A memory includes: a memory array; a nonvolatile memory circuit suitable for storing a plurality of data sets each including flag information and multi-bit data; a plurality of repair register sets suitable for receiving and storing the multi-bit data included in the data sets whose flag information is marked for repair among the data sets during a boot-up operation; a plurality of setting register sets suitable for storing setting information included in the data sets whose flag information is marked for setting among the data sets during the boot-up operation; and a repair circuit suitable for repairing a defect in the memory array based on the multi-bit data stored in the repair register sets.

Embodiments of the disclosure are drawn to apparatuses methods for checking redundancy information for row addresses prior to performing various refresh operations, such as auto refresh and targeted refresh operations. In some examples, refresh operations may be multi pump refresh operations. In some examples, a targeted refresh operation may be performed prior to an auto refresh operation responsive to a multi pump refresh operation. In some examples, redundancy information for the auto refresh operation may be performed, at least in part, during the targeted refresh operation. In some examples, refresh operations on word lines may be skipped when the redundancy information indicates the word line is defective or unused.

An apparatus includes a boot-up control circuit configured to, when a first boot-up operation is performed, latch first fuse data by receiving the first fuse data and fuse information from a fuse circuit and configured to, when a second boot-up operation is performed, latch second fuse data by receiving the second fuse data from the fuse circuit based on the fuse information; and a rupture control circuit configured to store a failure address as the second fuse data by rupturing the fuse circuit based on the fuse information.

A memory device includes a memory cell array including normal memory cells and redundant memory cells; first page buffers connected to the normal memory cells through first bit lines including a first bit line group and a second bit line group and arranged in a first area corresponding to the first bit lines in a line in a first direction; and second page buffers connected to the redundant memory cells through second bit lines including a third bit line group and a fourth bit line group and arranged in a second area corresponding to the second bit lines in a line in the first direction, wherein, when at least one normal memory cell connected to the first bit line group is determined as a defective cell, normal memory cells connected to the first bit line group are replaced with redundant memory cells connected to the third bit line group.

A semiconductor device includes a control circuit configured to generate an input enable signal, an output enable signal, a latch control signal, and an error correction control signal based on a write control signal, a write check command, and a read check command for performing an error correction test mode; a latch circuit configured to generate latch data, a latch parity, and a latch masking signal by latching input data, an input parity, and an input masking signal and configured to re-store corrected data as the latch data, during a period in which the latch control signal is enabled; and an error correction circuit configured to generate the corrected data by correcting an error, included in the latch data, based on the latch data, the latch parity and the latch masking signal during a period in which the error correction control signal is enabled.

A method to manufacture a semiconductor device includes: bonding a first wafer and a second wafer to be stacked vertically with one another, in which the first wafer provides a plurality of memory components and the second wafer provides a control circuit; forming a plurality of input/output channels on a surface of one of the first and second wafers; and cutting the bonded first and second wafers into a plurality of dices; wherein a plurality of first conductive contacts in the first wafer are electrically connected to the control circuit and the first conductive contacts in combinations with a plurality of first conductive vias in the first wafer form a plurality of transmission channels through which the control circuit is capable to access the memory components.

An anti-fuse readout circuit, an anti-fuse memory, and a testing method are provided. The anti-fuse readout circuit includes: a latch circuit configured to latch data read out from an anti-fuse storage array; and a transmission circuit connected to an output terminal of the latch circuit, the transmission circuit being configured to transmit data latched in the latch circuit to a data port in response to a read test command.

An example method may be used to perform concurrent compensation in a memory array. The example method may include decoding a prime row address corresponding to a respective prime memory cell row of a first row section of a memory array mat to provide a prime section signal, and in response to a determination that the prime row address matches a defective prime row address, providing a redundant section signal corresponding to a respective redundant memory cell row of a second row section of the memory array mat. In response to the prime section signal, initiating a first threshold voltage compensation operation on first sensing circuitry coupled to the first row section; and in response to the redundant section signal indicating a defective prime row, initiating a second threshold voltage compensation operation on second sensing circuitry coupled to the second row section concurrent with the first threshold voltage compensation operation.

A memory repair system in an integrated circuit (IC) that optimizes the fuseROM used for memory repair. The IC includes a plurality of memory wrappers. Each memory wrapper includes a memory block with a fuse register and a bypass register. The bypass register have a bypass data that indicates a defective memory wrapper of the plurality of memory wrappers. A fuseROM controller is coupled to the plurality of memory wrappers. A memory bypass chain links the bypass registers in the plurality of memory wrappers with the fuseROM controller. The fuseROM controller loads the bypass data in the memory bypass chain. A memory data chain links the fuse registers in the plurality of memory wrappers with the fuseROM controller. The memory data chain is re-configured to link the fuse registers in a set of defective memory wrappers of the plurality of memory wrappers responsive to the bypass data loaded in the memory bypass chain.

An electronic device includes a power-up signal generation circuit block suitable for generating a power-up signal during a power-up section of a source voltage, a delay circuit block suitable for generating a plurality of delay signals by sequentially delaying the power-up signal, and a plurality of internal circuit blocks sequentially initialized in response to a corresponding one of the power-up signal and the delay signals.