A semiconductor device may include: first to n-th through-electrodes; first to n-th through-electrode driving circuits suitable for charging the first to n-th through-electrodes to a first voltage level, or discharging the first to n-th through-electrodes to a second voltage level; and first to n-th error detection circuits, each suitable for storing the first voltage level or the second voltage level of a corresponding through-electrode of the first to n-th through-electrodes as a down-detection signal and an up-detection signal, and outputting a corresponding error detection signal of first to n-th error detection signals by sequentially masking the down-detection signal and the up-detection signal.

A semiconductor memory device includes a memory cell array, an error correction code (ECC) circuit, a fault address register and a control logic circuit. The memory cell array includes a plurality of memory cell rows. The scrubbing control circuit generates scrubbing addresses for performing a scrubbing operation on a first memory cell row based on refresh row addresses for refreshing the memory cell rows. The control logic circuit controls the ECC circuit such that the ECC circuit performs an error detection and correction operation on a plurality of sub-pages in the first memory cell row to count a number of error occurrences during a first interval and determines a sub operation in a second interval in the scrubbing operation based on the number of error occurrences in the first memory cell row.

Methods, systems, and devices for adjustable column address scramble using fuses are described. A testing device may detect a first error in a first column plane of a memory array and a second error in a second column plane of the memory array. The testing device may identify a first column address of the first column plane associated with the first error and a second column address of the second column plane based on detecting the first error and the second error. The testing device may determine, for the first column plane, a configuration for scrambling column addresses of the first column plane to different column addresses of the first column plane. In some cases, the testing device may perform a fuse blow of a fuse associated with the first column plane to implement the determined configuration.

An integrated memory assembly comprises a memory die and a control die bonded to the memory die. The memory die includes a memory structure of non-volatile memory cells. The control die is configured to program user data to and read user data from the memory die based on one or more operational parameters. The control die is configured to calibrate the one or more operational parameters for the memory die. The control die is also configured to perform testing of the memory die using the calibrated one or more operational parameters.

An electronic device includes memory banks and repair circuitry configured to remap data from the memory banks to repair memory elements of the memory banks when a failure occurs. The repair circuitry includes a logic gate configured to receive an output from a memory bank of the memory banks, receive a failure signal indicating whether a corresponding memory element has failed, and transmit the output with a value of the output is based at least in part on the failure signal. The repair circuitry also includes error correction circuitry configured to receive the output via the logic gate and a multiplexer configured to receive the output from the memory bank, receive a repair value, and selectively output the output or the repair value from the repair circuitry as an output of the repair circuitry.

A data processing system comprising: a memory system comprising a plurality of memory devices, each of which comprises a first error correction unit and a plurality of cell array regions each having a plurality of memory cells coupled in an array to a plurality of word lines and a plurality of bit lines; and a host comprising a second error correction unit for correcting an error of data transferred from the memory system, and suitable for generating error correction information on the error correction operation of the second error correction unit, setting error correcting strengths to the respective memory devices using the error correction information and log information, and performing counter-error operations on the respective memory devices according to the error correcting strengths.

A sense amplifier reference is generated with the same memory cell columns as data cells in order to match signal paths between the data and reference signals. Each row of data memory cells may have a corresponding set of reference cells, which greatly reduces the number of data cells supported by a reference, and in turn reduces the impact of process variations. A memory array may include data columns, a first reference column in the memory array configured to provide a logic 0 reference signal, and a second reference column in the memory array configured to provide a logic 1 reference signal. A circuit is configured to combine at least the logic 0 reference signal and the logic 1 reference signal to generate a reference signal for a sense amplifier to identify the data signal provided from the data columns.

A reading method for a non-volatile memory device, includes performing a normal read operation using a default read level in response to a first read command; and performing a read operation using a multiple on-chip valley search (OVS) sensing operation in response to a second read command, when read data read in the normal read operation are uncorrectable.

Embodiments of the present disclosure provide a memory detection method and detection apparatus, for detecting a current-leakage bitline. The method includes: a memory including a plurality of memory cells, a plurality of sense amplifiers, and the sense amplifier including a power line providing a low potential voltage and a power line providing a high potential voltage; writing first memory data to each of the memory cells; performing a reading operation after the first memory data is written; acquiring a first test result based on a difference between first real data and the first memory data; performing the reading operation again to read second real data in each of the memory cells; acquiring a second test result based on a difference between the second real data and second memory data; and acquiring a specific position of the current-leakage bitline based on the second test result and the first test result.

A memory device may include: a memory bank comprising a first cell mat used as a normal area and a second cell mat used as a row hammer area and a redundancy area; a target address generation circuit suitable for: saving, in the row hammer area, a count of a received address for an active operation on the memory bank by performing an internal access operation on the row hammer area during the active operation, and setting, a particular count which satisfies a preset condition, an address corresponding to the particular count as a target address; a refresh control circuit suitable for controlling a smart refresh operation on the target address; and a column repair circuit suitable for repairing, when a bit line of the normal area has a defect, the bit line of the normal area with a bit line of the redundancy area.