A system and method for preserving block experiencing wordline failure in memory devices. An example method includes performing, by a processor, a write operation to program data to a set of memory cells addressable by a first wordline of a plurality of wordlines of a block of a memory device; determining that a program fault occurred during the write operation; determining a number of wordlines referenced by a program fault data structure that are associated with the block; and responsive to determining that the number of wordlines fails to satisfy a threshold criterion, releasing a second wordline of the plurality of wordlines to be available for write operations.

A memory device including a memory cell array, a redundant fuse circuit and a memory controller is provided. The memory cell array includes multiple regular memory blocks and multiple redundant memory blocks. The redundant fuse circuit includes multiple fuse groups recording multiple repair information. Each repair information is associated with a corresponding one of the redundant memory blocks and includes a repair address, a first enable bit, and a second enable bit. The memory controller includes multiple determining circuits. Each of the multiple determining circuits generates a hit signal according to an operation address, the repair address, the first enable bit, and the second enable bit. When a target memory block is bad, and the determining circuit of the memory controller generates the hit signal, the memory controller disables the redundant memory block that is bad according to the hit signal.

A memory-testing circuit configured to perform a test of reference bits in a memory. In a read operation, outputs of data bit columns are compared with one or more reference bit columns. The memory-testing circuit comprises: a test controller and association adjustment circuitry configurable by the test controller to associate another one or more reference bit columns or one or more data bit columns with the data bit columns in the read operation. The test controller can determine whether the original one or more reference bit columns have a defect based on results from the two different association.

Fuse logic is configured to selectively enable certain group of fuses of a fuse array to support one of column (or row) redundancy in one application or error correction code (ECC) operations in another application. For example, the fuse logic may decode the group of fuses to enable a replacement column (or row) of memory cells in one mode or application, and decodes a subset of the group of fuses to retrieve ECC data corresponding to a second group of fuses are encoded to enable a different replacement column or row of memory cells in a second mode or application. The fuse logic includes an ECC decode logic circuit that is selectively enabled to detect and correct errors in data encoded in the second group of fuses based on the ECC data encoded in the subset of fuses of the first group of fuses.

Methods, systems, and devices for modifying subsets of memory bank operating parameters are described. First global trimming information may be configured to adjust a first subset of operating parameters for a set of memory banks within a memory system. Second global trimming information may be configured to adjust a second subset of operating parameters for the set of memory banks. Local trimming information may be used to adjust one of the subsets of the operating parameters for a subset of the memory banks. To adjust one of the subsets of the operating parameters, the local trimming information may be combined with one of the first or second global trimming information to yield additional local trimming information that is used to adjust a corresponding subset of the operating parameters at the subset of the memory banks.

Electronic devices and methods for single event effect mitigation are described. The device can include a processor, a memory cell, and an integrated particle sensor. The memory cell can comprise a substrate, a deep well coupled to the substrate, and a ground-coupled well coupled to the deep well. The integrated particle sensor can be coupled between the substrate and the deep well, and the ground-coupled well and the deep well. The integrated particle sensor can be operable to detect an ionizing particle generating the single event effect. The electronic device can be a field-programmable gate array.

The method can include detecting an ionizing particle generating a single event effect at a memory cell of the electronic device, switching from the memory cell to a redundant memory cell associated with the memory cell when the single event effect is detected, and reconfiguring the memory cell based on the redundant memory cell.

Apparatuses for memory repair for a memory device are described. An example apparatus includes: a non-volatile storage element that stores information; a storage latch circuit coupled to the non-volatile storage element and stores latch information; and a control circuit that, in a first repair mode, receives first repair address information, provides the first repair address information to the non-volatile storage element, and further transmits the first repair address information from the non-volatile storage element to the storage latch circuit. The control circuit, in a second repair mode, receives second repair address information and provides the second repair address information to the storage latch circuit and disables storing the second address information into the non-volatile storage element.

A method and device for Fail Bit (FB) repairing. The method includes: a bank to be repaired of a chip to be repaired is determined; first repair processing is performed on first FBs in each target repair bank using a redundant circuit; second FBs are determined, and second repair processing is performed on the second FBs through a state judgment repair operation; for each target repair bank, unrepaired FBs in the target repair bank is determined, and candidate repair combinations and candidate repair costs of the unrepaired FBs are determined using an optimal combined detection manner; and a target repair cost is determined according to the candidate repair costs, and a target repair solution corresponding to the target repair cost is determined to perform repair processing on the unrepaired FBs according to the target repair solution.

A memory device includes a memory cell array and a set of fuse banks including a common fuse bank storing common bit information corresponding to a plurality of defective memory cells in the memory cell array. The memory device including a plurality of match sub-circuits corresponding to respective defective memory cells of the plurality of defective memory cells. Each match sub-circuit can be configured to provide a determination of whether a memory cell address of a memory cell of the memory cell array matches an address of the respective defective memory cell. The plurality of match sub-circuit can include a shared common bit-processing circuit that is configured to receive common bit-by-bit results of a comparison between a portion of the memory cell address and the common bit information. The common bit-processing circuit can determine whether the common bit information matches the portion of the memory cell address.

A controller includes an internal memory to store an address and a memory control unit operatively coupled with the internal memory. The memory control unit includes logic to identify a malfunctioning address of primary data storage elements within an external memory device, the external memory device being another semiconductor device separate from the controller, store the malfunctioning address in the internal memory, and transmit, to the external memory device, a command to initiate a repair of the malfunctioning address using redundant data storage elements and an indication of an address associated with the malfunctioning address.