A test circuit includes first integration circuit configured to receive first test signal and integrate first test signal to output first integrated signal; second integration circuit configured to receive second test signal and integrate second test signal to output second integrated signal, where first test signal and second test signal are signals inverted with respect to each other, value of first integrated signal is product of duty cycle of first test signal and a voltage amplitude of power supply, and value of second integrated signal is product of duty cycle of second test signal and voltage amplitude of power supply; and comparison circuit connected to first and second integration circuits. The comparison circuit is configured to output high-level signal in response to first integrated signal being greater than second integrated signal, and output low-level signal in response to second integrated signal being greater than first integrated signal.

According to one embodiment, a memory system includes: a controller configured to execute an error correction process on first data read from a first area at a first address of a memory device and determine a read level used for reading data at the first address according to a result of the correction process. The controller executes the correction process on first frame data of the first data. When the correction process on the first frame data has failed, the controller executes the correction process on second frame data of the first data. When the correction process on the second frame data has succeeded, the controller determines the read level based on a result of comparison between the second frame data and a result of the correction process on the second frame data.

An apparatus is provided, comprising a controller, a plurality of memory devices operably connected to the controller, circuitry configured to measure a performance metric for each of the plurality of memory devices, and circuitry configured to select, based upon the measured performance metric, a subset of the plurality of memory devices to disable in response to a recovery command. Information corresponding to the selected subset cam be stored in a mode register of the apparatus, and the apparatus can further comprise circuitry configured, in response to a recovery command, to disable the subset of the plurality of memory devices.

Methods and apparatus for configurable ECC (error correction code) mode in DRAM. Selected memory cells in the bank arrays of a DRAM device (e.g., die) are used to store ECC bits. A DRAM device (e.g., die) is configured to operate in a first mode in which an on-die ECC engine employs selected bits in the arrays of memory cells in the DRAM banks as ECC bits to perform ECC operations and to operate in a second mode under which the ECC bits are not employed for ECC operations by the ECC engine and made available for external use by a host. In the second mode, the repurposed ECC bits may comprise RAS bits used for RAS (Reliability, Serviceability, and Availability) operations and/or metabits comprising metadata used for other operations by the host.

A memory device includes a data pad; a read circuit outputting read or test data to the data pad according to a read timing signal and a read command; a write circuit receiving write data through the data pad according to a write timing signal; a test register circuit performing a preset operation on data and storing the data, and transferring the stored data as the test data in response to the read command, during a first test mode; a data compression circuit generating a test output signal by compressing the test data and outputting the test output signal to a first test output pad, during the first test mode; and a timing control circuit generating, according to first to third output control signals, the read timing signal and generating the write timing signal by delaying the read timing signal, during the first test mode.

A storage device includes a memory device and a memory controller. The memory device stores a history read table including root bit information, read voltage information, and error bit information on each of a plurality of memory blocks, and performs a read operation of reading data stored in the plurality of memory blocks based on the history read table. When the read operation fails, a memory controller changes a level of a read voltage, and controls the memory device to perform a read retry operation of retrying the read operation by using the changed read voltage. When the read retry operation passes, the memory controller determines whether the history read table is to be updated by comparing the root bit information of the read retry operation with the root bit information of the history read table.

Memory devices may have an array of elements in two or more dimensions. The memory devices use multiple access lines arranged in a grid to access the memory devices. Memory cells located at intersections of the access lines in the grid. Drivers are used for each access line and configured to transmit a corresponding signal to respective memory cells of the plurality of memory cells via a corresponding access line. The memory devices may use an address scrambler to determine a bit error rate for accessing memory cells and remap an address of a particular memory cell to have a bit error rate below a threshold. In this way, the address scrambler may distribute the bit error rates of multiple accesses of the array.

The present technology may include a first storage circuit connected to a plurality of memory banks, an error correction circuit, a read path including a plurality of sub-read paths connected between the plurality of memory banks and the error correction circuit, and a control circuit configured to control data output from the plurality of memory banks to be simultaneously stored in the first storage circuit by deactivating the read path during a first sub-test section, and to control the data stored in the first storage circuit to be sequentially transmitted to the error correction circuit by sequentially activating the plurality of sub-read paths during a second sub-test section.

An apparatus includes a first group of memory units and a second group of memory units coupled to a first data path and a second data path coupled to a controller, a first delay element on the first data path coupled to the second group of memory units and configured to send, from the controller to the second group of memory units, signals for write and read operations in a sequence of time cycles delayed by a time cycle with respect to the first group of memory units, and a second delay element on the second data path and coupled to the first group of memory units and configured to send, from the first group of memory units to the controller, test result signals delayed by a time cycle, the delayed test result signals having a matching delay to the delayed write and read operations.

A memory controller receives a multi-plane read request and identifies a set of actual read offsets for a set of pages in the multi-plane read request. The memory controller calculates a common read offset using the set of actual read offsets. The memory controller calculates an offset difference for. Each page. Each offset difference reflects the difference between an actual read offset for that page and the common read offset. The memory controller compares a particular page's offset difference to an offset difference threshold. The memory controller categorizes, based on the comparing, a first subset of pages from the set of pages into a single plane group and a second subset of pages from the set of pages into a multi-plane group. The memory controller performs a multi-plane read on the multi-plane group.