine that a difference between a number of bits from the second raw string having a value of logical zero and a number of bits from the second raw string having a value of logical one is not greater than a threshold value and applying a cryptographic function using the second raw string to generate a first PUF value.

There are provided a memory controller and a memory system having the same. The memory controller includes: a central processing unit configured to output a read command for checking an erase state of a selected storage region in response to a program request from a host, determine the number of dummy pages according to the erase state, and output a program command according to the number of dummy pages; and a memory interface configured to, when user data corresponding to the program request is output to the selected storage region, selectively generate dummy data corresponding to the number of dummy pages, and output the dummy data with the user data.

A flash memory cell includes a rectifying device and a transistor. The rectifying device has an input end coupled to a bit line. The transistor has a charge storage structure. The transistor has a first end coupled to an output end of the rectifying device, the transistor has a second end coupled to a source line, and a control end of the transistor is coupled to a word line.

A nonvolatile memory device includes a memory cell array having cell strings that each includes memory cells stacked on a substrate in a direction perpendicular to the substrate. A row decoder is connected with the memory cells through word lines. The row decoder applies a setting voltage to at least one word line of the word lines and floats the at least one word line during a floating time. A page buffer circuit is connected with the cell strings through bit lines. The page buffer senses voltage changes of the bit lines after the at least one word line is floated during the floating time and outputs a page buffer signal as a sensing result. A counter counts a number of off-cells in response to the page buffer signal. A detecting circuit outputs a detection signal associated with a defect cell based on the number of off-cells.

A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to one of a plurality of word lines including at least one edge word line and a plurality of other data word lines. The memory cells are arranged in strings and configured to retain a threshold voltage corresponding to one of a plurality of data states. The memory apparatus also includes a control means coupled to the plurality of word lines and the strings. The control means is configured to identify the at least one edge word line. The control means is also configured to periodically apply a program voltage to the at least one edge word line to reprogram the memory cells associated with the at least one edge word line without erasing the memory cells associated with the at least one edge word line.

A semiconductor storage device includes memory cells, select transistors, memory strings, first and second blocks, word lines, and select gate lines. In the memory string, the current paths of plural memory cells are connected in series. When data are written in a first block, after a select gate line connected to the gate of a select transistor of one of the memory strings in the first block is selected, the data are sequentially written in the memory cells in the memory string connected to the selected select gate line. When data are written in the second block, after a word line connected to the control gates of memory cells of different memory strings in the second block is selected, the data are sequentially written in the memory cells of the different memory strings in the second block which have their control gates connected to the selected word line.

NOR memory strings may be used for implementations of logic functions involving many Boolean variables, or to generate analog signals whose magnitudes are each representative of the bit values of many Boolean variables. The advantage of using NOR memory strings in these manners is that the logic function or analog signal generation may be accomplished within one simultaneous read operation on the NOR memory strings.