A controller includes an internal memory to store an address and a memory control unit operatively coupled with the internal memory. The memory control unit includes logic to identify a malfunctioning address of primary data storage elements within an external memory device, the external memory device being another semiconductor device separate from the controller, store the malfunctioning address in the internal memory, and transmit, to the external memory device, a command to initiate a repair of the malfunctioning address using redundant data storage elements and an indication of an address associated with the malfunctioning address.

A controller includes an internal memory to store an address and a memory control unit operatively coupled with the internal memory. The memory control unit includes logic to identify a malfunctioning address of primary data storage elements within an external memory device, the external memory device being another semiconductor device separate from the controller, store the malfunctioning address in the internal memory, and transmit, to the external memory device, a command to initiate a repair of the malfunctioning address using redundant data storage elements and an indication of an address associated with the malfunctioning address.

A controller includes an internal memory to store an address and a memory control unit operatively coupled with the internal memory. The memory control unit includes logic to identify a malfunctioning address of primary data storage elements within an external memory device, the external memory device being another semiconductor device separate from the controller, store the malfunctioning address in the internal memory, and transmit, to the external memory device, a command to initiate a repair of the malfunctioning address using redundant data storage elements and an indication of an address associated with the malfunctioning address.

An apparatus includes a semiconductor fuse array, disposed on a semiconductor die, into which is programmed configuration data. The semiconductor fuse array has a first plurality of semiconductor fuses and a second plurality of semiconductor fuses. The first plurality of semiconductor fuses is configured to store the configuration data in an encoded and compressed format. The second plurality of semiconductor fuses is configured to store first fuse correction data that indicates locations and values corresponding to a first one or more fuses within the first plurality of fuses whose states are to be changed from that which was previously stored.

An apparatus including a plurality of cores and a fuse array. The plurality of cores is disposed on a die. The fuse array is disposed on the die and is coupled to each of the plurality of cores, where the fuse array includes a first plurality of semiconductor fuses and a second plurality of semiconductor fuses. The first plurality of semiconductor fuses is programmed with compressed configuration data for the each of the plurality of cores. The second plurality of semiconductor fuses is programmed with core designation data that associates some of the compressed configuration data with one of the plurality of cores, where the one of the plurality of cores accesses and decompresses the some of the compressed configuration data upon power-up/reset, for initialization of elements within the one of the plurality of cores.

An apparatus is contemplated for storing and providing configuration data to an integrated circuit device, the apparatus has a fuse array and a plurality of cores. The fuse array is disposed on a die. The fuse array has a first plurality of semiconductor fuses and a second plurality of semiconductor fuses. The plurality of cores is disposed on the die, where each of the plurality of cores is coupled to the fuse array. The each of the plurality of cores includes array control, configured to access the first and second pluralities of fuses, and configured to process first states of the first plurality of semiconductor fuses and second states of the second plurality of semiconductor fuses according to contents of a configuration data register.

An apparatus includes a plurality of cores and a fuse array. The plurality of cores is disposed on a die. The fuse array is disposed on the die and is coupled to each of the plurality of cores, where the fuse array includes a plurality of semiconductor fuses that are programmed with compressed configuration data for the each of the plurality of cores, and where the each of the plurality of cores accesses and decompresses all of the compressed configuration data upon power-up/reset, for initialization of elements within the each of the plurality of cores.

An apparatus is contemplated for storing and decompressing configuration data in a multi-core microprocessor. The apparatus includes a shared fuse array and a plurality of microprocessor cores. The shared fuse array is disposed on a die and comprises a plurality of semiconductor fuses programmed with compressed configuration data. The plurality of microprocessor cores is also disposed on the die, where each of the plurality of microprocessor cores is coupled to the shared fuse array and is configured to access all of the compressed configuration data during power-up/reset, for initialization of elements within the each of the plurality of cores. The each of the plurality of cores have a reset controller that is configured to decompress the all of the compressed configuration data, and to distribute decompressed configuration data to initialize the elements.

An apparatus includes a semiconductor fuse array, a cache memory, and a plurality of cores. The semiconductor fuse array is disposed on a die, into which is programmed the configuration data. The semiconductor fuse array has a first plurality of semiconductor fuses that is configured to store compressed cache correction data. The cache memory is disposed on the die. The plurality of cores is disposed on the die, where each of the plurality of cores is coupled to the semiconductor fuse array and the cache memory, and is configured to access the semiconductor fuse array upon power-up/reset, to decompress the compressed cache correction data, and to distribute decompressed cached correction data to initialize the cache memory.

A dynamic random access memory (DRAM) comprises a plurality of primary data storage elements, a plurality of redundant data storage elements, and circuitry to receive a first register setting command and initiate a repair mode in the DRAM in response to the first register setting command. The circuitry is further to receive an activation command, repair a malfunctioning row address in the DRAM, receive a precharge command, receive a second register setting command, terminate the repair mode in the DRAM in response to the second register setting command, receive a memory access request for data stored at the malfunctioning row address, and redirect the memory access request to a corresponding row address in the plurality of redundant data storage elements.