A memory device includes a memory cell array and a memory controller. The memory cell array includes a plurality of memory blocks. Each of the memory blocks includes a plurality of word lines. A plurality of memory chunks is coupled to at least one of the word lines. The memory controller is configured to program data to a particular memory chunk of the plurality of memory chunks by performing a chunk operation that includes selecting a particular word line from the plurality of word lines, selecting a particular memory chunk from the plurality of memory chunks that are coupled to the particular word line, and applying a program voltage to a particular memory block corresponding to the particular memory chunk to program data to the particular memory chunk.

Embodiments of the disclosure are drawn to apparatuses and methods for storing an enable state of an address. The address may be broadcast from a fuse array to a fuse latch, and may be associated with enable information. The fuse latch may include a plurality of enable latch circuits, each of which may receive the enable information in common, and each of which may store the enable information as an enable bit. Each of the enable latch circuits may provide a respective enable signal based on a state of the stored enable bit. An enable logic circuit may provide an overall enable signal with a state determined by the states of all of the enable signals from the plurality of enable latch circuits.

A storage system is provided which includes: a storage device including a first memory, which may be nonvolatile memory, and a second memory, which may be a device memory, and configured to request a test on at least one of the first and second memories; and a host configured to test the at least one memory in response to the request for the memory test from the storage device and store the test result in the first memory or a third memory.

According to one embodiment, a non-volatile semiconductor memory device comprises a memory cell array and a memory region. The memory cell array has a plurality of physical blocks. Each of the plurality of physical blocks includes a plurality of string units. Each string unit has a plurality of NAND strings that shares a plurality of word lines connected to a plurality of memory cells, respectively. The memory region is disposed to one of the plurality of physical blocks. Each of the plurality of string units configures a first logical block, and when the first logical block is failed, information of the first failed logical block is stored in a first region of the memory region.

Methods, systems, and devices related to 3D self-selecting-memory array of memory cells are described. The method relates to a solution for improving the fault-tolerant capability of memory devices, including: applying a triple-modular-redundancy calculation in a programming phase of the memory cells of a memory array, and adopting a sequence of two opposite dual polarity algorithms applied along a selected bit line and in parallel on the at least three selected word lines of the memory array.

Methods, systems, and devices for modifiable repair solutions for a memory array are described to support storing repair information for a memory array within the memory array itself. A memory device may include the memory array and an on-die microprocessor, where the microprocessor may retrieve the repair information from the memory array and write the repair information to repair circuitry used for identifying defective memory addresses. The microprocessor may support techniques for identifying additional defects and updating the repair information during operation of the memory array. For example, the microprocessor may identify additional defects based on errors associated with one or more memory cells of the memory array or based on testing performed on one or more memory cells of the memory array. In some cases, a host device may identify additional defects and may notify the microprocessor of the additional defects.

A storage device includes a memory, a write circuit, a read circuit, and a debug information register. The memory includes a data area and a redundant area that corresponds to the data area. The write circuit writes first data specified in a write command to the data area, and first information about a transmission source which has transmitted the write command, to the redundant area. The read circuit reads the first data as second data from the data area, and reads the first information as second information from the redundant area, in response to a read command. The debug information register stores the second information read by the read circuit.

A memory device includes a memory cell array including a plurality of memory cell groups, and a decoder circuit configured to control selection of the memory cell groups. The decoder circuit includes an address decoder circuit configured to activate the decoder circuit based on an input address, a plurality of information retention circuits, each of which corresponds to one of the memory cell groups and outputting a signal that indicates whether or not the corresponding memory cell group is defective, a transistor having a gate connected to each of the outputs of the information retention circuits, and a signal output circuit configured to output a control signal for selecting or not selecting the memory cell groups based on an on/off state of the transistor.

A dynamic random access memory (DRAM) comprises a plurality of primary data storage elements, a plurality of redundant data storage elements, and circuitry to receive a first register setting command and initiate a repair mode in the DRAM in response to the first register setting command. The circuitry is further to receive an activation command, repair a malfunctioning row address in the DRAM, receive a precharge command, receive a second register setting command, terminate the repair mode in the DRAM in response to the second register setting command, receive a memory access request for data stored at the malfunctioning row address, and redirect the memory access request to a corresponding row address in the plurality of redundant data storage elements.

A controller includes an internal memory to store an address and a memory control unit operatively coupled with the internal memory. The memory control unit includes logic to identify a malfunctioning address of primary data storage elements within an external memory device, the external memory device being another semiconductor device separate from the controller, store the malfunctioning address in the internal memory, and transmit, to the external memory device, a command to initiate a repair of the malfunctioning address using redundant data storage elements and an indication of an address associated with the malfunctioning address.