Patent classifications
G11C2013/0042
NONVOLATILE MEMORY DEVICE INCLUDING RESISTIVE MEMORY CELLS
A nonvolatile memory device comprises: resistive memory cells each of which takes either a variable state or an initial state, the resistive memory cells including at least one resistive memory cell in the initial state; and a read circuit that comprising a resistance detection circuit that obtains resistance value information of the at least one resistive memory cell, and a data generation circuit that generates digital data corresponding to the resistance value information. The resistance detection circuit applies a second read voltage to the at least one resistive memory cell to obtain the resistance value information. The second read voltage is larger than a first read voltage and smaller than a voltage of a forming pulse that is an electrical stress for changing from the initial state to the variable state. The first read voltage is for reading a resistive memory cell in the variable state.
Sense amplifier local feedback to control bit line voltage
Methods for precharging bit lines using closed-loop feedback are described. In one embodiment, a sense amplifier may include a bit line precharge circuit for setting a bit line to a read voltage prior to sensing a memory cell connected to the bit line. The bit line precharge circuit may include a first transistor in a source-follower configuration with a first gate and a first source node electrically coupled to the bit line. By applying local feedback from the first source node to the first gate, the bit line settling time may be reduced. In some cases, a first voltage applied to the first gate may be determined based on a first current drawn from the first bit line. Thus, the first voltage applied to the first gate may vary over time depending on the conductivity of a selected memory cell connected to the bit line.
Apparatus to reduce retention failure in complementary resistive memory
Described is an apparatus which comprises: a complementary resistive memory bit-cell; and a sense amplifier coupled to the complementary resistive memory bit-cell, wherein the sense amplifier includes: a first output node; and a first transistor which is operable to cause a deterministic output on the first output node.
MEMORY SENSE AMPLIFIER WITH PRECHARGE
A memory device includes a memory cell and a sense amplifier. The sense amplifier has a reference circuit configured to output a reference voltage and a sensing circuit connected to the memory cell. A comparator includes a first input and a second input, with the first input connected to the reference circuit to receive the reference voltage, and the second input connected to the memory cell. A precharger is configured to selectively precharge the sensing circuit to a predetermined precharge voltage
Memory cell including multi-level sensing
An embodiment of a semiconductor apparatus may include technology to convert an analog voltage level of a memory cell of a multi-level memory to a multi-bit digital value, and determine a single-bit value of the memory cell based on the multi-bit digital value. Some embodiments may also include technology to track a temporal history of accesses to the memory cell for a duration in excess of ten seconds, and determine the single-bit value of the memory cell based on the multi-bit digital value and the temporal history. Other embodiments are disclosed and claimed.
Resistance change memory
According to one embodiment, a resistance change memory includes a memory cell, a reference voltage generating circuit, a first transistor and a sense amplifier. The memory cell includes a resistance change element. The reference voltage generating circuit generates a reference adjustment voltage. The first transistor provides a reference current in accordance with the reference adjustment voltage. The sense amplifier compares a cell current flowing through the memory cell with the reference current flowing through the first transistor.
Multi-Bit-Per-Cell Three-Dimensional One-Time-Programmable Memory
The present invention discloses a multi-bit-per-cell three-dimensional read-only memory (3D-OTP.sub.MB). It comprises a plurality of OTP cells stacked above a semiconductor substrate. Each OTP cell comprises an antifuse layer, which is irreversibly switched from a high-resistance state to a low-resistance state during programming. By adjusting the programming current, the programmed antifuses have different resistances.
Real-time update method for a differential memory, differential memory and electronic system
A method for operating a differential memory includes: operating a main memory module differentially while executing a first program; copying first logic data from a first submodule of the main memory module to an auxiliary memory module; storing third logic data associated with a second program in a second submodule of the main memory module by overwriting second logic data associated with the first program, while maintaining the first logic data contained in the first submodule of the main memory module unaltered, where the second logic data are complementary to the first logic data; when a request for reading the first logic data is received during the storing of the third logic data in the second submodule of the main memory module, reading the first logic data from the auxiliary memory module; and executing the first or second programs by operating the main memory module in single-ended mode.
Memristive computation of a vector cross product
Memristive computation of a cross product is disclosed. One example is a crossbar array of memory elements that include a number of column lines perpendicular to a number of row lines, a memory element located at each intersection of a row line and a column line. A programming voltage is applied at each memory element to change a resistance value to represent a respective entry in a skew symmetric matrix representing a first vector, and an input voltage is applied along each row line to represent a dimensional component of a second vector. Sensors located at each column line measure output voltages along column lines, where the output voltages are generated by applying input voltages received by memory elements located along the row line to resistance values of the respective memory elements. Differential amplifiers collate the output voltages for pairs of sensors to generate dimensional components of the cross product.
SENSE AMPLIFIER
Broadly speaking, embodiments of the present techniques provide an amplification circuit comprising a sense amplifier and at least one Correlated Electron Switch (CES) configured to provide a signal to the sense amplifier. The sense amplifier outputs an amplified version of the input signal depending on the signal provided by the CES element. The signal provided by the CES element depends on the state of the CES material. The CES element provides a stable impedance to the sense amplifier, which may improve the reliability of reading data from the bit line, and reduce the number of errors introduced during the reading.