Various embodiments of the present disclosure are directed towards a method for memory repair using a lookup table (LUT)-free dynamic memory allocation process. An array of memory cells having a plurality of rows and a plurality of columns is provided. Further, each memory cell of the array has multiple data states and a permanent state. One or more abnormal memory cells is/are identified in a row of the array and, in response to identifying an abnormal memory cell, the abnormal memory cell is set to the permanent state. The abnormal memory cells include failed memory cells and, in some embodiments, tail memory cells having marginal performance. During a read or write operation on the row, the one or more abnormal memory cells is/are identified by the permanent state and data is read from or written to a remainder of the memory cells while excluding the abnormal memory cell(s).

The present disclosure provides an operation method related to a post package repair (PPR) function in a dynamic random access memory (DRAM) device. The method for operating a post package repair (PPR) function of a memory device is disclosed. The method includes providing a memory bank, which includes a memory array and a sense amplifier adjacent to the memory array, wherein the memory array comprises at least one defective row and at least one associated row, and the at least one associated row is electrically connected to the sense amplifier by a plurality of bit lines. The method also includes arranging a redundant row adjacent to the memory array, wherein the redundant row is electrically connected to the sense amplifier by the plurality of bit lines. The method also includes activating the at least one associated row to transmit data in the at least one associated row to the sense amplifier, latching the data in the sense amplifier; activating the redundant row, and transmitting the data from the sense amplifier to the redundant row.

A semiconductor memory device comprises a memory cell array including segments disposed at corresponding intersections of row and column blocks, each row block including dynamic memory cells coupled to word-lines and bit-lines, a row decoder that activates a first word-line of a first row block in response to a row address, determines whether the first row block is a master block based on a first fuse information and a second row block is mapped as a slave to the master block, activates a second word-line of the second row block, and outputs a row block information signal, and a column decoder accessing a portion of first memory cells coupled to the first word-line or a portion of second memory cells coupled to the second word-line based on a column address, the row block information signal and a second fuse information.

Methods, systems, and devices for spare substitution in a memory system are described. A controller may, as part of a background operation, assign a spare bit to replace a bit of a code word and save an indication of the spare bit assignment in a memory array. The code word may include a set of bits that each correspond to a respective Minimum Substitution Region (MSR) within a memory medium that retains the code word. An MSR corresponding to the bit to be replaced may include a quantity of erroneous bits relative to a threshold. The controller may, during a read operation, identify the spare bit in a first portion of the code word, determine the bit to be replaced based on accessing the memory array, and replace the bit with the spare bit concurrently with receiving a second portion of the code word.

A memory circuit includes a first memory array and a second memory array. The first memory array and the second memory array are independent. The first memory array includes a plurality of general bits and the second memory array includes a plurality of spare bits. An address of defective bit in the first memory array is stored in the second memory array, and the memory circuit repairs the defective bit by one of the spare bits according to the address.

A system for improving radiation tolerance of memory senses an amount of radiation exposure and, based on the sensed amount of radiation exposure, determines whether to perform one or more techniques for mitigating the effects of the radiation exposure. As an example, the system may perform a data refresh operation by re-writing data that has been corrupted by radiation, or the system may adjust the reference voltage used to read memory cells. In another example, the system may perform a fault repair operation by re-programming cells that have erroneously transitioned from a program state to an erase state. The system may selectively perform different radiation-mitigation techniques in a tiered approach based on the sensed amount of radiation in order to limit the adverse effects of the more invasive techniques.

Embodiments of the disclosure are drawn to apparatuses and methods for dynamic column select swapping. A memory may have a number of sets of bit lines organized into column planes. If a set of bit lines associated with a first address in a first column plane is defective, it may be repaired by reassigning the first address to a redundant set of bit lines in a global column redundant (GCR) column plane. If a set of bit lines associated with the first address in a second column plane is also defective, then swap logic of the memory may swap the first address to a second address and assign it to the set of bitlines in the second column plane. The second address may then also be repaired by being reassigned to the GCR column plane.

Various embodiments of the present disclosure are directed towards a method for memory repair using a lookup table (LUT)-free dynamic memory allocation process. An array of memory cells having a plurality of rows and a plurality of columns is provided. Further, each memory cell of the array has multiple data states and a permanent state. One or more abnormal memory cells is/are identified in a row of the array and, in response to identifying an abnormal memory cell, the abnormal memory cell is set to the permanent state. The abnormal memory cells include failed memory cells and, in some embodiments, tail memory cells having marginal performance. During a read or write operation on the row, the one or more abnormal memory cells is/are identified by the permanent state and data is read from or written to a remainder of the memory cells while excluding the abnormal memory cell(s).

A three-dimensional stacked memory device includes a buffer die having a plurality of core die memories stacked thereon. The buffer die is configured as a buffer to occupy a first space in the buffer die. The first memory module, disposed in a second space unoccupied by the buffer, is configured to operate as a cache of the core die memories. The controller is configured to detect a fault in a memory area corresponding to a cache line in the core die memories based on a result of a comparison between data stored in the cache line and data stored in the memory area corresponding to the cache line in the core die memories. The second memory module, disposed in a third space unoccupied by the buffer and the first memory module, is configured to replace the memory area when the fault is detected in the memory area.

A neuromorphic device includes a memory cell array including first resistive memory cells connected to word lines, bit lines and source lines, second resistive memory cells connected to the word lines, at least one redundancy bit line and at least one redundancy source line, third resistive memory cells connected to at least one redundancy word line, the bit lines and the source lines. The memory cell array stores data corresponding to a weight of a neural network in the first resistive memory cells, and is configured to generate a plurality of read currents based on input signals and the data. The neuromorphic device further includes an analog to digital converter (ADC) circuit configured to convert the plurality of read currents into a plurality of digital signals.