A storage device may include a controller performing non data word line (NDWL) maintenance in sub block mode (SBM). The NDWL maintenance in SBM can include proactive select gate drain (SGD) detection and phased SGD correction. For example, when a block reaches a PE cycle threshold value, SGD phased correction occurs upon detection of an error, by determining whether a sister sub block of the selected block contains data. If the sister sub block contains data, the data is transferred from the sister sub block, and then the block and sister sub block undergo correction for NDLW maintenance.

A three-dimensional stacked integrated circuit (3D SIC) having a non-volatile memory die, a volatile memory die, and a logic die. The non-volatile memory die, the volatile memory die, and the logic die are stacked. The 3D SIC is partitioned into a plurality of columns that are perpendicular to each of the stacked dies. Each column of the plurality of columns is configurable to be bypassed via configurable routes. When the configurable routes are used, functionality of a failing part of the column is re-routed to a corresponding effective part of a neighboring column.

Apparatuses, systems, and methods are disclosed for skip inconsistency correction. A skip circuit is configured to skip memory units for read operations and write operations of a memory array, based on a record of memory units identified as faulty. A skip inconsistency detection circuit is configured to detect a skip inconsistency in read data from a memory array. A correction circuit is configured to correct a skip inconsistency and output corrected read data.

A three-dimensional stacked integrated circuit (3D SIC) having a non-volatile memory die, a volatile memory die, and a logic die. The non-volatile memory die, the volatile memory die, and the logic die are stacked. The 3D SIC is partitioned into a plurality of columns that are perpendicular to each of the stacked dies. Each column of the plurality of columns is configurable to be bypassed via configurable routes. When the configurable routes are used, functionality of a failing part of the column is re-routed to a corresponding effective part of a neighboring column.

A three-dimensional stacked integrated circuit (3D SIC) having a non-volatile memory die, a volatile memory die, and a logic die. The non-volatile memory die, the volatile memory die, and the logic die are stacked. The 3D SIC is partitioned into a plurality of columns that are perpendicular to each of the stacked dies. Each column of the plurality of columns is configurable to be bypassed via configurable routes. When the configurable routes are used, functionality of a failing part of the column is re-routed to a corresponding effective part of a neighboring column.

Apparatuses, systems, and methods are disclosed for skip inconsistency correction. A skip circuit is configured to skip memory units for read operations and write operations of a memory array, based on a record of memory units identified as faulty. A skip inconsistency detection circuit is configured to detect a skip inconsistency in read data from a memory array. A correction circuit is configured to correct a skip inconsistency and output corrected read data.

In certain aspects, a memory device includes an array of memory cells, an input/output (I/O) circuit, and I/O control logic coupled to the I/O circuit. The array of memory cells includes P groups of banks. P redundant banks are included in and shared by the P groups of banks. The I/O circuit is coupled to the P groups of banks and configured to direct P?N pieces of data to or from P?N working banks, respectively. The I/O control logic is configured to determine the P?N working banks from the P groups of banks based on bank fail information indicative of K failed main banks from the P groups of banks. The P?N working banks include K redundant banks of the P redundant banks. The I/O control logic is also configured to control the I/O circuit to direct P?N pieces of data to or from the P?N working banks, respectively.

A memory is provided in which a scan chain covers the redundancy logic for column redundancy as well as the redundancy multiplexers in each column. The redundancy logic includes a plurality of redundancy logic circuits arranged in series. Each redundancy logic circuit corresponds to a respective column in the memory. Each column is configured to route a shift-in signal through its redundancy multiplexers during a scan mode of operation.

Various implementations described herein are directed to an integrated circuit having core circuitry with an array of bitcells arranged in columns of bitcells that may represent bits. A first column of bitcells may represent a nearest bit of the bits, and a last column of bitcells may represent a farthest bit of the bits. The integrated circuit may include sense amplifier circuitry coupled to the core circuitry to assist with accessing data stored in the array of bitcells. The integrated circuit may include multiplexer circuitry coupled to the sense amplifier circuitry. The integrated circuit may include first bypass circuitry coupled to outputs of the sense amplifier circuitry at the farthest bit. The integrated circuit may include second bypass circuitry coupled to an output of the multiplexer circuitry at the nearest bit.

Apparatuses and methods related to column repair in memory are described. The sensing circuitry of an apparatus can include a first sensing component, a second sensing component, and a third sensing component. The second sensing component can include a defective sense amplifier that is column repaired. The apparatus can include a controller configured to use the sensing circuitry to shift data from the first sensing component to the third sensing component by transferring the data through the second sensing component. The second sensing component can be physically located between the first sensing component and the third sensing component.