Disclosed herein is an apparatus that includes a plurality of column planes each including a plurality of bit lines, an access control circuit configured to select one of the plurality of bit lines in each of the plurality of column planes based on a column address to read a plurality of data-bits, a data generating circuit configured to generate an expected-bit based at least in part on the data-bits, and an analyzing circuit configured to generate a fail-bit data indicating which one of the data-bits does not match the expected-bit when one of the data-bits does not match the expected-bit.

Disclosed herein is an apparatus that includes a plurality of column planes each including a plurality of bit lines, an access control circuit configured to select one of the plurality of bit lines in each of the plurality of column planes based on a column address to read a plurality of data-bits, a data generating circuit configured to generate an expected-bit based at least in part on the data-bits, and an analyzing circuit configured to generate a fail-bit data indicating which one of the data-bits does not match the expected-bit when one of the data-bits does not match the expected-bit.

Example embodiments provide for a storage device that includes a storage controller including a plurality of analog circuits and at least one nonvolatile memory device including a first region and a second region. The at least one nonvolatile memory device stores user data in the second region and stores trimming control codes in the first region as a compensation data set. The trimming control codes are configured to compensate for offsets of the plurality of analog circuits and are obtained through a wafer-level test on the storage controller. The storage controller, during a power-up sequence, reads the compensation data set from the first region of the at least one nonvolatile memory device, stores the read compensation data set therein, and adjusts the offsets of the plurality of analog circuits based on the stored compensation data set.

Example embodiments provide for a storage device that includes a storage controller including a plurality of analog circuits and at least one nonvolatile memory device including a first region and a second region. The at least one nonvolatile memory device stores user data in the second region and stores trimming control codes in the first region as a compensation data set. The trimming control codes are configured to compensate for offsets of the plurality of analog circuits and are obtained through a wafer-level test on the storage controller. The storage controller, during a power-up sequence, reads the compensation data set from the first region of the at least one nonvolatile memory device, stores the read compensation data set therein, and adjusts the offsets of the plurality of analog circuits based on the stored compensation data set.

The present disclosure provides memory devices and methods for using shared latch elements thereof. A memory device includes a substrate, an interposer disposed over the substrate, and a logic die and stacked memory dies disposed over the interposer. In the logic die, the test generation module performs a memory test operation for the memory device. The functional elements stores functional data in latch elements during a functional mode of the memory device. The repair analysis module determines memory test/repair data based on the memory test operation. The memory test/repair data comprises memory addresses of faulty memory storage locations of the memory device that are identified during the memory test operation. The repair analysis module configures the latch elements into a scan chain, accesses the memory test/repair data during the test mode of the memory device, and repairs the memory device using the memory test/repair data.

The present disclosure provides memory devices and methods for using shared latch elements thereof. A memory device includes a substrate, an interposer disposed over the substrate, and a logic die and stacked memory dies disposed over the interposer. In the logic die, the test generation module performs a memory test operation for the memory device. The functional elements stores functional data in latch elements during a functional mode of the memory device. The repair analysis module determines memory test/repair data based on the memory test operation. The memory test/repair data comprises memory addresses of faulty memory storage locations of the memory device that are identified during the memory test operation. The repair analysis module configures the latch elements into a scan chain, accesses the memory test/repair data during the test mode of the memory device, and repairs the memory device using the memory test/repair data.

A tool for performing a logic built-in self-test of an electronic circuit operating on a clock cycle basis. The tool stores a configurable test signature in a random-access memory together with a pattern counter for a test pattern, wherein a number of the at least one additional signature register corresponds to a number of entries in the random access memory. The tool determines an error based, at least in part, on a compare operation for a given test pattern, wherein the compare operation determines whether the test signature in the first signature register before a capture cycle of a next test pattern differs from the corresponding configurable test signature. The tool stores the error in a corresponding additional signature register.

Disclosed is a method for grading memory modules comprising: a testing step which applies at least one test procedure to test a memory, each test procedure is provided with a reliability test; and a grading step which grades the memory into corresponding grade level according to test results of said at least one test procedure, and each test result includes a reliability test result wherein the reliability test has the following steps in sequence: performing a data-writing operation on the memory, wherein the data-writing operation is an operation that writes data to the memory; stopping electric charging the memory; halting a predetermined time period; electric charging the memory; checking data integrity of the memory; and generating the reliability test result according to the data integrity.

Disclosed is a method for grading memory modules comprising: a testing step which applies at least one test procedure to test a memory, each test procedure is provided with a reliability test; and a grading step which grades the memory into corresponding grade level according to test results of said at least one test procedure, and each test result includes a reliability test result wherein the reliability test has the following steps in sequence: performing a data-writing operation on the memory, wherein the data-writing operation is an operation that writes data to the memory; stopping electric charging the memory; halting a predetermined time period; electric charging the memory; checking data integrity of the memory; and generating the reliability test result according to the data integrity.

The present application relates to the technical field of integrated circuits, and in particular, to a memory test method and a memory test apparatus. The memory test method includes: providing a to-be-tested memory, where the to-be-tested memory includes a plurality of memory cells; alternately writing a first write value and a second write value into a memory cell of the memory cells at a preset frequency; writing a test write value into the memory cell; judging whether a data read from the memory cell is the test write value, and determining that a capacitance-frequency characteristic of the memory cell is abnormal if the data is not the test write value. According to the present application, the capacitance-frequency characteristic of the to-be-tested memory is accurately tested, to improve the field of memory products.