Some embodiments include apparatuses and methods of forming such apparatuses. One of the apparatus includes first memory cells located in different levels in a first portion of the apparatus, second memory cells located in different levels in a second portion of the apparatus, a switch located in a third portion of the apparatus between the first and second portions, first and second control gates to access the first and second memory cells, an additional control gate located between the first and second control gates to control the switch, a first conductive structure having a thickness and extending perpendicular to the levels in the first portion of the apparatus, a first dielectric structure between the first conductive structure and charge-storage portions of the first memory cells, a second dielectric structure having a second thickness between the second conductive structure and a sidewall of the additional control gate, the second thickness being greater than the first thickness.

The improvement of the reliability of a semiconductor device having a split gate type MONOS memory is implemented. An ONO film and a second polysilicon film are sequentially formed so as to fill between a first polysilicon film and a dummy gate electrode. Then, the dummy gate electrode is removed. Then, the top surfaces of the first and second polysilicon films are polished, thereby to form a memory gate electrode formed of the second polysilicon film at the sidewall of a control gate electrode formed of the first polysilicon film via the ONO film. As a result, the memory gate electrode high in perpendicularity of the sidewall, and uniform in film thickness is formed.

Provided are a non-volatile memory device and a method of fabricating the same. The non-volatile memory includes a channel layer, a data storage layer disposed on the channel layer, a plurality of control gates arranged on the data storage layer and spaced apart from one another, and conductive cover layers disposed on sidewalls of the control gates facing each other. The plurality of control gates includes a first conductor having a first work function. The conductive cover layers include a second conductor having a second work function that is greater than the first work function.

A memory arrangement having a memory cell array, wherein each column is associated with a bit line and each row is associated with a word line, wherein the columns have first columns of memory cells that store useful data, and columns of memory cells of a second column type that store prescribed verification data, wherein during a read access operation the memory cells of at least the columns of memory cells of the second column type set the associated bit line to a value that corresponds to a logic combination of the values stored by the memory cells of the column of the second column type that belong to rows of memory cells addressed during the read access operation, and a detection circuit that is configured to, during a read access operation, detect whether a bit line associated with a column of memory cells of the second column type is set to a value that corresponds to the logic combination of values stored by memory cells of the column of the second column type of memory cells and whose values belong to different rows of memory cells.

A 3D memory device, the device including: a first vertical pillar; a second vertical pillar, where the first vertical pillar and the second vertical pillar function as a source or a drain for a plurality of overlaying horizontally-oriented memory transistors, where the plurality of overlaying horizontally-oriented memory transistors are self-aligned being formed following the same lithography step; and memory control circuits, where the memory control circuits are disposed at least partially directly underneath the plurality of overlaying horizontally-oriented memory transistors, or are disposed at least partially directly above the plurality of overlaying horizontally-oriented memory transistors.

According to one embodiment, a semiconductor memory device includes: a memory cell array; a plurality of bit lines respectively connected to memory cells; a word line commonly connected to the memory cells; and a control circuit. The control circuit programs a first memory cell of a first state and a second memory cell of a second state by using a first program pulse. The control circuit applies a first voltage to a first bit line connected to the first memory cell, and applies a second voltage lower than the first voltage to a second bit line connected to the second memory cell at a first time within a first period during which the first program pulse is applied. The control circuit applies the second voltage to the first and second bit lines at a second time within the first period.

A semiconductor device, the device including: a plurality of non-volatile memory cells, where at least one of the non-volatile memory cells includes at least one channel facet, where the at least one channel facet is modified by at least two gates, where the at least one channel facet includes at least two storage locations oriented perpendicular to the at least two gates.

A memory device and associated techniques improve a settling time of bit lines in a memory device during a read or verify operation. Bit line control (BLC) transistors in the sense circuits are briefly turned off during a sensing process. After the read voltage on a selected word line is changed to a second word line level or higher, a control gate voltage of the BLC transistor is lowered. This helps to inhibit a current flow from a sense circuit through a bit line when a voltage of the bit line is settling. The voltage of the bit line may be settling in response to a memory cell coupled to the selected word line undergoing a transition from off to on. A settling time of the bit line is shortened by stopping the current flow from the sense circuit. The transition of the memory cell from off to on is also improved.

A method of reading a memory device having a plurality of memory cells by, and a device configured for, reading a first memory cell of the plurality of memory cells to generate a first read current, reading a second memory cell of the plurality of memory cells to generate a second read current, applying a first offset value to the second read current, and then combining the first and second read currents to form a third read current, and then determining a program state using the third read current. Alternately, a first voltage is generated from the first read current, a second voltage is generated from the second read current, whereby the offset value is applied to the second voltage, wherein the first and second voltages are combined to form a third voltage, and then the program state is determined using the third voltage.

Present implementations are directed to nonvolatile memory devices with charge trap transistor structures. Example implementations can include a method of memory storage, by programming a first data node operatively coupled to a first charge trap transistor to a first level above a threshold, decreasing, below the threshold, a first voltage at the first charge trap transistor, increasing, above the threshold, the first voltage at the first charge trap transistor, and reprogramming, the first data node to the first level, in response to an interruption of the first voltage at the first charge trap transistor caused by the decreasing and the increasing.