The present invention provides a method for accessing a flash memory module is disclosed, wherein the flash memory module includes at least one flash memory chip, each flash memory chip includes a plurality of block, each block is implemented by a plurality of word lines, each word line corresponds to K pages, and each word line includes a plurality of memory cells supporting a plurality of states, and the method includes the steps of: receiving data from a host device; generating dummy data; and writing the data with the dummy data to a plurality of specific blocks, wherein for each of a portion of the word lines of the specific blocks, the dummy data is written into at least one of the K pages, and the data from the host device is written into the other page(s) of the K pages.

A memory device including a plurality of memory cells, configured to perform a read operation of reading data from memory cells connected to a selected word line, and configured to apply a plurality of read voltages to the selected word line, apply a first pass voltage to unselected word lines while first read voltages for determining a program state of memory cells having a threshold voltage higher than a reference voltage among the plurality of read voltages are applied to the selected word line, and apply a second pass voltage higher than the first pass voltage to the unselected word line while second read voltages for determining a program state of memory cells having a threshold voltage lower than the reference voltage among the plurality of read voltages are applied to the selected word line.

A memory device including a plurality of memory cells, configured to perform a read operation of reading data from memory cells connected to a selected word line, and configured to apply a plurality of read voltages to the selected word line, apply a first pass voltage to unselected word lines while first read voltages for determining a program state of memory cells having a threshold voltage higher than a reference voltage among the plurality of read voltages are applied to the selected word line, and apply a second pass voltage higher than the first pass voltage to the unselected word line while second read voltages for determining a program state of memory cells having a threshold voltage lower than the reference voltage among the plurality of read voltages are applied to the selected word line.

A differential memory cell array structure for a MTP non-volatile memory is provided. The array structure is connected to a source line, a word line, a bit line, an inverted bit liner and an erase line. After an erase operation (ERS) is completed, the stored data in the differential memory cells of the selected row are not all erased. That is, only the stored data in a single selected memory cell of the selected row is erased.

A memory sector with trimmed reference currents, including eight unit cells corresponding to an even word line and eight unit cells corresponding to an odd word line, and each unit cell has erased state and programmed state, wherein the logic state of unit cell corresponding to the odd word line is determined by a first reference current based on cell currents of the 8 unit cells corresponding to the even word line in programmed state and cell currents of the eight unit cells corresponding to the odd word line in erased state, and the logic state of unit cell corresponding to the even word line is determined by a second reference current based on cell currents of the eight unit cells corresponding to the even word line in erased state and cell currents of the 8 unit cells corresponding to the odd word line in programmed state.

A memory sector with trimmed reference currents, including eight unit cells corresponding to an even word line and eight unit cells corresponding to an odd word line, and each unit cell has erased state and programmed state, wherein the logic state of unit cell corresponding to the odd word line is determined by a first reference current based on cell currents of the 8 unit cells corresponding to the even word line in programmed state and cell currents of the eight unit cells corresponding to the odd word line in erased state, and the logic state of unit cell corresponding to the even word line is determined by a second reference current based on cell currents of the eight unit cells corresponding to the even word line in erased state and cell currents of the 8 unit cells corresponding to the odd word line in programmed state.

A memory device includes a high density or 3D data memory and a 3D reference memory. The reference memory is used to generate a reference signal used to sense data in the data memory. Conversion circuitry converts signals from one memory cell or a group of memory cells in the reference memory into a reference signal. The reference signal is applied to a sense amplifier to sense data stored in a selected memory cell in the data memory.

A memory device includes a high density or 3D data memory and a 3D reference memory. The reference memory is used to generate a reference signal used to sense data in the data memory. Conversion circuitry converts signals from one memory cell or a group of memory cells in the reference memory into a reference signal. The reference signal is applied to a sense amplifier to sense data stored in a selected memory cell in the data memory.

A memory device includes a high density or 3D data memory and a 3D reference memory. The reference memory is used to generate a reference signal used to sense data in the data memory. Conversion circuitry converts signals from one memory cell or a group of memory cells in the reference memory into a reference signal. The reference signal is applied to a sense amplifier to sense data stored in a selected memory cell in the data memory.

A semiconductor memory comprising: a comparison readout circuit comprising a first port configured to receive an electric signal of a read memory unit and a second port configured to receive a reference electric signal, the comparison readout circuit being configured to compare the electric signal of the read memory unit with the reference electric signal to obtain storage information of the memory unit; and a first/second column decoder connected to a first/second memory array and the comparison readout circuit and configured to select a bitline corresponding to the read memory unit when a memory array selection signal enables the first/second memory array, and output the electric signal of the memory unit to the first port by means of the bitline, and further configured to connect a first bitline of the first/second memory array to the second port when the memory array selection signal does not enable the first/second memory array.