A system and integrated circuits are disclosed for determining performance metrics over a plurality of cycles of an input signal using on-chip diagnostic circuitry. The system comprises a trigger generation module configured to generate a trigger signal, and diagnostic circuitry coupled with the trigger generation module. The diagnostic circuitry comprises a memory comprising a plurality of data lines, and a plurality of delay elements, each delay element of the plurality of delay elements connected between consecutive data lines of the plurality of data lines. The diagnostic circuitry is configured to receive at least one input signal, and write, upon receiving the trigger signal, values on the plurality of data lines to the memory, thereby acquiring samples of a plurality of cycles of the input signal.

An IC includes an array of processor units, arranged in two or more subarrays. A subarray has a test generator, a multiplexer to apply a test vector to a datapath, and a test result output. It includes one or more processor units. A test result compressor is coupled with an output of the datapath, and compresses output data to obtain a test signature, which it stores in a signature register. The signature register is legible from outside the subarray. The datapath includes one or more memories and one or more ALUs. Test data travels through the full datapath, including the memories and the ALUs. ALU control registers are overridden during test to ensure a testable datapath.

A storage system includes a controller part, a data storage part, and a transfer path of a signal that couples these parts. A driver included in the controller part transmits the signal including write data on the basis of a configured parameter, a receiver included in the data storage part receives the signal, and the write data included in the signal is written into a first storage area. The controller part reads the write data from the first storage area, determines whether or not a bit error exists in the write data, changes the parameter when the bit error exists to repeat similar determination and find an appropriate parameter at which the bit error no longer exists.

Technologies are generally described for systems, devices, and methods effective to operate a memory device. A memory controller may compress initial data to produce compressed data. The memory controller may select a storage block in the memory device. The memory controller may identify one or more positions of defective cells in the selected storage block. The memory controller may manipulate the compressed data based on the identified one or more positions to produce manipulated data. The memory controller may store the manipulated data in the selected storage block.

A memory device includes a memory cell array including a plurality of memory cell groups, and a decoder circuit configured to control selection of the memory cell groups. The decoder circuit includes an address decoder circuit configured to activate the decoder circuit based on an input address, a plurality of information retention circuits, each of which corresponds to one of the memory cell groups and outputting a signal that indicates whether or not the corresponding memory cell group is defective, a transistor having a gate connected to each of the outputs of the information retention circuits, and a signal output circuit configured to output a control signal for selecting or not selecting the memory cell groups based on an on/off state of the transistor.

For a non-volatile memory die formed of multiple blocks of memory cells, the memory die has a multi-bit bad block flag for each block stored on the memory die, such as in a fuse ROM. For each block, the multi-bit flag indicates if the block has few defects and is of the highest reliability category, is too defective to be used, or is in of one of multiple recoverability categories. The multi-bit bad blocks values can be determined as part a test process on fresh devices, where the test of a block can be fail stop for critical category errors, but, for recoverable categories, the test continues and tracks the test results to determine a recoverability category for the block and write this onto the die as a bad block flag for each block. These recoverability categories can be incorporated into wear leveling operations.

An integrated memory assembly comprises a memory die and a control die bonded to the memory die. The memory die includes a memory structure of non-volatile memory cells. The control die is configured to program user data to and read user data from the memory die based on one or more operational parameters. The control die is configured to calibrate the one or more operational parameters for the memory die. The control die is also configured to perform testing of the memory die using the calibrated one or more operational parameters.

A method to manufacture a semiconductor device includes: bonding a first wafer and a second wafer to be stacked vertically with one another, in which the first wafer provides a plurality of memory components and the second wafer provides a control circuit; forming a plurality of input/output channels on a surface of one of the first and second wafers; and cutting the bonded first and second wafers into a plurality of dices; wherein a plurality of first conductive contacts in the first wafer are electrically connected to the control circuit and the first conductive contacts in combinations with a plurality of first conductive vias in the first wafer form a plurality of transmission channels through which the control circuit is capable to access the memory components.

A method of operating a controller includes randomly transmitting a first command to a non-volatile memory device upon a read request from a host; receiving first read data corresponding to the first command from the non-volatile memory device; determining whether the number of first error bits of the first read data is greater than a first reference value; determining whether the number of first error bits is greater than a second reference value, when the number of first error bits is not greater than the first reference value; storing a target wordline in a health buffer, when the number of first error bits is greater than the second reference value; periodically transmitting a second command to the non-volatile memory device; and receiving second read data corresponding to the second command from the non-volatile memory device.

Methods, systems, and devices for techniques for detecting a state of a bus are described. A memory device may fail to receive or decode (e.g., successfully receive or successfully decode) an access command transmitted to the memory device via a bus. The bus may enter or remain in an idle state which may cause indeterminate signals to develop on the idle bus. A host device may obtain the indeterminate signals from the idle bus and determine that the indeterminate signals include an error based on a signal that develops on a control line of the idle bus. The signal may be associated with a control signal that indicates errors in a data signal when the control signal has a first voltage, and the control line may be configured to have the first voltage when the bus is idle.