A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.

An optical sensing system and an optical sensing method are provided. The system includes a bright-field light source, a dark-field light source, an optical detecting circuit, and a processing circuit. The processing circuit performs a floor type detection process, including: controlling the dark-field light source to provide dark-field illumination; receiving, by the optical detecting circuit, scattered lights of the dark-field light source; executing a dark-field computation process to obtain a first optical characteristic, and determining whether the first optical characteristic meets a first surface condition; in the negative, determining that a floor is a first type; in the affirmative, controlling the bright-field light source to provide bright-field illumination; receiving, by the optical detecting circuit, scattered lights of the bright-field light source; executing a bright-field computation process to obtain a second optical characteristic, and determining whether the second optical characteristic meets a second surface condition.

The present disclosure discloses an inspection device and an inspection method. The inspection device includes a first light source, a second light source, a light source controller and a sensor. The light source controller is configured to enable the first light source to irradiate an object under inspection in a first period of an inspection phase, and to enable the second light source to irradiate the object under inspection in a second period of the inspection phase. The sensor continuously senses the reflected light of the object under inspection in an exposure period of the inspection phase so as to obtain image data of the object under inspection. The exposure period includes the first period and the second period.

An inspection apparatus according to the present disclosure includes a first optical system that illuminates a film with first light transmitted through the film and receives first observation light from a first surface side of the film, a second optical system that illuminates the film from the first surface side with second light reflected from the first surface of the film and receives second observation light from the first surface side, and a determination unit that determines whether a position of a defect of the film is a defect above the first surface of the film or a defect below the first surface based on a combination of an observation result of bright-field observation in the first optical system and an observation result of dark-field observation in the second optical system.

A measuring apparatus has at least two radiation sources arranged to illuminate a measuring region of a surface of a sample, the at least two sources configured to illuminate the measuring region along at least two illumination beam paths at different angles of incidence relative to a surface normal of the surface, a detector device configured to detect at least two scattered radiation images of surface sections in the illuminated measuring region at a predetermined viewing angle relative to the surface normal of the surface, portions of the scattered radiation received by the detector device, which portions are formed in each case by the illumination in one of the illumination beam paths, in each case having a common spatial frequency, and an evaluation device configured to determine at least one roughness feature of the surface sections from the at least two scattered radiation images.

A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.

According to one embodiment, an optical inspection method includes projecting first pattern light in a first basic modulation mode that periodically changes in bright and dark, onto an object, acquiring a first image by capturing an image of the object onto which the first pattern light has been projected, projecting second pattern light in a first inverted modulation mode in which bright and dark are inverted with respect to the first basic modulation mode, onto the object, acquiring a second image by capturing an image of the object onto which the second pattern light has been projected, and generating a singular light-scattered image in which a singular region including uniquely-scattered light that is extracted based at least on the first image and the second image is intensified.

A plurality of surface images are picked up while changing a relative posture of a surface of an object to be inspected with respect to an image pickup part configured to pick up an image of the surface of the object to be inspected under a state in which the surface of the object to be inspected is irradiated with light, and a defect and luminance unevenness of the surface of the object to be inspected are discriminated from each other based on a change in the plurality of surface images.

A device includes a camera, which captures images of moving objects, lighting units, and a controller. The camera captures recordings of the moving objects in series during transportation on the conveyor, so that a first recording of the object in a first position and a second recording of the object in a second position are obtained. The first and second positions of the object differ by the movement of the conveyor by a corresponding offset. The illumination units are composed of a dark-field illumination unit and a bright-field illumination unit, which are controlled synchronously with the camera by the controller such that the first recording generates a first contrast by a first specific control of the dark-field illumination unit and bright-field illumination unit, and in that the second recording generates a second contrast by a second specific activation of the dark-field illumination unit and bright-field illumination unit.

One variation of an optical inspection kit includes: an enclosure defining an imaging volume; an optical sensor adjacent the imaging volume and defining a field of view directed toward the imaging volume; a nest module defining a receptacle configured to locate a surface of interest on a first unit of a first part within the imaging volume at an image plane of the optical sensor; a dark-field lighting module adjacent and perpendicular to the nest module and including a dark-field light source configured to output light across a light plane and a directional light filter configured to pass light output by the dark-field light source normal to the light plane and to reject light output by the dark-field light source substantially nonparallel to the light plane; and a bright-field light source proximal the optical sensor and configured to output light toward the surface of interest.