In one example, a method comprises determining a program resolution current value; and setting levels for a programming operation of a plurality of non-volatile memory cells in a neural network array such that a delta current between levels of each pair of adjacent cells in the plurality is a multiple of the program resolution current value.

In a computing-in-memory chip and a memory cell array structure, a memory cell array therein includes a plurality of memory cell sub-arrays arranged in an array. Each memory cell sub-array comprises a plurality of switch units and a plurality of memory cells arranged in an array; and first terminals of all memory cells in each column are connected to a source line, second terminals of all the memory cells are connected to a bit line, third terminals of all memory cells in each row are connected to a word line through a switch unit, a plurality of rows of memory cells are correspondingly connected to a plurality of switch units, control terminals of the plurality of switch units are connected to a local word line of the memory cell sub-array, and whether to activate the memory cell sub-array is controlled by controlling the local word line.

A plurality of non-volatile memory cells are used to realize synapses in a neural network circuit. A semiconductor device includes a memory cell array in which a plurality of non-volatile memory cells are arranged in an array. Each of the plurality of non-volatile memory cells has: a control gate electrode and a memory gate electrode that extend in a Y direction; a drain region; and a source region. Each of the plurality of drain regions is electrically connected to a bit line extending in a Y direction, and each of the plurality of source regions is electrically connected to a source line extending in an X direction.

In some aspects, a memory device is provided. The memory device includes a plurality of memory strings and a peripheral circuit. One of the memory strings includes memory cells, a select transistor coupled to a select line and a bit line, and a dummy cell coupled to a dummy word line and arranged between the select transistor and the memory cells. The peripheral circuit is coupled to the memory strings and configured to, in a pre-pulse period of a program operation, maintain a first voltage on the select line to retain an on-state of the select transistor and apply a second voltage to the dummy word line to turn off the dummy cell. After applying the second voltage to the dummy word line, the peripheral circuit is further configured to apply a third voltage to the select line to turn off the select transistor.

Numerous embodiments are disclosed for a high voltage generation algorithm and system for generating high voltages necessary for a particular programming operation in analog neural memory used in a deep learning artificial neural network. In one example, a method for programming a plurality of non-volatile memory cells in an array of non-volatile memory cells, comprises generating a high voltage, and programming a plurality of non-volatile memory cells in an array using the high voltage when a programming enable signal is asserted and providing a feedback loop to maintain the high voltage while programming the plurality of non-volatile memory cells.

Numerous embodiments for reading a value stored in a selected memory cell in a vector-by-matrix multiplication (VMM) array in an artificial neural network are disclosed. In one embodiment, an input comprises a set of input bits that result in a series of input pulses applied to a terminal of the selected memory cell, further resulting in a series of output signals that are summed to determine the value stored in the selected memory cell. In another embodiment, an input comprises a set of input bits, where each input bit results in a single pulse or no pulse being applied to a terminal of the selected memory cell, further resulting in a series of output signals which are then weighted according to the binary bit location of the input bit, and where the weighted signals are then summed to determine the value stored in the selected memory cell.

A memory device is disclosed, including a first switch and multiple first memory cells that are arranged in a first column, a second switch and multiple second memory cells that are arranged in a second column, a first data line and a second data line. The first data line is coupled to the first memory cells and the second memory cells. The second data line is coupled connected to the first memory cells and the second memory cells. The first switch transmits a data signal in the first data line in response to a control signal. The second switch outputs the data signal received from the second data line in response to the control signal.

A method of operating a nonvolatile memory device which includes at least one memory block is provided. The method includes providing a plurality of word-lines with a voltage during a word-line set-up period, precharging a plurality of driving lines with a voltage during a word-line development period, detecting a voltage drop of a sensing node during a sensing period, and detecting leakage based on the voltage drop.

In one aspect, a flash memory cell includes a well having a first-type dopant, a source having a second-type dopant and formed within the well, a drain having the second-type dopant and formed within the well, a floating gate above the well, a control gate above the floating gate, an oxide compound disposed between the floating gate and the control gate, and a tunnel oxide disposed between the floating gate and the well. The flash memory cell is configured, in one of a program mode or an erase mode, to move an electron from the source to the floating gate. The flash memory cell is configured, in the other one of the program or the erase mode, to move an electron is from the floating gate to the drain.

Disclosed herein are related to a memory device including a memory cell and a bias supply circuit providing a bias voltage to the memory cell. In one aspect, the bias supply circuit includes a bias memory cell coupled to the memory cell, where the bias memory cell and the memory cell may be of a same semiconductor conductivity type. The memory cell may include at least two gate electrodes, and the bias memory cell may include at least two gate electrodes. In one configuration, the bias memory cell includes a drain electrode coupled to one of the at least two gate electrodes of the bias memory cell. In this configuration, the bias voltage provided to the memory cell can be controlled by regulating or controlling current provided to the drain electrode of the bias memory cell.