Various implementations described herein are directed to an integrated circuit having core circuitry with an array of bitcells arranged in columns of bitcells that may represent bits. A first column of bitcells may represent a nearest bit of the bits, and a last column of bitcells may represent a farthest bit of the bits. The integrated circuit may include sense amplifier circuitry coupled to the core circuitry to assist with accessing data stored in the array of bitcells. The integrated circuit may include multiplexer circuitry coupled to the sense amplifier circuitry. The integrated circuit may include first bypass circuitry coupled to outputs of the sense amplifier circuitry at the farthest bit. The integrated circuit may include second bypass circuitry coupled to an output of the multiplexer circuitry at the nearest bit.

In certain aspects, a memory device includes an array of memory cells, an input/output (I/O) circuit, and I/O control logic coupled to the I/O circuit. The array of memory cells includes P groups of banks. Each group of banks includes N main banks and M redundant banks, where each of P, N and M is a positive integer, and N is greater than M The I/O circuit is coupled to the P groups of banks and configured to direct P?N pieces of data to or from P?N working banks, respectively. One of the M redundant banks is coupled with at least two main banks of the N main banks through the I/O circuit. The I/O control logic is configured to in responding to K main banks of the P groups of banks failed, determine the P?N working banks including K redundant banks of P?M redundant banks, where K is a positive integer not greater than P, and control the I/O circuit to direct P?N pieces of data to or from the P?N working banks, respectively.

A semiconductor apparatus may include a through via and a redundancy through via which couple a first chip and a second chip. A transmission circuit may perform a repair operation for the through via with the redundancy through via or supply the redundancy through via with a power supply voltage based on through via defect information.

A memory device is provided, including a memory array and a selection circuit. At least one first faulty cell and at least one second faulty cell that are in the memory array store data corresponding to, respectively, first and second fields of a floating-point number. The selection circuit identifies the at least one first faulty cell and the at least one second faulty cell based on a priority of a cell replacement operation which indicates that a priority of the at least one first faulty cell is higher than that of the at least one second faulty cell. The selection circuit further outputs a fault address of the at least one first faulty cell to a redundancy analyzer circuit for replacing the at least one first faulty cell.

A semiconductor apparatus may include a through via and a redundancy through via which couple a first chip and a second chip. A transmission circuit may perform a repair operation for the through via with the redundancy through via or supply the redundancy through via with a power supply voltage based on through via defect information.

The present disclosure includes apparatuses and methods related to column repair in memory. An example apparatus can include sensing circuitry. The sensing circuitry can include a first sensing component, a second sensing component, and a third sensing component. The second sensing component can include a defective sense amplifier that is column repaired. The apparatus can include a controller configured to use the sensing circuitry to shift data from the first sensing component to the third sensing component by transferring the data through the second sensing component. The second sensing component can be physically located between the first sensing component and the third sensing component.

Apparatuses and methods related to column repair in memory are described. An apparatus can include sensing circuitry. The sensing circuitry can include a first sensing component, a second sensing component, and a third sensing component. The second sensing component can include a defective sense amplifier that is column repaired. The apparatus can include a controller configured to use the sensing circuitry to shift data from the first sensing component to the third sensing component by transferring the data through the second sensing component. The second sensing component can be physically located between the first sensing component and the third sensing component.

A semiconductor memory device includes a block of memory cells including first, second, and third memory cells, a first word line electrically connected to a gate of the first memory cell, a second word line electrically connected to a gate of the second memory cell, a third word line electrically connected to a gate of the third memory cell, and a control circuit configured to access the block in one of at least first and second modes to perform an operation thereon. When the control circuit accesses the block in the first mode, the same voltage is applied to the first and second word lines throughout the operation, and when the control circuit accesses the block in the second mode, the same voltage is applied to the second and third word lines throughout the operation.

A memory includes a plurality of columns and a redundant column. The memory includes a plurality of multiplexers corresponding to the plurality of columns. Depending upon the location of a defect, the multiplexers are configured to select for their corresponding column or an immediately-subsequent column to their corresponding column.

A memory includes a plurality of columns and a redundant column. The memory includes a plurality of multiplexers corresponding to the plurality of columns. Depending upon the location of a defect, the multiplexers are configured to select for their corresponding column or an immediately-subsequent column to their corresponding column.