The present application discloses an OTP memory. A cell structure includes a first active region and a second active region that intersect vertically; an EDNMOS is formed in the first active region, and a PMOS is formed in the second active region; a body portion of a channel region of the PMOS is formed a drift region of the EDNMOS, a first polysilicon gate of the EDNMOS serves as a control gate, and a second polysilicon gate of the PMOS serves as a floating gate; and the PMOS is programmed by means of hot carriers generated in the drift region of the EDNMOS. The present application further discloses a method for manufacturing an OTP memory. In the present application, high-speed writing can be implemented.

The present disclosure provides a memory device, which includes a plurality of electrically bipolar variable memory devices and a storage transistor. The electrically bipolar variable memory devices are electrically connected to a plurality of word lines respectively, the storage transistor is electrically connected to the electrically bipolar variable memory devices, where one end of each of the electrically bipolar variable memory devices is electrically connected to a corresponding one of the word lines, and another end of each of the electrically bipolar variable memory devices is electrically connected to the gate of the storage transistor.

The programming techniques include the step of providing a memory device that includes a plurality of memory cells that are divided into at least two groups including a first group and a second group. The first group includes memory cells that are coupled to full select gate drains (SGDs), and the second group includes memory cells that are coupled to partial SGDs. The method continues with the step of applying a programming voltage to a selected word line that includes at least one memory cell of the first group and at least one memory cell of the second group. Simultaneous to the application of the programming voltage, the method continues with applying voltages to bit lines coupled to memory cells. The voltages being determined based on if the memory cells are of the first group or are of the second group.

The present invention relates to a single-layer polysilicon nonvolatile memory cell, a group structure thereof and a memory including the same. The memory cell includes a selection transistor and a storage transistor, wherein the selection transistor is connected in series with the storage transistor; and the selection transistor and the storage transistor are arranged on a substrate in a mutually perpendicular manner. A memory cell group includes four memory cells, arranged in a center-symmetrical array of two rows×two columns. The memory comprises at least one memory cell group. The memory cell and the memory thereof are used as a one-time programming memory cell and memory, and have the advantages of small area, high programming efficiency and capability, and strong data retention capability.

A memory programming circuit for programming a non-volatile memory device having an array structure includes a plurality of rows, each row having a row index and comprising one or more memory units, each memory unit being configured to receive one or more input signals and to deliver one or more output signals, the memory programming circuit comprising: a first source line connected to the top electrode of the memory units comprised at rows of odd row indices, and a second source line connected to the top electrodes of the memory units comprised at rows of even row indices.

An analog CAM and an operation method thereof are provided. The analog CAM includes a matching line, an analog CAM cell and a sense amplifier. Each of the at least one analog CAM includes a first floating gate device having a N type channel and a second floating gate device having a P type channel. A match range is set through programming the first floating gate device and the second floating gate device. The sense amplifier is connected to the matching line. If an inputting signal is within the match range, a voltage of the matching line is pulled down to be equal to or lower than a predetermined level. The sense amplifier outputs a match result if the voltage of the matching line is pulled down to a predetermined level.

A memory device includes a well, a first gate layer, a second gate layer, a doped region, a blocking layer and an alignment layer. The first gate layer is formed on the well. The second gate layer is formed on the well. The doped region is formed within the well and located between the first gate layer and the second gate layer. The blocking layer is formed to cover the first gate layer, the first doped region and a part of the second gate layer and used to block electrons from excessively escaping. The alignment layer is formed on the blocking layer and above the first gate layer, the doped region and the part of the second gate layer. The alignment layer is thinner than the blocking layer, and the alignment layer is thinner than the first gate layer and the second gate layer.

A semiconductor device includes a transmission and reception circuit and a control circuit. The transmission and reception circuit transmits and receives a signal to and from a semiconductor memory device. The control circuit acquires threshold voltage distribution information of a memory element connected to a word line for read disturb detection to which a second voltage higher than a first voltage applied to an adjacent word line adjacent to a read target word line during a read operation is applied and determines an influence of read disturb based on the threshold voltage distribution information.

The present invention relates to a flash memory device that uses strap cells in a memory array of non-volatile memory cells as source line pull down circuits. In one embodiment, the strap cells are erase gate strap cells. In another embodiment, the strap cells are source line strap cells. In another embodiment, the strap cells are control gate strap cells. In another embodiment, the strap cells are word line strap cells.

A semiconductor memory device includes a memory cell array circuit and a driving force adjustment circuit. The memory cell array circuit includes a plurality of memory cells. The driving force adjustment circuit adjusts driving forces of a plurality of respective verify pass voltages based on whether or not the plurality of memory cells are programmed.