Patent classifications
G11C2013/0045
MEMORY SENSE AMPLIFIER WITH PRECHARGE
A memory device includes a memory cell and a sense amplifier. The sense amplifier has a reference circuit configured to output a reference voltage and a sensing circuit connected to the memory cell. A comparator includes a first input and a second input, with the first input connected to the reference circuit to receive the reference voltage, and the second input connected to the memory cell. A precharger is configured to selectively precharge the sensing circuit to a predetermined precharge voltage
MEMORY CELLS WITH ASYMMETRICAL ELECTRODE INTERFACES
Methods, systems, and devices for memory cells with asymmetrical electrode interfaces are described. A memory cell with asymmetrical electrode interfaces may mitigate shorts in adjacent word lines, which may be leveraged for accurately reading a stored value of the memory cell. The memory device may include a self-selecting memory component with a top surface area in contact with a top electrode and a bottom surface area in contact with a bottom electrode, where the top surface area in contact with the top electrode is a different size than the bottom surface area in contact with the bottom electrode.
Reversible resistive memory logic gate device
A memory device includes two phase change memory (PCM) cells and a bridge. The first PCM cell includes an electrical input and a phase change material. The second PCM cell includes an electrical input that is independent from the electrical input of the first PCM cell and another phase change material. The bridge is electrically connected to the two PCM cells.
VOLATILE MEMORY DEVICE EMPLOYING A RESISTIVE MEMORY ELEMENT
A volatile resistive memory device includes a resistive memory element including a barrier material portion and a charge-modulated resistive memory material portion. The barrier material portion includes a material selected from germanium and a silicon-germanium alloy, and the charge-modulated resistive memory material portion includes a non-filamentary, electrically conductive metal oxide. The resistive memory device may be a volatile eDRAM device. In operation, reading a resistance state of the resistive memory element does not disturb the resistance state of the charge-modulated resistive memory material portion.
RESISTIVE MEMORY DEVICE AND A MEMORY SYSTEM INCLUDING THE SAME
A memory device includes a memory cell array, a read circuit, and a control logic. The memory cell array includes a memory cell having a resistance level that varies depending on data stored therein. The memory cell is connected to a first signal line and a second signal line. The read circuit is configured to read the data. The control logic is configured to precharge a sensing node, connected to the first signal line through a first switching device, and a first node, connected to the second signal line through a second switching device, to different voltage levels during a first period, and develop a voltage of the sensing node based on the resistance level of the memory cell during a second period.
MEMORY ARRAY WITH ASYMMETRIC BIT-LINE ARCHITECTURE
The present disclosure relates to an integrated circuit. The integrated circuit has a plurality of bit-line stacks disposed over a substrate and respectively including a plurality of bit-lines stacked onto one another. A data storage structure is over the plurality of bit-line stacks and a selector is over the data storage structure. A word-line is over the selector. The selector is configured to selectively allow current to pass between the plurality of bit-lines and the word-line. The plurality of bit-line stacks include a first bit-line stack, a second bit-line stack, and a third bit-line stack. The first and third bit-line stacks are closest bit-line stacks to opposing sides of the second bit-line stack. The second bit-line stack is separated from the first bit-line stack by a first distance and is further separated from the third bit-line stack by a second distance larger than the first distance.
Three-Dimensional Vertical One-Time-Programmable Memory
The present invention discloses a three-dimensional vertical read-only memory (3D-OTP.sub.V). It comprises a plurality of vertical OTP strings formed side-by-side on a substrate circuit. Each OTP string is vertical to the substrate and comprises a plurality of vertically stacked OTP cells. Each OTP cell comprises an antifuse layer. The antifuse layer is irreversibly switched from a high-resistance state to a low-resistance state during programming.
Two-terminal reversibly switchable memory device
A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric filed to cause oxygen ionic motion.
ELECTRONIC DEVICE
An electronic device including a semiconductor memory. The semiconductor memory may include a cell array including a plurality of resistive storage cells; a current code generation block suitable for generating a current code which has a value corresponding to an average value of current amounts of test currents respectively flowing through at least two first resistive storage cells among the plurality of resistive storage cells, in a test operation; and a sensing block suitable for comparing a read current flowing through a second resistive storage cell selected among the plurality of resistive storage cells with a reference current, and thereby sensing data of the second resistive storage cell, wherein the semiconductor memory is operable to adjust a current amount of at least one current flowing through the sensing block based on the value of the current code.
Methods and systems for accessing memory cells
A method for reading memory cells is described. The method may include applying a first read voltage to a plurality of memory cells, detecting first threshold voltages exhibited by the plurality of memory cells in response to application of the first read voltage, associating a first logic state to one or more cells of the plurality of memory cells, applying a second read voltage to the plurality of memory cells, where the second read voltage has the same polarity of the first read voltage and a higher magnitude than an expected highest threshold voltage of memory cells in the first logic state, and detecting second threshold voltages exhibited by the plurality of memory cells in response to application of the second read voltage, among other aspects. A related circuit, a related memory device and a related system are also disclosed.