A non-volatile memory device includes an upper semiconductor layer including a first metal pad and vertically stacked on a lower semiconductor layer. The upper semiconductor layer includes a first memory group spaced apart from a second memory group in a first horizontal direction by a separation region, and the lower semiconductor layer includes a second metal and a bypass circuit underlying at least a portion of the separation region and configured to selectively connect a first bit line of the first memory group with a second bit line of the second memory group. The upper semiconductor layer is vertically connected to the lower semiconductor layer by the first metal pad and the second metal pad.

Apparatuses and techniques are described for programming a multi-tier block in which sub-blocks are arranged in respective tiers. When a program operation involves the source-side sub-block, the NAND strings are pre-charged from the source line. When a program operation involves the drain-side sub-block, the NAND strings are pre-charged from the bit line. When a program operation involves an interior sub-block, the NAND strings can be pre-charged from the bit line if all sub-blocks on the drain side of the interior sub-block are erased, or from the source line if all sub-blocks on the source side of the interior sub-block are erased. A table can be provided which identifies free blocks, free sub-blocks and a corresponding program order. If such a table is not available, the sub-blocks can be read to determine whether they are programmed.

According to principles as discussed herein, an EEPROM cell is provided and then, after testing the code, using the exact same architecture, transistors, memory cells, and layout, the EEPROM cell is converted to a read-only memory (“ROM”) cell. This conversion is done on the very same integrated circuit die using the same layout, design, and timing with only a single change in an upper level mask in the memory array. In one embodiment, the mask change is the via mask connecting metal 1 to poly. This allows the flexibility to store the programming code as non-volatile memory code, and then after it has been tested, at time selected by the customer, some or all of that code from a code that can be written to a read-only code that is stored in a ROM cell that is composed the same transistors and having the same layout.

A memory device is provided. The memory device includes an array of memory cells arranged in a plurality of rows, a plurality of word lines respectively coupled to the plurality of rows of the memory cells; and a peripheral circuit coupled to the word lines and configured to perform multi-pass programming on a selected row of memory cells coupled to a selected word line of the word lines. The multi-pass programming includes a plurality of programming passes, each of the programming passes having a programming operation and a verify operation. To perform the multi-pass programming, the peripheral circuit is configured to, in a non-last programming pass, perform a negative gate stress (NGS) operation on each memory cell in the selected row of memory cells between the programming operation and the verify operation.

Apparatuses and techniques are described for programming a multi-tier block in which sub-blocks are arranged in respective tiers. When a program operation involves the source-side sub-block, the NAND strings are pre-charged from the source line. When a program operation involves the drain-side sub-block, the NAND strings are pre-charged from the bit line. When a program operation involves an interior sub-block, the NAND strings can be pre-charged from the bit line if all sub-blocks on the drain side of the interior sub-block are erased, or from the source line if all sub-blocks on the source side of the interior sub-block are erased. A table can be provided which identifies free blocks, free sub-blocks and a corresponding program order. If such a table is not available, the sub-blocks can be read to determine whether they are programmed.

A nonvolatile memory device includes a first semiconductor layer and a second semiconductor layer. The first semiconductor layer includes word-lines, at least one string selection line, at least one ground selection line, and a memory cell array including at least one memory block. The second semiconductor includes a first address decoder and a second address decoder. The first address decoder is disposed under a first extension region adjacent to a first side of a cell region and includes a plurality of first pass transistors driving the word-lines, the at least one string selection line, and the at least one ground selection line. The second address decoder is disposed under a second extension region adjacent to a second side of the cell region and includes a plurality of second pass transistors driving the at least one string selection line and the at least one ground selection line.

Disclosed herein are related to a memory array including one-time programmable (OTP) cells. In one aspect, the memory array includes a set of OTP cells including a first subset of OTP cells connected between a first program control line and a first read control line. Each OTP cell of the first subset of OTP cells may include a programmable storage device and a switch connected between the first program control line and the first read control line. The first program control line may extend towards a first side of the memory array along a first direction, and the first read control line may extend towards a second side of the memory array facing away from the first side of the memory array.

A negative voltage switching device includes a first switching circuit configured to transmit a first negative voltage, a second switching circuit configured to transmit a second negative voltage, and a switching selection circuit configured to select one of the first switching circuit or the second switching circuit for transmitting one of the first negative voltage and the second negative voltage to an output terminal

Control logic in a memory device receives a request to program data to a block of a memory array of the memory device, the block comprising a plurality of sub-blocks, and identifies a first sub-block of the plurality of sub-blocks to be programmed with at least a portion of the data. The control logic further causes a plurality of control signals to be applied to a plurality of logical select gate layers positioned at a drain-side of the block to activate the first sub-block, and causes a program signal to be applied to a selected wordline of the block to program at least the portion of the data to a memory cell in the first sub-block and associated with the selected wordline.

Provided is a memory device including a memory structure including a substrate, a channel region, first and second doped regions, a floating gate and a dielectric layer. The channel region is disposed on the substrate. The first and the second doped regions are disposed on the substrate and respectively located at two sides of the channel region. The floating gate is disposed on the channel region. The dielectric layer is disposed between the floating gate and the channel region, the first doped region and the second doped region. The floating gate and the first doped region are partially overlapped, and/or the floating gate and the second doped region are not overlapped and a sidewall of the floating gate adjacent to the second doped region and a boundary between the second doped region and the channel region are separated by a distance.