The application provides a Content Addressable Memory (CAM) cell, a CAM memory device and an operation method thereof. The CAM cell includes: a plurality of parallel-coupled flash memory cells: wherein a storage data of the CAM cell is based on a combination of a plurality of threshold voltages of the parallel-coupled flash memory cells.

Numerous embodiments of a precision tuning algorithm and apparatus are disclosed for precisely and quickly depositing the correct amount of charge on the floating gate of a non-volatile memory cell within a vector-by-matrix multiplication (VMM) array in an artificial neural network. Selected cells thereby can be programmed with extreme precision to hold one of N different values.

An embedded flash memory and an operation method thereof is provided. The embedded flash memory includes a memory cell array comprising a plurality of memory cells, an automatic verification controller comprising: a TRIM calibration configured to provide a write voltage, and a time controller configured to control a write time, and a high voltage generator configured to provide the write voltage to the memory cell array, an input buffer configured to store input data, a sense amplifier configured to generate read data from the memory cell array, and a data comparator configured to compare the read data with the input data.

A device which can be implemented on a single packaged integrated circuit or a multichip module comprises a plurality of non-volatile memory cells, and logic to use a physical unclonable function to produce a key and to store the key in a set of non-volatile memory cells in the plurality of non-volatile memory cells. The physical unclonable function can use entropy derived from non-volatile memory cells in the plurality of non-volatile memory cells to produce a key. Logic is described to disable changes to data in the set of non-volatile memory cells, and thereby freeze the key after it is stored in the set.

Numerous embodiments of a precision programming algorithm and apparatus are disclosed for precisely and quickly depositing the correct amount of charge on the floating gate of a non-volatile memory cell within a vector-by-matrix multiplication (VMM) array in an artificial neural network. Selected cells thereby can be programmed with extreme precision to hold one of N different values.

Numerous embodiments of analog neural memory arrays are disclosed. In one embodiment, an analog neural memory system comprises an array of non-volatile memory cells, wherein the cells are arranged in rows and columns, the columns arranged in physically adjacent pairs of columns, wherein within each adjacent pair one column in the adjacent pair comprises cells storing W+ values and one column in the adjacent pair comprises cells storing W− values, wherein adjacent cells in the adjacent pair store a differential weight, W, according to the formula W=(W+)−(W−). In another embodiment, an analog neural memory system comprises a first array of non-volatile memory cells storing W+ values and a second array storing W− values.

Embodiments of the present disclosure relate to a memory system and a memory controller, in which data input/output terminals in different data input/output terminal groups corresponding to different channels may be arranged adjacent to each other, thereby preventing skew of a signal occurring during data input/output operations and interference between different signals and reducing the cost required for implementing the memory system.

Some implementations described herein provide a semiconductor structure. The semiconductor structure includes a first terminal coupled to a substrate of the semiconductor structure, with the first terminal including a first portion of a tunneling layer formed on the substrate, and a first gate formed on the first portion of the tunneling layer. The semiconductor structure includes a second terminal coupled to the substrate and adjacent to the first terminal, with the second terminal including a second portion of the tunneling layer formed on the substrate, a second gate formed on the second portion of the tunneling layer, and a dielectric structure formed on a top surface and side surfaces of the second gate. The semiconductor structure includes a third terminal coupled to an insulating structure and adjacent to the second terminal, with the third terminal including, a third gate formed on the insulating structure.

The application discloses an integrated memory device, a manufacturing method and an operation method thereof. The integrated memory cell includes: a first memory cell; and an embedded second memory cell, serially coupled to the first memory cell, wherein the embedded second memory cell is formed on any one of a first side and a second side of the first memory cell.

Various examples of memory systems comprising an address fault detection system are disclosed. The memory system comprises a first memory array, a row decoder, and an address fault detection system comprising a second array, wherein the row decoder decodes row addresses into word lines, each word line coupled to a row of cells in the first array and a row of cells in the second array. The second array contains digital bits and/or analog values that are used to identify address faults.