G11C29/36

SEMICONDUCTOR DEVICE EQUIPPED WITH GLOBAL COLUMN REDUNDANCY
20230005565 · 2023-01-05 · ·

Disclosed herein is an apparatus that includes a plurality of column planes each including a plurality of bit lines, an access control circuit configured to select one of the plurality of bit lines in each of the plurality of column planes based on a column address to read a plurality of data-bits, a data generating circuit configured to generate an expected-bit based at least in part on the data-bits, and an analyzing circuit configured to generate a fail-bit data indicating which one of the data-bits does not match the expected-bit when one of the data-bits does not match the expected-bit.

SEMICONDUCTOR DEVICE EQUIPPED WITH GLOBAL COLUMN REDUNDANCY
20230005565 · 2023-01-05 · ·

Disclosed herein is an apparatus that includes a plurality of column planes each including a plurality of bit lines, an access control circuit configured to select one of the plurality of bit lines in each of the plurality of column planes based on a column address to read a plurality of data-bits, a data generating circuit configured to generate an expected-bit based at least in part on the data-bits, and an analyzing circuit configured to generate a fail-bit data indicating which one of the data-bits does not match the expected-bit when one of the data-bits does not match the expected-bit.

Manufacturer self-test for solid-state drives

An apparatus includes a memory and a controller. The memory may be configured to store data. The controller may be configured to process a plurality of input/output requests to a plurality of blocks of the memory that are not marked as bad on a block list, perform a code rate test that programs the plurality of blocks of the memory at three or more code rates of an error correction code scheme, and mark any of the plurality of blocks identified as bad during the code rate test on the block list.

Manufacturer self-test for solid-state drives

An apparatus includes a memory and a controller. The memory may be configured to store data. The controller may be configured to process a plurality of input/output requests to a plurality of blocks of the memory that are not marked as bad on a block list, perform a code rate test that programs the plurality of blocks of the memory at three or more code rates of an error correction code scheme, and mark any of the plurality of blocks identified as bad during the code rate test on the block list.

SYSTEM AND METHOD FOR LOW POWER MEMORY TEST
20220415423 · 2022-12-29 ·

An apparatus includes a first group of memory units and a second group of memory units coupled to a first data path and a second data path coupled to a controller, a first delay element on the first data path coupled to the second group of memory units and configured to send, from the controller to the second group of memory units, signals for write and read operations in a sequence of time cycles delayed by a time cycle with respect to the first group of memory units, and a second delay element on the second data path and coupled to the first group of memory units and configured to send, from the first group of memory units to the controller, test result signals delayed by a time cycle, the delayed test result signals having a matching delay to the delayed write and read operations.

SYSTEM AND METHOD FOR LOW POWER MEMORY TEST
20220415423 · 2022-12-29 ·

An apparatus includes a first group of memory units and a second group of memory units coupled to a first data path and a second data path coupled to a controller, a first delay element on the first data path coupled to the second group of memory units and configured to send, from the controller to the second group of memory units, signals for write and read operations in a sequence of time cycles delayed by a time cycle with respect to the first group of memory units, and a second delay element on the second data path and coupled to the first group of memory units and configured to send, from the first group of memory units to the controller, test result signals delayed by a time cycle, the delayed test result signals having a matching delay to the delayed write and read operations.

SEMICONDUCTOR MEMORY DEVICES

A semiconductor memory device includes a buffer die and a plurality of memory dies. Each of the memory dies includes a memory cell array, an error correction code (ECC) engine and a test circuit. The memory cell array includes a plurality of memory cell rows, each including a plurality of volatile memory cells. The test circuit, in a test mode, generates a test syndrome and an expected decoding status flag indicating error status of the test syndrome, receives test parity data generated by the ECC engine based on the test syndrome and a decoding status flag indicating error status of the test parity data, and determines whether the ECC engine has a defect based on comparison of the test syndrome and the test parity data and a comparison of the expected decoding status flag and the decoding status flag.

Data input circuit and memory device including the same

A memory device includes a plurality of data input pads and at least one test data input pad. The memory device also includes a plurality of data input circuits corresponding to a plurality of channels, respectively, the plurality of data input circuits suitable for transmitting respective data received through the data input pads to the corresponding channels. The memory device further includes a test control circuit suitable for selecting at least one data input circuit among the plurality of data input circuits based on test mode information and suitable for controlling the selected data input circuit to transmit set data to the corresponding channel, during a test operation.

Data input circuit and memory device including the same

A memory device includes a plurality of data input pads and at least one test data input pad. The memory device also includes a plurality of data input circuits corresponding to a plurality of channels, respectively, the plurality of data input circuits suitable for transmitting respective data received through the data input pads to the corresponding channels. The memory device further includes a test control circuit suitable for selecting at least one data input circuit among the plurality of data input circuits based on test mode information and suitable for controlling the selected data input circuit to transmit set data to the corresponding channel, during a test operation.

Digital bit generators for trim circuits

In some examples, a circuit comprises a first polyfuse and a first diode having a first diode anode and a first diode cathode, where the first diode anode is coupled to the first polyfuse. The circuit comprises a second polyfuse coupled to the first polyfuse and a second diode having a second diode anode and a second diode cathode, where the second diode cathode is coupled to the second polyfuse. The circuit comprises a probe pad coupled to the first diode cathode and the second diode anode.